NL7811403A - Printplaat met daarin een weerstandslaagje. - Google Patents

Printplaat met daarin een weerstandslaagje.

Info

Publication number
NL7811403A
NL7811403A NL7811403A NL7811403A NL7811403A NL 7811403 A NL7811403 A NL 7811403A NL 7811403 A NL7811403 A NL 7811403A NL 7811403 A NL7811403 A NL 7811403A NL 7811403 A NL7811403 A NL 7811403A
Authority
NL
Netherlands
Prior art keywords
circuit board
resistance layer
resistance
layer
board
Prior art date
Application number
NL7811403A
Other languages
English (en)
Other versions
NL176128B (nl
NL176128C (nl
Original Assignee
Nitto Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Ind Co filed Critical Nitto Electric Ind Co
Publication of NL7811403A publication Critical patent/NL7811403A/nl
Publication of NL176128B publication Critical patent/NL176128B/nl
Application granted granted Critical
Publication of NL176128C publication Critical patent/NL176128C/nl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Chemically Coating (AREA)
NLAANVRAGE7811403,A 1977-11-21 1978-11-20 Werkwijze voor het vervaardigen van printplaatmateriaal met een weerstandslaag. NL176128C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14052577A JPS5472468A (en) 1977-11-21 1977-11-21 Printing circuit substrate with resistance

Publications (3)

Publication Number Publication Date
NL7811403A true NL7811403A (nl) 1979-05-23
NL176128B NL176128B (nl) 1984-09-17
NL176128C NL176128C (nl) 1985-02-18

Family

ID=15270687

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7811403,A NL176128C (nl) 1977-11-21 1978-11-20 Werkwijze voor het vervaardigen van printplaatmateriaal met een weerstandslaag.

Country Status (6)

Country Link
US (1) US4220945A (nl)
JP (1) JPS5472468A (nl)
BE (1) BE872131A (nl)
DE (1) DE2847821C2 (nl)
FR (1) FR2409660A1 (nl)
NL (1) NL176128C (nl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS57160190A (en) * 1981-03-27 1982-10-02 Sumitomo Bakelite Co Flexible printed circuit board and method of producing same
JPS58106888A (ja) * 1981-12-21 1983-06-25 住友ベークライト株式会社 抵抗付プリント回路板の製造方法
DE3321900C2 (de) * 1982-06-16 1986-01-16 Nitto Electric Industrial Co., Ltd., Ibaraki, Osaka Substrat für eine Schaltung mit einer Widerstandsschicht und Verfahren zu dessen Herstellung
JPS5916084A (ja) * 1982-07-19 1984-01-27 Nitto Electric Ind Co Ltd 入力タブレツト
US4495524A (en) * 1983-06-21 1985-01-22 Nitto Electric Industrial Co., Ltd. Part for a slide variable resistor
US5038132A (en) * 1989-12-22 1991-08-06 Texas Instruments Incorporated Dual function circuit board, a resistor element therefor, and a circuit embodying the element
EP0664547B1 (en) * 1993-05-14 1999-04-07 Kiyokawa Mekki Kougyo Co., Ltd Metallic film resistor having fusing function and method for its manufacture
EP0710177B1 (en) * 1993-07-21 2003-05-02 Ohmega Electronics, Inc. Circuit board material with barrier layer
DE10031906B4 (de) * 2000-06-30 2006-05-24 Becromal S.P.A. Verfahren zur Herstellung von Elektroden sowie damit hergestellte Elektroden
JP3954958B2 (ja) 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
JP4217778B2 (ja) 2003-04-11 2009-02-04 古河電気工業株式会社 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
KR101635133B1 (ko) * 2012-01-23 2016-06-30 가부시키가이샤 무라타 세이사쿠쇼 전자부품 및 그 제조방법
CN108513438A (zh) * 2018-05-24 2018-09-07 衢州顺络电子有限公司 内置电阻的led灯条电路板及其成型工艺

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US859608A (en) * 1907-02-18 1907-07-09 Hoskins Company Electric resistance element.
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
US2632831A (en) * 1951-05-09 1953-03-24 Pritikin Variable resistance element
US2803729A (en) * 1953-03-03 1957-08-20 Wilbur M Kohring Resistors
FR1419084A (fr) * 1963-11-20 1965-11-26 Xerox Corp Circuits imprimés en pellicule mince
US3337426A (en) * 1964-06-04 1967-08-22 Gen Dynamics Corp Process for fabricating electrical circuits
US3396055A (en) * 1965-04-16 1968-08-06 Vitreous Steel Products Compan Radiant heating panels and resistive compositions for the same
US3522085A (en) * 1965-12-17 1970-07-28 Sanyo Electric Co Article and method for making resistors in printed circuit board
FR1554767A (nl) * 1967-11-14 1969-01-24
FR1571857A (nl) * 1968-07-03 1969-06-20
US3808576A (en) * 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
FR2166347A1 (en) * 1972-01-04 1973-08-17 Mica Corp Printed circuit laminate - with resistive under-cladding
DE2261249C3 (de) * 1972-07-21 1979-06-28 The Mica Corp., Culver City, Calif. (V.St.A.) Mehrschichtiges Trägermaterial für gedruckte Schaltungen mit einer Widerstandsschicht
US3857683A (en) * 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
US3971861A (en) * 1974-10-25 1976-07-27 Handy Chemicals Limited Alloy plating system
US4033835A (en) * 1975-10-14 1977-07-05 Amp Incorporated Tin-nickel plating bath
US4017712A (en) * 1975-12-08 1977-04-12 Northern Electric Co Thermal printing device
US4038457A (en) * 1976-02-12 1977-07-26 Matsushita Electric Industrial Co., Ltd. Fusible metal film resistor

Also Published As

Publication number Publication date
US4220945A (en) 1980-09-02
NL176128B (nl) 1984-09-17
JPS5542510B2 (nl) 1980-10-31
DE2847821A1 (de) 1979-05-23
FR2409660B1 (nl) 1982-06-11
NL176128C (nl) 1985-02-18
DE2847821C2 (de) 1981-10-29
BE872131A (fr) 1979-03-16
JPS5472468A (en) 1979-06-09
FR2409660A1 (fr) 1979-06-15

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Legal Events

Date Code Title Description
A1A A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee