NL7215767A - - Google Patents
Info
- Publication number
- NL7215767A NL7215767A NL7215767A NL7215767A NL7215767A NL 7215767 A NL7215767 A NL 7215767A NL 7215767 A NL7215767 A NL 7215767A NL 7215767 A NL7215767 A NL 7215767A NL 7215767 A NL7215767 A NL 7215767A
- Authority
- NL
- Netherlands
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/32—Seals for leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Joining Of Glass To Other Materials (AREA)
- Structure Of Telephone Exchanges (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2158188A DE2158188A1 (de) | 1971-11-24 | 1971-11-24 | Kaltpresschweissbare und kaltpressloetbare druckglasdurchfuehrungen |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7215767A true NL7215767A (de) | 1973-05-28 |
Family
ID=5825971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7215767A NL7215767A (de) | 1971-11-24 | 1972-11-22 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3988825A (de) |
JP (1) | JPS4860053A (de) |
AT (1) | AT326292B (de) |
DE (1) | DE2158188A1 (de) |
FR (1) | FR2160900A1 (de) |
GB (1) | GB1410813A (de) |
IT (1) | IT975467B (de) |
NL (1) | NL7215767A (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4100675A (en) * | 1976-11-01 | 1978-07-18 | Mansol Ceramics Company | Novel method and apparatus for hermetic encapsulation for integrated circuits and the like |
US4266090A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package |
US4266089A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package having excellent heat transfer characteristics |
DE2919404C2 (de) * | 1979-05-14 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse für Halbleiterbauelement |
JPS5952032B2 (ja) * | 1981-04-03 | 1984-12-17 | 株式会社東芝 | 圧接装置 |
DE3124692A1 (de) * | 1981-06-24 | 1983-01-13 | Robert Bosch Gmbh, 7000 Stuttgart | "halbleitergleichrichter" |
US4461924A (en) * | 1982-01-21 | 1984-07-24 | Olin Corporation | Semiconductor casing |
US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
US4453104A (en) * | 1982-05-12 | 1984-06-05 | Motorola, Inc. | Low-profile crystal package with an improved crystal-mounting arrangement |
US4524497A (en) * | 1982-05-12 | 1985-06-25 | Motorola, Inc. | Method of making a low-profile crystal package with an improved crystal-mounting arrangement |
US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages |
FR2568443B1 (fr) * | 1984-07-27 | 1986-11-14 | Cepe | Boitier a fermeture a froid supportant les hautes temperatures |
WO1989006934A1 (en) * | 1988-02-02 | 1989-08-10 | Intra-Sonix, Inc. | Ultrasonic transducer |
US5436407A (en) * | 1994-06-13 | 1995-07-25 | Integrated Packaging Assembly Corporation | Metal semiconductor package with an external plastic seal |
CN102185580A (zh) * | 2010-01-18 | 2011-09-14 | 精工爱普生株式会社 | 电子装置、基板的制造方法以及电子装置的制造方法 |
US9524840B2 (en) * | 2015-01-21 | 2016-12-20 | Thomas & Betters International LLC | High-temperature, high-pressure vacuum relay |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB859025A (en) * | 1958-08-13 | 1961-01-18 | Gen Electric Co Ltd | Improvements in or relating to electrical devices having hermetically sealed envelopes |
US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
US3024519A (en) * | 1960-07-19 | 1962-03-13 | Bendix Corp | Cold weld semiconductor housing |
US3203083A (en) * | 1961-02-08 | 1965-08-31 | Texas Instruments Inc | Method of manufacturing a hermetically sealed semiconductor capsule |
US3226820A (en) * | 1963-02-11 | 1966-01-04 | Scully Anthony Corp | Method of manufacturing hermetically sealed enclosures |
-
1971
- 1971-11-24 DE DE2158188A patent/DE2158188A1/de active Pending
-
1972
- 1972-10-27 AT AT914772A patent/AT326292B/de not_active IP Right Cessation
- 1972-11-07 IT IT70480/72A patent/IT975467B/it active
- 1972-11-21 FR FR7241288A patent/FR2160900A1/fr not_active Withdrawn
- 1972-11-22 NL NL7215767A patent/NL7215767A/xx unknown
- 1972-11-24 GB GB5441172A patent/GB1410813A/en not_active Expired
- 1972-11-24 JP JP47117859A patent/JPS4860053A/ja active Pending
- 1972-11-24 US US05/309,375 patent/US3988825A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AT326292B (de) | 1975-12-10 |
DE2158188A1 (de) | 1973-06-07 |
GB1410813A (en) | 1975-10-22 |
JPS4860053A (de) | 1973-08-23 |
ATA914772A (de) | 1975-02-15 |
IT975467B (it) | 1974-07-20 |
US3988825A (en) | 1976-11-02 |
FR2160900A1 (de) | 1973-07-06 |