NL7302026A - - Google Patents
Info
- Publication number
- NL7302026A NL7302026A NL7302026A NL7302026A NL7302026A NL 7302026 A NL7302026 A NL 7302026A NL 7302026 A NL7302026 A NL 7302026A NL 7302026 A NL7302026 A NL 7302026A NL 7302026 A NL7302026 A NL 7302026A
- Authority
- NL
- Netherlands
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32131—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47016432A JPS5217995B2 (ja) | 1972-02-18 | 1972-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7302026A true NL7302026A (ja) | 1973-08-21 |
Family
ID=11916061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7302026A NL7302026A (ja) | 1972-02-18 | 1973-02-13 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3825454A (ja) |
JP (1) | JPS5217995B2 (ja) |
DE (1) | DE2307814A1 (ja) |
NL (1) | NL7302026A (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5525500B2 (ja) * | 1972-06-26 | 1980-07-07 | ||
JPS5062385A (ja) * | 1973-10-02 | 1975-05-28 | ||
US3936331A (en) * | 1974-04-01 | 1976-02-03 | Fairchild Camera And Instrument Corporation | Process for forming sloped topography contact areas between polycrystalline silicon and single-crystal silicon |
FR2288392A1 (fr) * | 1974-10-18 | 1976-05-14 | Radiotechnique Compelec | Procede de realisation de dispositifs semiconducteurs |
US4022930A (en) * | 1975-05-30 | 1977-05-10 | Bell Telephone Laboratories, Incorporated | Multilevel metallization for integrated circuits |
JPS5922337B2 (ja) * | 1975-09-17 | 1984-05-25 | ニホンアイ ビ− エム カブシキガイシヤ | ガス・パネル装置の製造方法 |
US4082604A (en) * | 1976-01-05 | 1978-04-04 | Motorola, Inc. | Semiconductor process |
JPS52136590A (en) * | 1976-05-11 | 1977-11-15 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
NL7701559A (nl) * | 1977-02-15 | 1978-08-17 | Philips Nv | Het maken van schuine hellingen aan metaal- patronen, alsmede substraat voor een geinte- greerde schakeling voorzien van een dergelijk patroon. |
US4098638A (en) * | 1977-06-14 | 1978-07-04 | Westinghouse Electric Corp. | Methods for making a sloped insulator for solid state devices |
GB2023926B (en) * | 1978-06-22 | 1983-03-16 | Western Electric Co | Conductors for semiconductor devices |
JPS5539650A (en) * | 1978-09-12 | 1980-03-19 | Nec Corp | Manufacture of semiconductor device |
JPS5546587A (en) * | 1978-09-29 | 1980-04-01 | Nec Corp | Method of forming plasma growing film |
US4230522A (en) * | 1978-12-26 | 1980-10-28 | Rockwell International Corporation | PNAF Etchant for aluminum and silicon |
DE2903308A1 (de) * | 1979-01-29 | 1980-08-28 | Siemens Ag | Verfahren zum herstellen von leitbahnstrukturen fuer integrierte halbleiterschaltungen |
WO1984001966A1 (en) * | 1982-11-11 | 1984-05-24 | Masahide Ichikawa | Battery using porous aluminum metal |
EP0469370A3 (en) * | 1990-07-31 | 1992-09-09 | Gold Star Co. Ltd | Etching process for sloped side walls |
JP3111478B2 (ja) * | 1991-02-06 | 2000-11-20 | 三菱電機株式会社 | 金属薄膜のテーパーエッチング方法及び薄膜トランジスタ |
JP2614403B2 (ja) * | 1993-08-06 | 1997-05-28 | インターナショナル・ビジネス・マシーンズ・コーポレイション | テーパエッチング方法 |
EP0660381A1 (en) * | 1993-12-21 | 1995-06-28 | Koninklijke Philips Electronics N.V. | Method of manufacturing a transparent conductor pattern and a liquid crystal display device |
JPH07310191A (ja) * | 1994-05-11 | 1995-11-28 | Semiconductor Energy Lab Co Ltd | エッチング材料およびエッチング方法 |
US6147395A (en) * | 1996-10-02 | 2000-11-14 | Micron Technology, Inc. | Method for fabricating a small area of contact between electrodes |
KR100271769B1 (ko) * | 1998-06-25 | 2001-02-01 | 윤종용 | 반도체소자의 제조방법, 이를 위한 반도체소자 제조용 식각액조성물 및 반도체소자 |
JP4199206B2 (ja) * | 2005-03-18 | 2008-12-17 | シャープ株式会社 | 半導体装置の製造方法 |
CN101199043B (zh) | 2005-06-24 | 2010-05-19 | 三菱瓦斯化学株式会社 | 腐蚀剂组合物及使用该组合物的半导体装置的制备方法 |
DE102006008261A1 (de) * | 2006-02-22 | 2007-08-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ätzlösung und Verfahren zur Strukturierung eines UBM-Schichtsystems |
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1972
- 1972-02-18 JP JP47016432A patent/JPS5217995B2/ja not_active Expired
-
1973
- 1973-02-13 NL NL7302026A patent/NL7302026A/xx unknown
- 1973-02-16 DE DE19732307814 patent/DE2307814A1/de active Pending
- 1973-02-20 US US00333983A patent/US3825454A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS4887777A (ja) | 1973-11-17 |
JPS5217995B2 (ja) | 1977-05-19 |
DE2307814A1 (de) | 1973-08-30 |
US3825454A (en) | 1974-07-23 |