NL7409192A - PROCESS FOR MANUFACTURING A BASIS FOR A SEMICONDUCTOR DEVICE, DEVICE FOR APPLYING THE METHOD AND THE BASIS FOR A SEMICONDUCTOR DEVICE MADE UNDER APPLICATION OF THE PROCEDURE. - Google Patents

PROCESS FOR MANUFACTURING A BASIS FOR A SEMICONDUCTOR DEVICE, DEVICE FOR APPLYING THE METHOD AND THE BASIS FOR A SEMICONDUCTOR DEVICE MADE UNDER APPLICATION OF THE PROCEDURE.

Info

Publication number
NL7409192A
NL7409192A NL7409192A NL7409192A NL7409192A NL 7409192 A NL7409192 A NL 7409192A NL 7409192 A NL7409192 A NL 7409192A NL 7409192 A NL7409192 A NL 7409192A NL 7409192 A NL7409192 A NL 7409192A
Authority
NL
Netherlands
Prior art keywords
basis
semiconductor device
procedure
applying
manufacturing
Prior art date
Application number
NL7409192A
Other languages
Dutch (nl)
Original Assignee
Sato Yoshio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7705173A external-priority patent/JPS5116300B2/ja
Priority claimed from JP13072773A external-priority patent/JPS5132954B2/ja
Application filed by Sato Yoshio filed Critical Sato Yoshio
Publication of NL7409192A publication Critical patent/NL7409192A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Forging (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
NL7409192A 1973-07-10 1974-07-08 PROCESS FOR MANUFACTURING A BASIS FOR A SEMICONDUCTOR DEVICE, DEVICE FOR APPLYING THE METHOD AND THE BASIS FOR A SEMICONDUCTOR DEVICE MADE UNDER APPLICATION OF THE PROCEDURE. NL7409192A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7705173A JPS5116300B2 (en) 1973-07-10 1973-07-10
JP13072773A JPS5132954B2 (en) 1973-11-22 1973-11-22

Publications (1)

Publication Number Publication Date
NL7409192A true NL7409192A (en) 1975-01-14

Family

ID=26418154

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7409192A NL7409192A (en) 1973-07-10 1974-07-08 PROCESS FOR MANUFACTURING A BASIS FOR A SEMICONDUCTOR DEVICE, DEVICE FOR APPLYING THE METHOD AND THE BASIS FOR A SEMICONDUCTOR DEVICE MADE UNDER APPLICATION OF THE PROCEDURE.

Country Status (4)

Country Link
US (1) US3893325A (en)
FR (1) FR2236572B1 (en)
GB (1) GB1467168A (en)
NL (1) NL7409192A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341106A (en) * 1977-04-13 1982-07-27 Gleason Works Apparatus for controlling the movement of a reciprocatory hydraulically driven element of a metal forming machine
CA1114779A (en) * 1978-07-18 1981-12-22 Nissan Motor Co., Ltd. Process of closed extrusion shaping of a metal rod material and an apparatus therefor
JPS5812089B2 (en) * 1980-01-17 1983-03-07 日産自動車株式会社 Closed extrusion equipment
US5950858A (en) * 1993-02-18 1999-09-14 Sergeant; David Robert Container end closure
CN1060415C (en) * 1997-04-25 2001-01-10 张应宪 Technological process of manufacturing steel flange blank
US7506527B2 (en) * 2000-04-10 2009-03-24 Honeywell International, Inc. Making integral heat spreader by coining
CN105499463B (en) * 2015-12-28 2018-10-02 无锡透平叶片有限公司 A kind of large-scale rectangular die holder structure with prestressing force flanging

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186209A (en) * 1960-04-14 1965-06-01 Nat Machinery Co Method of cold forming an elongated hollow article
US3417597A (en) * 1967-02-06 1968-12-24 Francis S. Napoli Weld stud
JPS5147659B1 (en) * 1971-06-14 1976-12-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device

Also Published As

Publication number Publication date
DE2432681A1 (en) 1975-01-30
FR2236572B1 (en) 1978-01-20
GB1467168A (en) 1977-03-16
FR2236572A1 (en) 1975-02-07
US3893325A (en) 1975-07-08
DE2432681B2 (en) 1976-06-16

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Legal Events

Date Code Title Description
BC A request for examination has been filed
BV The patent application has lapsed