NL7012831A - - Google Patents

Info

Publication number
NL7012831A
NL7012831A NL7012831A NL7012831A NL7012831A NL 7012831 A NL7012831 A NL 7012831A NL 7012831 A NL7012831 A NL 7012831A NL 7012831 A NL7012831 A NL 7012831A NL 7012831 A NL7012831 A NL 7012831A
Authority
NL
Netherlands
Application number
NL7012831A
Other versions
NL167277C (nl
NL167277B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7012831A priority Critical patent/NL167277C/xx
Priority to DE2142146A priority patent/DE2142146C3/de
Priority to CA121176A priority patent/CA925224A/en
Priority to AU32687/71A priority patent/AU466690B2/en
Priority to US3775200D priority patent/US3775200A/en
Priority to FR7131003A priority patent/FR2103607B1/fr
Priority to GB4009271A priority patent/GB1356323A/en
Priority to JP6485471A priority patent/JPS5139512B1/ja
Priority to BE771917A priority patent/BE771917A/xx
Publication of NL7012831A publication Critical patent/NL7012831A/xx
Publication of NL167277B publication Critical patent/NL167277B/xx
Application granted granted Critical
Publication of NL167277C publication Critical patent/NL167277C/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/646—Chemical etching of Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
NL7012831A 1970-08-29 1970-08-29 Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting. NL167277C (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL7012831A NL167277C (nl) 1970-08-29 1970-08-29 Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.
DE2142146A DE2142146C3 (de) 1970-08-29 1971-08-23 Verfahren zum gleichzeitigen Herstellen mehrerer Halbleiterbauelemente
CA121176A CA925224A (en) 1970-08-29 1971-08-24 Semiconductor device and method of manufacturing the same
US3775200D US3775200A (en) 1970-08-29 1971-08-25 Schottky contact devices and method of manufacture
AU32687/71A AU466690B2 (en) 1970-08-29 1971-08-25 Semiconductor device and method of manufacturing the same
FR7131003A FR2103607B1 (https=) 1970-08-29 1971-08-26
GB4009271A GB1356323A (en) 1970-08-29 1971-08-26 Semiconductor devices
JP6485471A JPS5139512B1 (https=) 1970-08-29 1971-08-26
BE771917A BE771917A (fr) 1970-08-29 1971-08-27 Dispositif semiconducteur et procede permettant sa fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7012831A NL167277C (nl) 1970-08-29 1970-08-29 Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.

Publications (3)

Publication Number Publication Date
NL7012831A true NL7012831A (https=) 1972-03-02
NL167277B NL167277B (nl) 1981-06-16
NL167277C NL167277C (nl) 1981-11-16

Family

ID=19810894

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7012831A NL167277C (nl) 1970-08-29 1970-08-29 Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.

Country Status (9)

