NL7115991A - - Google Patents

Info

Publication number
NL7115991A
NL7115991A NL7115991A NL7115991A NL7115991A NL 7115991 A NL7115991 A NL 7115991A NL 7115991 A NL7115991 A NL 7115991A NL 7115991 A NL7115991 A NL 7115991A NL 7115991 A NL7115991 A NL 7115991A
Authority
NL
Netherlands
Application number
NL7115991A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2023680A external-priority patent/DE2023680C3/de
Application filed filed Critical
Publication of NL7115991A publication Critical patent/NL7115991A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/464Additional interconnections in combination with leadframes
    • H10W70/466Tape carriers or flat leads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0446Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/161Containers comprising no base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07231Techniques
    • H10W72/07236Soldering or alloying
NL7115991A 1970-05-14 1971-11-19 NL7115991A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2023680A DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben
DE2057126A DE2057126C3 (de) 1970-05-14 1970-11-20 Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
NL7115991A true NL7115991A (enExample) 1972-05-24

Family

ID=34227360

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7115991A NL7115991A (enExample) 1970-05-14 1971-11-19

Country Status (3)

Country Link
DE (1) DE2057126C3 (enExample)
FR (2) FR2088564B1 (enExample)
NL (1) NL7115991A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108761A (ja) * 1981-12-23 1983-06-28 Toshiba Corp 電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays
DE1915501C3 (de) * 1969-03-26 1975-10-16 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE1917399A1 (de) * 1969-04-03 1970-10-08 Siemens Ag Anordnung mit wenigstens zwei elektrische Schaltelemente oder integrierte elektrische Schaltungen enthaltenden Halbleiterkoerpern

Also Published As

Publication number Publication date
FR2115206B2 (enExample) 1977-11-25
DE2057126B2 (de) 1975-03-27
FR2088564A1 (enExample) 1972-01-07
DE2057126C3 (de) 1975-11-06
DE2057126A1 (de) 1972-05-25
FR2088564B1 (enExample) 1977-08-05
FR2115206A2 (enExample) 1972-07-07

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