NL7102323A - - Google Patents

Info

Publication number
NL7102323A
NL7102323A NL7102323A NL7102323A NL7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A NL 7102323 A NL7102323 A NL 7102323A
Authority
NL
Netherlands
Application number
NL7102323A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7102323A publication Critical patent/NL7102323A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL7102323A 1970-02-26 1971-02-22 NL7102323A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1447870A 1970-02-26 1970-02-26

Publications (1)

Publication Number Publication Date
NL7102323A true NL7102323A (https=) 1971-08-30

Family

ID=21765748

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7102323A NL7102323A (https=) 1970-02-26 1971-02-22

Country Status (6)

Country Link
US (1) US3644180A (https=)
BE (1) BE763308A (https=)
CA (1) CA952058A (https=)
DE (1) DE2108327A1 (https=)
FR (1) FR2085598A1 (https=)
NL (1) NL7102323A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330604A (en) * 1980-08-04 1982-05-18 Hughes Aircraft Company Fabrication of holograms on plastic substrates
US4329409A (en) * 1980-08-04 1982-05-11 Hughes Aircraft Company Process for fabricating stable holograms
DE3720465A1 (de) * 1987-06-20 1988-12-29 Asea Brown Boveri Haftvermittler fuer negativresist zum aetzen tiefer graeben in siliciumscheiben mit glatter oberflaeche und verfahren zur herstellung des haftvermittlers
US5902475A (en) * 1997-04-08 1999-05-11 Interventional Technologies, Inc. Method for manufacturing a stent
US6063646A (en) * 1998-10-06 2000-05-16 Japan Rec Co., Ltd. Method for production of semiconductor package
US6047637A (en) * 1999-06-17 2000-04-11 Fujitsu Limited Method of paste printing using stencil and masking layer
US6617251B1 (en) * 2001-06-19 2003-09-09 Lsi Logic Corporation Method of shallow trench isolation formation and planarization
US11859093B2 (en) 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition
US11859092B2 (en) 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition

Also Published As

Publication number Publication date
FR2085598A1 (https=) 1971-12-24
DE2108327A1 (de) 1971-10-28
BE763308A (fr) 1971-07-16
CA952058A (en) 1974-07-30
US3644180A (en) 1972-02-22

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