Country Link
US (1) US3775200A (https=)
JP (1) JPS5139512B1 (https=)
AU (1) AU466690B2 (https=)
BE (1) BE771917A (https=)
CA (1) CA925224A (https=)
DE (1) DE2142146C3 (https=)
FR (1) FR2103607B1 (https=)
GB (1) GB1356323A (https=)
NL (1) NL167277C (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189342A (en) * 1971-10-07 1980-02-19 U.S. Philips Corporation Semiconductor device comprising projecting contact layers
US3761783A (en) * 1972-02-02 1973-09-25 Sperry Rand Corp Duel-mesa ring-shaped high frequency diode
JPS519269B2 (https=) * 1972-05-19 1976-03-25
US3839110A (en) * 1973-02-20 1974-10-01 Bell Telephone Labor Inc Chemical etchant for palladium
US4071397A (en) * 1973-07-02 1978-01-31 Motorola, Inc. Silicon metallographic etch
DE2409312C3 (de) * 1974-02-27 1981-01-08 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einer auf der Halbleiteroberfläche angeordneten Metallschicht und Verfahren zu ihrer Herstellung
DE2415487C3 (de) * 1974-03-29 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von Leiterplatten nach dem Photoätzverfahren
US4092660A (en) * 1974-09-16 1978-05-30 Texas Instruments Incorporated High power field effect transistor
US3956042A (en) * 1974-11-07 1976-05-11 Xerox Corporation Selective etchants for thin film devices
US3932880A (en) * 1974-11-26 1976-01-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with Schottky barrier
FR2328286A1 (fr) * 1975-10-14 1977-05-13 Thomson Csf Procede de fabrication de dispositifs a semiconducteurs, presentant une tres faible resistance thermique, et dispositifs obtenus par ledit procede
US4023258A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4023260A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4142893A (en) * 1977-09-14 1979-03-06 Raytheon Company Spray etch dicing method
US4681657A (en) * 1985-10-31 1987-07-21 International Business Machines Corporation Preferential chemical etch for doped silicon
US4784967A (en) * 1986-12-19 1988-11-15 American Telephone And Telegraph Company, At&T Bell Laboratories Method for fabricating a field-effect transistor with a self-aligned gate
US6366266B1 (en) 1999-09-02 2002-04-02 Micron Technology, Inc. Method and apparatus for programmable field emission display
DE19962431B4 (de) * 1999-12-22 2005-10-20 Micronas Gmbh Verfahren zum Herstellen einer Halbleiteranordnung mit Haftzone für eine Passivierungsschicht
US7084475B2 (en) * 2004-02-17 2006-08-01 Velox Semiconductor Corporation Lateral conduction Schottky diode with plural mesas
US7417266B1 (en) 2004-06-10 2008-08-26 Qspeed Semiconductor Inc. MOSFET having a JFET embedded as a body diode
US7436039B2 (en) * 2005-01-06 2008-10-14 Velox Semiconductor Corporation Gallium nitride semiconductor device
US8026568B2 (en) 2005-11-15 2011-09-27 Velox Semiconductor Corporation Second Schottky contact metal layer to improve GaN Schottky diode performance
US7939853B2 (en) * 2007-03-20 2011-05-10 Power Integrations, Inc. Termination and contact structures for a high voltage GaN-based heterojunction transistor
KR20090127035A (ko) * 2007-03-26 2009-12-09 스미토모덴키고교가부시키가이샤 쇼트키 배리어 다이오드 및 그 제조 방법
US8633094B2 (en) 2011-12-01 2014-01-21 Power Integrations, Inc. GaN high voltage HFET with passivation plus gate dielectric multilayer structure
US8940620B2 (en) 2011-12-15 2015-01-27 Power Integrations, Inc. Composite wafer for fabrication of semiconductor devices
US8928037B2 (en) 2013-02-28 2015-01-06 Power Integrations, Inc. Heterostructure power transistor with AlSiN passivation layer
US11749758B1 (en) 2019-11-05 2023-09-05 Semiq Incorporated Silicon carbide junction barrier schottky diode with wave-shaped regions
US11469333B1 (en) 2020-02-19 2022-10-11 Semiq Incorporated Counter-doped silicon carbide Schottky barrier diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110849A (en) * 1960-10-03 1963-11-12 Gen Electric Tunnel diode device
US3214654A (en) * 1961-02-01 1965-10-26 Rca Corp Ohmic contacts to iii-v semiconductive compound bodies
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
JPS4512750Y1 (https=) * 1969-05-01 1970-06-03

Also Published As

Publication number Publication date
DE2142146C3 (de) 1980-03-13
GB1356323A (en) 1974-06-12
DE2142146A1 (de) 1972-03-02
BE771917A (fr) 1972-02-28
JPS5139512B1 (https=) 1976-10-28
FR2103607B1 (https=) 1976-05-28
AU466690B2 (en) 1975-11-06
NL167277C (nl) 1981-11-16
AU3268771A (en) 1973-03-01
NL167277B (nl) 1981-06-16
FR2103607A1 (https=) 1972-04-14
DE2142146B2 (de) 1979-07-12
US3775200A (en) 1973-11-27
CA925224A (en) 1973-04-24

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Legal Events

Date Code Title Description
V2 Lapsed due to non-payment of the last due maintenance fee for the patent application