NL7011885A - - Google Patents

Info

Publication number
NL7011885A
NL7011885A NL7011885A NL7011885A NL7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A NL 7011885 A NL7011885 A NL 7011885A
Authority
NL
Netherlands
Application number
NL7011885A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7011885A priority Critical patent/NL7011885A/xx
Priority to DE2136201A priority patent/DE2136201C3/de
Priority to JP46059670A priority patent/JPS5110072B1/ja
Priority to AU32121/71A priority patent/AU463465B2/en
Priority to BR5101/71A priority patent/BR7105101D0/pt
Priority to GB37351/71A priority patent/GB1293710A/en
Priority to ES394087A priority patent/ES394087A1/es
Priority to US00170482A priority patent/US3780432A/en
Priority to CA120,461A priority patent/CA964379A/en
Priority to FR7129371A priority patent/FR2102211B1/fr
Publication of NL7011885A publication Critical patent/NL7011885A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334Auxiliary members in encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
NL7011885A 1970-08-12 1970-08-12 NL7011885A (fr)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL7011885A NL7011885A (fr) 1970-08-12 1970-08-12
DE2136201A DE2136201C3 (de) 1970-08-12 1971-07-20 Verfahren zum Anbringen metallischer Zuleitungen an einem elektrischen Festkörper-Bauelement
JP46059670A JPS5110072B1 (fr) 1970-08-12 1971-08-09
AU32121/71A AU463465B2 (en) 1970-08-12 1971-08-09 Method of establishing relatively insulation connections between conductor ends andan insulating substrate
BR5101/71A BR7105101D0 (pt) 1970-08-12 1971-08-09 Processo para estabelecer conexoes relativamente isoladas entre as extremidades de condutores metalicos
GB37351/71A GB1293710A (en) 1970-08-12 1971-08-09 Improvements in and relating to substrate connections
ES394087A ES394087A1 (es) 1970-08-12 1971-08-10 Un metodo de establecer conexiones relativamente aisladas entre los terminales de conductores metalicos dispuestos en un bastidor de montaje y un sustrato aislante.
US00170482A US3780432A (en) 1970-08-12 1971-08-10 Method of establishing relatively insulated connections between conductor ends and an insulating substrate
CA120,461A CA964379A (en) 1970-08-12 1971-08-10 Method of establishing relatively insulation connections between conductor ends and an insulating substrate
FR7129371A FR2102211B1 (fr) 1970-08-12 1971-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7011885A NL7011885A (fr) 1970-08-12 1970-08-12

Publications (1)

Publication Number Publication Date
NL7011885A true NL7011885A (fr) 1972-02-15

Family

ID=19810763

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7011885A NL7011885A (fr) 1970-08-12 1970-08-12

Country Status (10)

Country Link
US (1) US3780432A (fr)
JP (1) JPS5110072B1 (fr)
AU (1) AU463465B2 (fr)
BR (1) BR7105101D0 (fr)
CA (1) CA964379A (fr)
DE (1) DE2136201C3 (fr)
ES (1) ES394087A1 (fr)
FR (1) FR2102211B1 (fr)
GB (1) GB1293710A (fr)
NL (1) NL7011885A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893234A (en) * 1972-07-03 1975-07-08 Sierracin Corp Edge improvement for window with electrically conductive layer
US3909934A (en) * 1972-12-02 1975-10-07 Licentia Gmbh Method of producing a measuring head for measuring electrical components
JPH033604U (fr) * 1989-06-02 1991-01-16
DE59005028D1 (de) * 1990-06-30 1994-04-21 Heidenhain Gmbh Dr Johannes Lötverbinder und Verfahren zur Herstellung einer elektrischen Schaltung mit diesem Lötverbinder.
US5184206A (en) * 1990-10-26 1993-02-02 General Electric Company Direct thermocompression bonding for thin electronic power chips
DE4429002A1 (de) * 1994-08-16 1996-02-22 Siemens Nixdorf Inf Syst Anschlußstiele für elektronische Bausteine mit flächigen Anschlußfeldern
KR20090076949A (ko) * 2006-10-06 2009-07-13 마이크로세미 코포레이션 고온, 고전압 탄화규소 무공극 전자 패키지

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396461A (en) * 1962-12-04 1968-08-13 Engelhard Ind Inc Printed circuit board and method of manufacture thereof
GB1087861A (en) * 1963-04-18 1967-10-18 Sealectro Corp Improvements in electrical socket connectors and other electrical contact devices
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3371148A (en) * 1966-04-12 1968-02-27 Radiation Inc Semiconductor device package and method of assembly therefor
US3434940A (en) * 1966-07-21 1969-03-25 Mc Donnell Douglas Corp Process for making thin-film temperature sensors
US3618200A (en) * 1970-04-17 1971-11-09 Matsuo Electric Co Method of manufacturing chip-shaped passive electronic components

Also Published As

Publication number Publication date
AU3212171A (en) 1973-02-15
DE2136201B2 (de) 1977-09-22
DE2136201C3 (de) 1978-05-24
FR2102211B1 (fr) 1976-05-28
AU463465B2 (en) 1975-07-31
US3780432A (en) 1973-12-25
JPS5110072B1 (fr) 1976-04-01
GB1293710A (en) 1972-10-25
FR2102211A1 (fr) 1972-04-07
CA964379A (en) 1975-03-11
ES394087A1 (es) 1974-11-16
BR7105101D0 (pt) 1973-04-12
DE2136201A1 (de) 1973-08-16

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