NL7706627A - Werkwijze voor het met een gasplasma etsen van aluminium en aluminiumoxyde. - Google Patents

Werkwijze voor het met een gasplasma etsen van aluminium en aluminiumoxyde.

Info

Publication number
NL7706627A
NL7706627A NL7706627A NL7706627A NL7706627A NL 7706627 A NL7706627 A NL 7706627A NL 7706627 A NL7706627 A NL 7706627A NL 7706627 A NL7706627 A NL 7706627A NL 7706627 A NL7706627 A NL 7706627A
Authority
NL
Netherlands
Prior art keywords
aluminum
procedure
gas plasma
etching
aluminum oxide
Prior art date
Application number
NL7706627A
Other languages
English (en)
Dutch (nl)
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4106655&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL7706627(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Publication of NL7706627A publication Critical patent/NL7706627A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
NL7706627A 1976-08-16 1977-06-16 Werkwijze voor het met een gasplasma etsen van aluminium en aluminiumoxyde. NL7706627A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA259,126A CA1059882A (en) 1976-08-16 1976-08-16 Gaseous plasma etching of aluminum and aluminum oxide

Publications (1)

Publication Number Publication Date
NL7706627A true NL7706627A (nl) 1978-02-20

Family

ID=4106655

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7706627A NL7706627A (nl) 1976-08-16 1977-06-16 Werkwijze voor het met een gasplasma etsen van aluminium en aluminiumoxyde.

Country Status (7)

Country Link
JP (1) JPS5322836A (cg-RX-API-DMAC7.html)
CA (1) CA1059882A (cg-RX-API-DMAC7.html)
DE (1) DE2730156C2 (cg-RX-API-DMAC7.html)
FR (1) FR2362216A1 (cg-RX-API-DMAC7.html)
GB (1) GB1554335A (cg-RX-API-DMAC7.html)
NL (1) NL7706627A (cg-RX-API-DMAC7.html)
SE (1) SE7709165L (cg-RX-API-DMAC7.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54118172A (en) * 1978-03-06 1979-09-13 Nichiden Varian Kk Method of dry etching aluminum
US4208241A (en) * 1978-07-31 1980-06-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
US4226665A (en) * 1978-07-31 1980-10-07 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
US4256534A (en) * 1978-07-31 1981-03-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
DE2924475A1 (de) * 1979-06-18 1981-01-15 Siemens Ag Verfahren zum herstellen einer metallisierung auf einem halbleiterkristall
JPS5623745A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Plasma etching device
US4341593A (en) * 1979-08-17 1982-07-27 Tokuda Seisakusyo, Ltd. Plasma etching method for aluminum-based films
JPS5747876A (en) * 1980-09-03 1982-03-18 Toshiba Corp Plasma etching apparatus and method
DE3103177A1 (de) * 1981-01-30 1982-08-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von polysiliziumstrukturen bis in den 1 (my)m-bereich auf integrierte halbleiterschaltungen enthaltenden substraten durch plasmaaetzen
US4426246A (en) * 1982-07-26 1984-01-17 Bell Telephone Laboratories, Incorporated Plasma pretreatment with BCl3 to remove passivation formed by fluorine-etch
JP2861785B2 (ja) * 1994-02-15 1999-02-24 日本電気株式会社 半導体装置の配線の形成方法
US9520303B2 (en) * 2013-11-12 2016-12-13 Applied Materials, Inc. Aluminum selective etch

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615956A (en) * 1969-03-27 1971-10-26 Signetics Corp Gas plasma vapor etching process
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor

Also Published As

Publication number Publication date
FR2362216A1 (fr) 1978-03-17
DE2730156A1 (de) 1978-02-23
CA1059882A (en) 1979-08-07
JPS5745310B2 (cg-RX-API-DMAC7.html) 1982-09-27
GB1554335A (en) 1979-10-17
DE2730156C2 (de) 1986-01-16
JPS5322836A (en) 1978-03-02
SE7709165L (sv) 1978-02-17

Similar Documents

Publication Publication Date Title
NL170442C (nl) Aluminium voorwerp met een poreuze anodische oxydefilm op het oppervlak daarvan; werkwijze voor het vervaardigen daarvan.
BE855459A (nl) Inrichting voor het verbeteren van het strmingsprofiel in een gasleiding
NL7408036A (nl) Werkwijze en inrichting voor het afkoelen van een gas.
NL178982C (nl) Werkwijze voor het plasma-etsen van aluminium en aluminiumlegeringen.
NL7803314A (nl) Werkwijze voor het aanbrengen van een deklaag op de aluminiumoxydelaag op het oppervlak van een voorwerp uit aluminium of een aluminium- legering.
NL154865B (nl) Elektrische gasontladingslamp met een omhulling van dichtgesinterd aluminiumoxyde en werkwijze voor het vervaardigen van een dergelijke gasontladingslamp.
NL184202C (nl) Werkwijze voor het lassen of dergelijke in een atmosfeer van een beschermend gas.
NL7706627A (nl) Werkwijze voor het met een gasplasma etsen van aluminium en aluminiumoxyde.
NL7713255A (nl) Werkwijze voor het regelen van een krachtinstal- latie met een gasturbinegroep en inrichting voor het uitvoeren van de werkwijze.
NL187752C (nl) Inrichting voor het afkoelen van een kraakgasstroom.
NL7709042A (nl) Werkwijze en inrichting voor het thermisch zui- veren van afgevoerde gassen.
NL7811361A (nl) Werkwijze voor het etsen van aluminium.
BE866886A (nl) Werkwijze voor het verminderen van het stikstofoxydegehalte in een verbrandingsgas
NL7705382A (nl) Wand met panelen, alsmede paneel voor zulk een wand.
NL7702049A (nl) Werkwijze en inrichting voor het scheiden van gassen.
IT1074201B (it) Apparecchiatura per l incenerimento di gas di scarico
NL167203C (nl) Houder met een aluminium paneel en werkwijze ter ver- vaardiging van een dergelijk paneel.
NL169348B (nl) Inrichting voor het ladingsgewijs met een gas reduceren van metaaloxyden.
NL7608183A (nl) Werkwijze voor het op aluminium of een aluminiumlegering opbrengen van een groene anodische oxydefilm.
NL7811920A (nl) Metaaloxyde-halfgeleiderinrichtingen met een nauw kanaal en werkwijze voor de vervaardiging van deze inrichtingen.
NL168072C (nl) Cassetteapparaat voorzien van een inrichting voor het grijpen en inbrengen van een cassette.
NL7702545A (nl) Werkwijze voor het bereiden van nieuwe verbindingen met een ergoleen- en ergolinestructuur.
NL7609234A (nl) Gasdetectieelement en werkwijze voor het ver- vaardigen van een dergelijk element.
NL7704148A (nl) Ondergrond voor getuft tapijt en tapijt met een dergelijke ondergrond.
NL7701895A (nl) Tunneloven voor het sinteren van ferrieten in een beschermende gasatmosfeer.

Legal Events

Date Code Title Description
BV The patent application has lapsed