NL7207300A - - Google Patents
Info
- Publication number
- NL7207300A NL7207300A NL7207300A NL7207300A NL7207300A NL 7207300 A NL7207300 A NL 7207300A NL 7207300 A NL7207300 A NL 7207300A NL 7207300 A NL7207300 A NL 7207300A NL 7207300 A NL7207300 A NL 7207300A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/042—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
- H10W70/457—Materials of metallic layers on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2127633A DE2127633B2 (de) | 1971-06-03 | 1971-06-03 | Verfahren zum Herstellen eines Systemträgers zur Halterung und Kontaktierung eines Halbleiterkörpers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7207300A true NL7207300A (cg-RX-API-DMAC7.html) | 1972-12-05 |
Family
ID=5809753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7207300A NL7207300A (cg-RX-API-DMAC7.html) | 1971-06-03 | 1972-05-30 |
Country Status (5)
| Country | Link |
|---|---|
| DE (1) | DE2127633B2 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2140190B3 (cg-RX-API-DMAC7.html) |
| GB (2) | GB1389346A (cg-RX-API-DMAC7.html) |
| IT (1) | IT955889B (cg-RX-API-DMAC7.html) |
| NL (1) | NL7207300A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2658532C2 (de) * | 1976-12-23 | 1984-02-16 | Siemens AG, 1000 Berlin und 8000 München | Zwischenträger zur Halterung und Kontaktierung eines Halbleiterkörpers und Verfahren zu dessen Herstellung |
| CN108257938B (zh) * | 2018-01-31 | 2020-01-24 | 江苏长电科技股份有限公司 | 用于引线框架的治具及引线框架的蚀刻方法 |
-
1971
- 1971-06-03 DE DE2127633A patent/DE2127633B2/de active Granted
-
1972
- 1972-05-25 GB GB2466172A patent/GB1389346A/en not_active Expired
- 1972-05-25 GB GB5125173A patent/GB1390752A/en not_active Expired
- 1972-05-26 IT IT24893/72A patent/IT955889B/it active
- 1972-05-30 NL NL7207300A patent/NL7207300A/xx unknown
- 1972-06-02 FR FR7219900A patent/FR2140190B3/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2127633C3 (cg-RX-API-DMAC7.html) | 1975-11-20 |
| DE2127633A1 (de) | 1972-12-07 |
| IT955889B (it) | 1973-09-29 |
| FR2140190A1 (cg-RX-API-DMAC7.html) | 1973-01-12 |
| DE2127633B2 (de) | 1975-03-20 |
| FR2140190B3 (cg-RX-API-DMAC7.html) | 1975-08-08 |
| GB1389346A (en) | 1975-04-03 |
| GB1390752A (en) | 1975-04-16 |