NL7011089A - - Google Patents
Info
- Publication number
- NL7011089A NL7011089A NL7011089A NL7011089A NL7011089A NL 7011089 A NL7011089 A NL 7011089A NL 7011089 A NL7011089 A NL 7011089A NL 7011089 A NL7011089 A NL 7011089A NL 7011089 A NL7011089 A NL 7011089A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691942455 DE1942455C3 (de) | 1969-08-20 | Verfahren zum Herstellen mehrschichtiger Leiterbahnen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7011089A true NL7011089A (de) | 1971-02-23 |
Family
ID=5743336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7011089A NL7011089A (de) | 1969-08-20 | 1970-07-27 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3642548A (de) |
| JP (1) | JPS4910191B1 (de) |
| AT (1) | AT305417B (de) |
| CH (1) | CH508281A (de) |
| FR (1) | FR2060107B1 (de) |
| GB (1) | GB1257408A (de) |
| NL (1) | NL7011089A (de) |
| SE (1) | SE351321B (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3839108A (en) * | 1970-07-22 | 1974-10-01 | Us Navy | Method of forming a precision pattern of apertures in a plate |
| US3740523A (en) * | 1971-12-30 | 1973-06-19 | Bell Telephone Labor Inc | Encoding of read only memory by laser vaporization |
| US3879746A (en) * | 1972-05-30 | 1975-04-22 | Bell Telephone Labor Inc | Gate metallization structure |
| US4057831A (en) * | 1972-09-05 | 1977-11-08 | U.S. Philips Corporation | Video record disc manufactured by a process involving chemical or sputter etching |
| JPS5061124A (de) * | 1973-09-28 | 1975-05-26 | ||
| US4035208A (en) * | 1974-09-03 | 1977-07-12 | Texas Instruments Incorporated | Method of patterning Cr-Pt-Au metallization for silicon devices |
| FR2285716A1 (fr) * | 1974-09-18 | 1976-04-16 | Radiotechnique Compelec | Procede pour la fabrication d'un dispositif semi-conducteur comportant une configuration de conducteurs et dispositif fabrique par ce procede |
| US4135998A (en) * | 1978-04-26 | 1979-01-23 | International Business Machines Corp. | Method for forming pt-si schottky barrier contact |
| US4226932A (en) * | 1979-07-05 | 1980-10-07 | Gte Automatic Electric Laboratories Incorporated | Titanium nitride as one layer of a multi-layered coating intended to be etched |
| US4248688A (en) * | 1979-09-04 | 1981-02-03 | International Business Machines Corporation | Ion milling of thin metal films |
| CH648692A5 (en) * | 1979-09-05 | 1985-03-29 | Bbc Brown Boveri & Cie | Contact arrangement on a semiconductor component |
| US6025205A (en) * | 1997-01-07 | 2000-02-15 | Tong Yang Cement Corporation | Apparatus and methods of forming preferred orientation-controlled platinum films using nitrogen |
| JP4605554B2 (ja) * | 2000-07-25 | 2011-01-05 | 独立行政法人物質・材料研究機構 | ドライエッチング用マスク材 |
| JP2005025910A (ja) * | 2003-06-13 | 2005-01-27 | Nec Corp | 光学的情報記録媒体及びその製造方法 |
| ES2685343B1 (es) | 2017-03-31 | 2019-10-11 | Dominguez Francisco Picon | Dispositivo y método para el control y gestión de recursos laborales |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3271286A (en) * | 1964-02-25 | 1966-09-06 | Bell Telephone Labor Inc | Selective removal of material using cathodic sputtering |
| GB1023532A (de) * | 1964-01-07 | |||
| US3442701A (en) * | 1965-05-19 | 1969-05-06 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
| US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
| US3546010A (en) * | 1968-03-06 | 1970-12-08 | Bosch Gmbh Robert | Method of producing multilayer bodies of predetermined electric conductivity |
-
1970
- 1970-07-15 US US55149A patent/US3642548A/en not_active Expired - Lifetime
- 1970-07-27 NL NL7011089A patent/NL7011089A/xx unknown
- 1970-08-13 FR FR7029806A patent/FR2060107B1/fr not_active Expired
- 1970-08-18 JP JP45071818A patent/JPS4910191B1/ja active Pending
- 1970-08-18 AT AT748970A patent/AT305417B/de not_active IP Right Cessation
- 1970-08-19 CH CH1238070A patent/CH508281A/de not_active IP Right Cessation
- 1970-08-19 GB GB1257408D patent/GB1257408A/en not_active Expired
- 1970-08-20 SE SE11371/70A patent/SE351321B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1942455B2 (de) | 1977-05-26 |
| FR2060107A1 (de) | 1971-06-11 |
| AT305417B (de) | 1973-02-26 |
| CH508281A (de) | 1971-05-31 |
| SE351321B (de) | 1972-11-20 |
| JPS4910191B1 (de) | 1974-03-08 |
| FR2060107B1 (de) | 1974-10-31 |
| DE1942455A1 (de) | 1971-02-25 |
| US3642548A (en) | 1972-02-15 |
| GB1257408A (de) | 1971-12-15 |