NL8302262A - Inrichting voor het bijvoorbeeld door solderen bevestigen van een element op een printsubstraat. - Google Patents
Inrichting voor het bijvoorbeeld door solderen bevestigen van een element op een printsubstraat. Download PDFInfo
- Publication number
- NL8302262A NL8302262A NL8302262A NL8302262A NL8302262A NL 8302262 A NL8302262 A NL 8302262A NL 8302262 A NL8302262 A NL 8302262A NL 8302262 A NL8302262 A NL 8302262A NL 8302262 A NL8302262 A NL 8302262A
- Authority
- NL
- Netherlands
- Prior art keywords
- bracket
- soldering
- solder
- holder
- parts
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910000639 Spring steel Inorganic materials 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 230000000284 resting effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/03—Soldering irons; Bits electrically heated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8302262A NL8302262A (nl) | 1983-06-24 | 1983-06-24 | Inrichting voor het bijvoorbeeld door solderen bevestigen van een element op een printsubstraat. |
US06/620,128 US4648543A (en) | 1983-06-24 | 1984-06-13 | Device for soldering an element to a print plate |
JP59123909A JPS6015993A (ja) | 1983-06-24 | 1984-06-18 | 固着装置 |
EP84200893A EP0130643B1 (en) | 1983-06-24 | 1984-06-21 | Device for soldering an element to a print substrate |
AT84200893T ATE39805T1 (de) | 1983-06-24 | 1984-06-21 | Vorrichtung zum loeten eines elements an eine leiterplatte. |
DE8484200893T DE3476011D1 (en) | 1983-06-24 | 1984-06-21 | Device for soldering an element to a print substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8302262 | 1983-06-24 | ||
NL8302262A NL8302262A (nl) | 1983-06-24 | 1983-06-24 | Inrichting voor het bijvoorbeeld door solderen bevestigen van een element op een printsubstraat. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8302262A true NL8302262A (nl) | 1985-01-16 |
Family
ID=19842071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8302262A NL8302262A (nl) | 1983-06-24 | 1983-06-24 | Inrichting voor het bijvoorbeeld door solderen bevestigen van een element op een printsubstraat. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4648543A (enrdf_load_html_response) |
EP (1) | EP0130643B1 (enrdf_load_html_response) |
JP (1) | JPS6015993A (enrdf_load_html_response) |
AT (1) | ATE39805T1 (enrdf_load_html_response) |
DE (1) | DE3476011D1 (enrdf_load_html_response) |
NL (1) | NL8302262A (enrdf_load_html_response) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3531715A1 (de) * | 1985-09-05 | 1987-03-12 | Widmaier Fa Hans | Verfahren bzw. einrichtung zum verloeten oberflaechenmontierbarer bauelemente auf mit leitermustern versehenen schaltungstraegerplatten |
DE9111967U1 (de) * | 1991-09-25 | 1991-12-05 | Siemens Nixdorf Informationssysteme AG, 4790 Paderborn | Lötsystem zum Auflöten von oberflächenbefestigbaren Bauteilen auf Leiterplatten |
DE4330467C1 (de) * | 1993-09-08 | 1994-09-08 | Siemens Nixdorf Inf Syst | Verfahren zum Löten von oberflächenmontierbaren elektronischen Bauelementen auf Leiterplatten |
IT1273513B (it) * | 1995-04-07 | 1997-07-08 | Agip Spa | Composizione efficace nella rimozione degli asfalteni |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650450A (en) * | 1969-11-24 | 1972-03-21 | Wells Electronics | Means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive element on an electrical assembly |
US3749362A (en) * | 1971-04-09 | 1973-07-31 | Nasa | Fastener stretcher |
FR2249519B1 (enrdf_load_html_response) * | 1973-03-08 | 1976-10-01 | Alexandrovich Osipov | |
FR2388626A1 (fr) * | 1977-04-29 | 1978-11-24 | Cii Honeywell Bull | Outil de micro soudage perfectionne |
JPS5419657A (en) * | 1977-07-15 | 1979-02-14 | Hitachi Ltd | Pulse tool for bonding |
GB2041808B (en) * | 1979-02-08 | 1982-12-01 | Standard Telephones Cables Ltd | Soldering tool for hybrid circuits |
CH639306A5 (fr) * | 1980-12-19 | 1983-11-15 | Far Fab Assortiments Reunies | Outil de soudage. |
JPS5948048U (ja) * | 1982-09-24 | 1984-03-30 | 富士通株式会社 | ボンデイング装置におけるヒ−タチツプのフロ−テイング構造 |
-
1983
- 1983-06-24 NL NL8302262A patent/NL8302262A/nl not_active Application Discontinuation
-
1984
- 1984-06-13 US US06/620,128 patent/US4648543A/en not_active Expired - Fee Related
- 1984-06-18 JP JP59123909A patent/JPS6015993A/ja active Granted
- 1984-06-21 EP EP84200893A patent/EP0130643B1/en not_active Expired
- 1984-06-21 DE DE8484200893T patent/DE3476011D1/de not_active Expired
- 1984-06-21 AT AT84200893T patent/ATE39805T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3476011D1 (en) | 1989-02-09 |
EP0130643A1 (en) | 1985-01-09 |
ATE39805T1 (de) | 1989-01-15 |
US4648543A (en) | 1987-03-10 |
JPH0452639B2 (enrdf_load_html_response) | 1992-08-24 |
EP0130643B1 (en) | 1989-01-04 |
JPS6015993A (ja) | 1985-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1B | A search report has been drawn up | ||
BT | A notification was added to the application dossier and made available to the public | ||
BV | The patent application has lapsed |