NL7100410A - - Google Patents

Info

Publication number
NL7100410A
NL7100410A NL7100410A NL7100410A NL7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A NL 7100410 A NL7100410 A NL 7100410A
Authority
NL
Netherlands
Application number
NL7100410A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7100410A priority Critical patent/NL7100410A/xx
Priority to DE19712163855 priority patent/DE2163855A1/de
Priority to US00211277A priority patent/US3780429A/en
Priority to CA131,999A priority patent/CA953504A/en
Priority to IT19193/72A priority patent/IT946430B/it
Priority to GB99272A priority patent/GB1380644A/en
Priority to FR7200777A priority patent/FR2121744A1/fr
Publication of NL7100410A publication Critical patent/NL7100410A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
NL7100410A 1971-01-13 1971-01-13 NL7100410A (cg-RX-API-DMAC7.html)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (cg-RX-API-DMAC7.html) 1971-01-13 1971-01-13
DE19712163855 DE2163855A1 (de) 1971-01-13 1971-12-22 Verfahren und Vorrichtung zum Herstellen eines Bodens für die Umhüllung eines elektrischen Bauelementes, sowie Boden für die Umhüllung eines elektrischen Bauelementes
US00211277A US3780429A (en) 1971-01-13 1971-12-23 Method for manufacturing a base for the envelope of an electric component
CA131,999A CA953504A (en) 1971-01-13 1972-01-10 Manufacturing a base for the envelope of an electrical component
IT19193/72A IT946430B (it) 1971-01-13 1972-01-10 Metodo e dispositivo per la fabbri cazione di una base per un conteni tore di un componente elettrico e base per il com ponente elettrico
GB99272A GB1380644A (en) 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes
FR7200777A FR2121744A1 (cg-RX-API-DMAC7.html) 1971-01-13 1972-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (cg-RX-API-DMAC7.html) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
NL7100410A true NL7100410A (cg-RX-API-DMAC7.html) 1972-07-17

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7100410A NL7100410A (cg-RX-API-DMAC7.html) 1971-01-13 1971-01-13

Country Status (7)

Country Link
US (1) US3780429A (cg-RX-API-DMAC7.html)
CA (1) CA953504A (cg-RX-API-DMAC7.html)
DE (1) DE2163855A1 (cg-RX-API-DMAC7.html)
FR (1) FR2121744A1 (cg-RX-API-DMAC7.html)
GB (1) GB1380644A (cg-RX-API-DMAC7.html)
IT (1) IT946430B (cg-RX-API-DMAC7.html)
NL (1) NL7100410A (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (cg-RX-API-DMAC7.html) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Also Published As

Publication number Publication date
GB1380644A (en) 1975-01-15
IT946430B (it) 1973-05-21
US3780429A (en) 1973-12-25
CA953504A (en) 1974-08-27
DE2163855A1 (de) 1972-07-20
FR2121744A1 (cg-RX-API-DMAC7.html) 1972-08-25

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