GB1380644A - Manufacture of bases for electrical-component envelopes - Google Patents

Manufacture of bases for electrical-component envelopes

Info

Publication number
GB1380644A
GB1380644A GB99272A GB99272A GB1380644A GB 1380644 A GB1380644 A GB 1380644A GB 99272 A GB99272 A GB 99272A GB 99272 A GB99272 A GB 99272A GB 1380644 A GB1380644 A GB 1380644A
Authority
GB
United Kingdom
Prior art keywords
preform
conductors
mould
placing
sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB99272A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1380644A publication Critical patent/GB1380644A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
GB99272A 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes Expired GB1380644A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7100410A NL7100410A (cg-RX-API-DMAC7.html) 1971-01-13 1971-01-13

Publications (1)

Publication Number Publication Date
GB1380644A true GB1380644A (en) 1975-01-15

Family

ID=19812245

Family Applications (1)

Application Number Title Priority Date Filing Date
GB99272A Expired GB1380644A (en) 1971-01-13 1972-01-10 Manufacture of bases for electrical-component envelopes

Country Status (7)

Country Link
US (1) US3780429A (cg-RX-API-DMAC7.html)
CA (1) CA953504A (cg-RX-API-DMAC7.html)
DE (1) DE2163855A1 (cg-RX-API-DMAC7.html)
FR (1) FR2121744A1 (cg-RX-API-DMAC7.html)
GB (1) GB1380644A (cg-RX-API-DMAC7.html)
IT (1) IT946430B (cg-RX-API-DMAC7.html)
NL (1) NL7100410A (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
US4979289A (en) * 1989-02-10 1990-12-25 Honeywell Inc. Method of die bonding semiconductor chip by using removable non-wettable by solder frame
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526588A (en) * 1946-03-22 1950-10-17 Raytheon Mfg Co Molding apparatus
US2958100A (en) * 1955-05-16 1960-11-01 Erie Resistor Corp Mold for forming a plurality of electrical elements with embedded terminals
NL258072A (cg-RX-API-DMAC7.html) * 1960-11-17
US3379823A (en) * 1965-04-29 1968-04-23 Corning Glass Works Hermetic enclosure for electronic devices

Also Published As

Publication number Publication date
NL7100410A (cg-RX-API-DMAC7.html) 1972-07-17
IT946430B (it) 1973-05-21
US3780429A (en) 1973-12-25
CA953504A (en) 1974-08-27
DE2163855A1 (de) 1972-07-20
FR2121744A1 (cg-RX-API-DMAC7.html) 1972-08-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees