NL7508955A - METHOD FOR STRUCTURING THIN LAYERS. - Google Patents

METHOD FOR STRUCTURING THIN LAYERS.

Info

Publication number
NL7508955A
NL7508955A NL7508955A NL7508955A NL7508955A NL 7508955 A NL7508955 A NL 7508955A NL 7508955 A NL7508955 A NL 7508955A NL 7508955 A NL7508955 A NL 7508955A NL 7508955 A NL7508955 A NL 7508955A
Authority
NL
Netherlands
Prior art keywords
thin layers
structuring thin
structuring
layers
thin
Prior art date
Application number
NL7508955A
Other languages
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742436568 external-priority patent/DE2436568C3/en
Application filed by Philips Nv filed Critical Philips Nv
Publication of NL7508955A publication Critical patent/NL7508955A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/428Stripping or agents therefor using ultrasonic means only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Magnetic Heads (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
NL7508955A 1974-07-30 1975-07-28 METHOD FOR STRUCTURING THIN LAYERS. NL7508955A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742436568 DE2436568C3 (en) 1974-07-30 Process for structuring thin layers

Publications (1)

Publication Number Publication Date
NL7508955A true NL7508955A (en) 1976-02-03

Family

ID=5921886

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7508955A NL7508955A (en) 1974-07-30 1975-07-28 METHOD FOR STRUCTURING THIN LAYERS.

Country Status (5)

Country Link
JP (1) JPS5140770A (en)
CA (1) CA1046648A (en)
FR (1) FR2280717A1 (en)
GB (1) GB1512029A (en)
NL (1) NL7508955A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52107199U (en) * 1977-02-17 1977-08-15
JPH0459523A (en) * 1990-06-29 1992-02-26 Toa Tsushin Kogyo Kk Vertical feeding conduit for lamination piece
DE102004034418B4 (en) * 2004-07-15 2009-06-25 Schott Ag Process for producing structured optical filter layers on substrates

Also Published As

Publication number Publication date
GB1512029A (en) 1978-05-24
FR2280717B1 (en) 1980-06-27
FR2280717A1 (en) 1976-02-27
DE2436568A1 (en) 1976-02-12
JPS5140770A (en) 1976-04-05
DE2436568B2 (en) 1977-07-07
CA1046648A (en) 1979-01-16

Similar Documents

Publication Publication Date Title
NL7415450A (en) DEVICE FOR THE APPLICATION OF THIN LAYERS.
NL180767C (en) METHOD FOR CONNECTING FOILS
BE829895A (en) PROCEDURE FOR HARDENING PHOTOGRAPHIC LAYERS
NL167086C (en) DEVICE FOR TAKING BLOOD.
NL175168C (en) METHOD FOR LANDFILLING WASTE MATERIALS
NL172147B (en) METHOD FOR PREPARING DIALKYLOXALATES
NL185011C (en) CONTINUOUS METHOD FOR MONONITRING BENZENE.
NL7513620A (en) METHOD FOR HYDROFORMYLATION OF ALKINS.
NL7505306A (en) METHOD FOR CALCINING KOOKS.
NL179898B (en) METHOD FOR PURIFYING GIPS.
NL175672C (en) METHOD FOR DISTINCTING LEUKOCYTS.
NL7900489A (en) METHOD FOR APPLYING THIN LAYERS.
NL7510411A (en) METHOD FOR MANUFACTURING POROUS PLASTER BODIES.
BE847443A (en) PROCEDURE FOR HARDENING PHOTOGRAPHIC LAYERS,
NL7408819A (en) METHOD FOR PREPARING CYCLOLEFINES.
NL7511873A (en) DEVICE FOR FORMING A THIN LAYER.
NL7500443A (en) METHOD FOR DETERMINING THE SLOPE OF A BOREHOLE CROSSED LAYERS.
BE827654A (en) PROCEDURE FOR HARDENING PHOTOGRAPHIC LAYERS
NL164070C (en) METHOD FOR MANUFACTURING POLYLAURINELACTAM FORM BODIES.
NL7610999A (en) THIN LAYER CONDENSER AND METHOD FOR MANUFACTURING THIS.
NL7514208A (en) METHOD FOR APPLYING THIN FILMS OF TANTAAL OR NIOBIUM.
NL7508955A (en) METHOD FOR STRUCTURING THIN LAYERS.
NL7508671A (en) METHOD FOR THE DETERMINATION OF PLASTIMINOGEN.
BE830866A (en) PROCEDURE FOR HARDENING PHOTOGRAPHIC LAYERS
NL171992C (en) METHOD FOR STABILIZING CHLORINE-RESIN.

Legal Events

Date Code Title Description
BV The patent application has lapsed