NL7700641A - PROCEDURE FOR APPLYING A COATING FOR SEMICONDUCTOR SUBSTRATES. - Google Patents

PROCEDURE FOR APPLYING A COATING FOR SEMICONDUCTOR SUBSTRATES.

Info

Publication number
NL7700641A
NL7700641A NL7700641A NL7700641A NL7700641A NL 7700641 A NL7700641 A NL 7700641A NL 7700641 A NL7700641 A NL 7700641A NL 7700641 A NL7700641 A NL 7700641A NL 7700641 A NL7700641 A NL 7700641A
Authority
NL
Netherlands
Prior art keywords
procedure
coating
applying
semiconductor substrates
substrates
Prior art date
Application number
NL7700641A
Other languages
Dutch (nl)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/651,556 external-priority patent/US4142004A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL7700641A publication Critical patent/NL7700641A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
    • H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Silicon Compounds (AREA)
  • Formation Of Insulating Films (AREA)
NL7700641A 1976-01-22 1977-01-21 PROCEDURE FOR APPLYING A COATING FOR SEMICONDUCTOR SUBSTRATES. NL7700641A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65155776A 1976-01-22 1976-01-22
US05/651,556 US4142004A (en) 1976-01-22 1976-01-22 Method of coating semiconductor substrates

Publications (1)

Publication Number Publication Date
NL7700641A true NL7700641A (en) 1977-07-26

Family

ID=27096092

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7700641A NL7700641A (en) 1976-01-22 1977-01-21 PROCEDURE FOR APPLYING A COATING FOR SEMICONDUCTOR SUBSTRATES.

Country Status (7)

Country Link
JP (1) JPS52115785A (en)
DE (1) DE2702165A1 (en)
ES (1) ES455227A1 (en)
FR (1) FR2339251A1 (en)
IT (1) IT1075610B (en)
NL (1) NL7700641A (en)
SE (1) SE7700229L (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54128283A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Manufacture of semiconductor device
JPS5643731A (en) * 1979-09-17 1981-04-22 Mitsubishi Electric Corp Film forming method
JPS5687353A (en) * 1979-12-18 1981-07-15 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS5745931A (en) * 1980-09-04 1982-03-16 Fujitsu Ltd Semiconductor device with multilayer passivation film and manufacture thereof
JPS57141935A (en) * 1981-02-25 1982-09-02 Nec Corp Manufacture of semiconductor device
JPS58131733A (en) * 1982-01-29 1983-08-05 Toshiba Corp Semiconductor device
DE3272669D1 (en) * 1982-03-18 1986-09-25 Ibm Deutschland Plasma-reactor and its use in etching and coating substrates
JPS598341A (en) * 1982-07-06 1984-01-17 Toshiba Corp Semiconductor device
JPS5994848A (en) * 1982-11-24 1984-05-31 Fuji Electric Co Ltd Manufacture of semiconductor device
US4513684A (en) * 1982-12-22 1985-04-30 Energy Conversion Devices, Inc. Upstream cathode assembly
US4455351A (en) * 1983-06-13 1984-06-19 At&T Bell Laboratories Preparation of photodiodes
JPS61128403A (en) * 1984-11-28 1986-06-16 鐘淵化学工業株式会社 Non-crystalline silicon based insulating material
US4618541A (en) * 1984-12-21 1986-10-21 Advanced Micro Devices, Inc. Method of forming a silicon nitride film transparent to ultraviolet radiation and resulting article
JPS61284928A (en) * 1985-06-10 1986-12-15 Mitsubishi Electric Corp Semiconductor device
JPH084109B2 (en) * 1987-08-18 1996-01-17 富士通株式会社 Semiconductor device and manufacturing method thereof
DE707661T1 (en) * 1994-04-22 1996-10-10 Innovatique Sa METHOD AND OVEN FOR NITRATING METALLIC MOLDED PARTS AT LOW PRESSURE
FR2725015B1 (en) * 1994-09-23 1996-12-20 Innovatique Sa OVEN FOR USE IN LOW PRESSURE NITRURATION OF A METAL PART
JP6146160B2 (en) * 2013-06-26 2017-06-14 東京エレクトロン株式会社 Film forming method, storage medium, and film forming apparatus

Also Published As

Publication number Publication date
IT1075610B (en) 1985-04-22
ES455227A1 (en) 1978-04-16
JPS52115785A (en) 1977-09-28
DE2702165A1 (en) 1977-07-28
FR2339251A1 (en) 1977-08-19
SE7700229L (en) 1977-07-23

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Legal Events

Date Code Title Description
BV The patent application has lapsed