NL7201211A - - Google Patents

Info

Publication number
NL7201211A
NL7201211A NL7201211A NL7201211A NL7201211A NL 7201211 A NL7201211 A NL 7201211A NL 7201211 A NL7201211 A NL 7201211A NL 7201211 A NL7201211 A NL 7201211A NL 7201211 A NL7201211 A NL 7201211A
Authority
NL
Netherlands
Application number
NL7201211A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7201211A publication Critical patent/NL7201211A/xx

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
NL7201211A 1971-02-01 1972-01-28 NL7201211A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11147671A 1971-02-01 1971-02-01
US27892372A 1972-08-09 1972-08-09

Publications (1)

Publication Number Publication Date
NL7201211A true NL7201211A (https=) 1972-08-03

Family

ID=26808949

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7201211A NL7201211A (https=) 1971-02-01 1972-01-28

Country Status (8)

Country Link
US (2) US3704455A (https=)
AU (1) AU463321B2 (https=)
CA (1) CA955683A (https=)
CH (1) CH546997A (https=)
DE (1) DE2203423A1 (https=)
FR (1) FR2124319B1 (https=)
GB (1) GB1348231A (https=)
NL (1) NL7201211A (https=)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761898A (en) * 1971-03-05 1973-09-25 Raytheon Co Random access memory
US3970990A (en) * 1972-06-22 1976-07-20 Grumman Aerospace Corporation Adaptive imaging system
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US3863231A (en) * 1973-07-23 1975-01-28 Nat Res Dev Read only memory with annular fuse links
US3922775A (en) * 1973-09-13 1975-12-02 Sperry Rand Corp High frequency diode and manufacture thereof
US3917983A (en) * 1973-11-12 1975-11-04 Bunker Ramo Multiwafer electrical circuit construction and method of making
US3999173A (en) * 1975-03-17 1976-12-21 The Singer Company Serial core memory array
US4306925A (en) * 1977-01-11 1981-12-22 Pactel Corporation Method of manufacturing high density printed circuit
JPS54139415A (en) * 1978-04-21 1979-10-29 Hitachi Ltd Semiconductor channel switch
US4275410A (en) * 1978-11-29 1981-06-23 Hughes Aircraft Company Three-dimensionally structured microelectronic device
US4283755A (en) * 1980-02-05 1981-08-11 The United States Of America As Represented By The Secretary Of The Air Force Modulator multilayer detector
US4281361A (en) * 1980-03-17 1981-07-28 The United States Of America As Represented By The Secretary Of The Navy Simplified multilayer circuit board
US4535424A (en) * 1982-06-03 1985-08-13 Texas Instruments Incorporated Solid state three dimensional semiconductor memory array
US4499607A (en) * 1982-09-13 1985-02-12 Higgins David M Geometrically-integrated architecture of microcircuits for high-speed computers
US4480885A (en) * 1983-02-16 1984-11-06 Honeywell Information Systems Inc. Printed circuit board interconnection system
JPS61288455A (ja) * 1985-06-17 1986-12-18 Fujitsu Ltd 多層半導体装置の製造方法
US4897708A (en) * 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US4983533A (en) * 1987-10-28 1991-01-08 Irvine Sensors Corporation High-density electronic modules - process and product
US5089880A (en) * 1989-06-07 1992-02-18 Amdahl Corporation Pressurized interconnection system for semiconductor chips
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5249355A (en) * 1991-10-31 1993-10-05 Hughes Aircraft Company Method of fabricating a multilayer electrical circuit structure
EP0568312A3 (en) * 1992-04-27 1993-12-29 Seiko Instr Inc Semiconductor device with driver chip and methods of manufacture
WO1994003038A1 (en) * 1992-07-17 1994-02-03 Vlt Corporation Packaging electrical components
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
AU4857493A (en) * 1992-09-16 1994-04-12 James E. Clayton A thin multichip module
CA2173123A1 (en) * 1993-09-30 1995-04-06 Paul M. Zavracky Three-dimensional processor using transferred thin film circuits
US5470237A (en) * 1994-06-20 1995-11-28 Elco Corporation Latch mechanism for joining the cover and connector of a removable memory device
US6486528B1 (en) 1994-06-23 2002-11-26 Vertical Circuits, Inc. Silicon segment programming apparatus and three terminal fuse configuration
US5698895A (en) * 1994-06-23 1997-12-16 Cubic Memory, Inc. Silicon segment programming method and apparatus
US5675180A (en) * 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6080596A (en) * 1994-06-23 2000-06-27 Cubic Memory Inc. Method for forming vertical interconnect process for silicon segments with dielectric isolation
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US5891761A (en) * 1994-06-23 1999-04-06 Cubic Memory, Inc. Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform
US6124633A (en) * 1994-06-23 2000-09-26 Cubic Memory Vertical interconnect process for silicon segments with thermally conductive epoxy preform
US6255726B1 (en) 1994-06-23 2001-07-03 Cubic Memory, Inc. Vertical interconnect process for silicon segments with dielectric isolation
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5773320A (en) * 1995-11-13 1998-06-30 Asea Brown Boveri Ag Method for producing a power semiconductor module
US5950303A (en) * 1998-04-03 1999-09-14 The United States Of America As Represented By The Secretary Of The Air Force Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7511968B2 (en) 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7576995B2 (en) 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US7508058B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7608920B2 (en) 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7468553B2 (en) 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
US9220180B2 (en) * 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
US8437163B2 (en) * 2010-02-11 2013-05-07 Micron Technology, Inc. Memory dies, stacked memories, memory devices and methods
US20120210438A1 (en) * 2011-02-15 2012-08-16 Guobiao Zhang Secure Three-Dimensional Mask-Programmed Read-Only Memory
US9111597B2 (en) * 2012-12-20 2015-08-18 Macronix International Co., Ltd. Memory device structure with decoders in a device level separate from the array level

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
US3161859A (en) * 1961-01-12 1964-12-15 Rca Corp Modular memory structures
US3245058A (en) * 1961-12-15 1966-04-05 Ibm Semi-permanent memory
US3217089A (en) * 1962-06-01 1965-11-09 Control Data Corp Embedded printed circuit
US3383564A (en) * 1965-10-22 1968-05-14 Sanders Associates Inc Multilayer circuit
US3372309A (en) * 1965-12-23 1968-03-05 Gen Motors Corp Multilayer electronic module
US3351702A (en) * 1966-02-24 1967-11-07 Bunker Ramo Interconnection means and method of fabrication thereof
US3351953A (en) * 1966-03-10 1967-11-07 Bunker Ramo Interconnection means and method of fabrication thereof
GB1210321A (en) * 1967-02-02 1970-10-28 Bunker Ramo Laminated circuit components and method of manufacture thereof
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry

Also Published As

Publication number Publication date
US3769702A (en) 1973-11-06
DE2203423A1 (de) 1972-09-07
CH546997A (de) 1974-03-15
GB1348231A (en) 1974-03-13
AU463321B2 (en) 1975-07-24
FR2124319A1 (https=) 1972-09-22
CA955683A (en) 1974-10-01
AU3813872A (en) 1973-07-26
FR2124319B1 (https=) 1976-01-16
US3704455A (en) 1972-11-28

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Legal Events

Date Code Title Description
BB A search report has been drawn up
BC A request for examination has been filed
BV The patent application has lapsed