NL7308408A - - Google Patents
Info
- Publication number
- NL7308408A NL7308408A NL7308408A NL7308408A NL7308408A NL 7308408 A NL7308408 A NL 7308408A NL 7308408 A NL7308408 A NL 7308408A NL 7308408 A NL7308408 A NL 7308408A NL 7308408 A NL7308408 A NL 7308408A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2951572 | 1972-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7308408A true NL7308408A (https=) | 1973-12-27 |
Family
ID=10292759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7308408A NL7308408A (https=) | 1972-06-23 | 1973-06-18 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS4964373A (https=) |
| DE (1) | DE2328798A1 (https=) |
| FR (1) | FR2189868A1 (https=) |
| IT (1) | IT986562B (https=) |
| NL (1) | NL7308408A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748858B2 (https=) * | 1974-09-06 | 1982-10-19 | ||
| JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
| JPS55107251A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part and its packaging construction |
| JPS55107250A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Electronic part, electronic part module and lead frame used for them |
| FR2488445A1 (fr) * | 1980-08-06 | 1982-02-12 | Efcis | Boitier plastique pour circuits integres |
| US4331831A (en) * | 1980-11-28 | 1982-05-25 | Bell Telephone Laboratories, Incorporated | Package for semiconductor integrated circuits |
| JPS56107566A (en) * | 1980-12-03 | 1981-08-26 | Hitachi Ltd | Resin sealing method for semiconductor device |
| JPS57103341A (en) * | 1981-11-02 | 1982-06-26 | Hitachi Ltd | Resin sealed semiconductor device |
| JPS62261165A (ja) * | 1986-05-08 | 1987-11-13 | Seikosha Co Ltd | 時計などの駆動回路ユニツト |
| US5394607A (en) * | 1993-05-20 | 1995-03-07 | Texas Instruments Incorporated | Method of providing low cost heat sink |
-
1973
- 1973-06-06 DE DE2328798A patent/DE2328798A1/de active Pending
- 1973-06-18 NL NL7308408A patent/NL7308408A/xx unknown
- 1973-06-20 IT IT68852/73A patent/IT986562B/it active
- 1973-06-22 FR FR7322867A patent/FR2189868A1/fr not_active Withdrawn
- 1973-06-23 JP JP48071240A patent/JPS4964373A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2328798A1 (de) | 1974-01-17 |
| JPS4964373A (https=) | 1974-06-21 |
| FR2189868A1 (https=) | 1974-01-25 |
| IT986562B (it) | 1975-01-30 |