NL6814014A - - Google Patents

Info

Publication number
NL6814014A
NL6814014A NL6814014A NL6814014A NL6814014A NL 6814014 A NL6814014 A NL 6814014A NL 6814014 A NL6814014 A NL 6814014A NL 6814014 A NL6814014 A NL 6814014A NL 6814014 A NL6814014 A NL 6814014A
Authority
NL
Netherlands
Prior art keywords
gold
nickel
pellet
welding
preliminarily
Prior art date
Application number
NL6814014A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6814014A publication Critical patent/NL6814014A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/325—Material
    • H01L2224/32505—Material outside the bonding interface, e.g. in the bulk of the layer connector
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2224/92—Specific sequence of method steps
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    • H01L2924/11—Device type
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
NL6814014A 1967-10-02 1968-10-01 NL6814014A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6305967A JPS553815B1 (nl) 1967-10-02 1967-10-02

Publications (1)

Publication Number Publication Date
NL6814014A true NL6814014A (nl) 1969-04-08

Family

ID=13218374

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6814014A NL6814014A (nl) 1967-10-02 1968-10-01

Country Status (6)

Country Link
US (1) US3641663A (nl)
JP (1) JPS553815B1 (nl)
DE (1) DE1800347B2 (nl)
GB (1) GB1190290A (nl)
MY (1) MY7300496A (nl)
NL (1) NL6814014A (nl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
US4659006A (en) * 1985-09-26 1987-04-21 Rca Corporation Method of bonding a die to a substrate
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
WO1991009699A1 (en) * 1989-12-29 1991-07-11 Williams Advanced Materials Inc. Welding of solder frame to ceramic lid in semi-conductor packaging
CN103887183B (zh) * 2012-12-21 2017-09-12 华为技术有限公司 金/硅共晶芯片焊接方法及晶体管
US8975176B2 (en) 2013-03-15 2015-03-10 Materion Corporation Gold die bond sheet preform
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3031747A (en) * 1957-12-31 1962-05-01 Tung Sol Electric Inc Method of forming ohmic contact to silicon
NL260635A (nl) * 1960-04-25
US3307088A (en) * 1962-03-13 1967-02-28 Fujikawa Kyoichi Silver-lead alloy contacts containing dopants for semiconductors
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
US3273979A (en) * 1964-07-06 1966-09-20 Rca Corp Semiconductive devices
BE671953A (nl) * 1964-11-05

Also Published As

Publication number Publication date
GB1190290A (en) 1970-04-29
US3641663A (en) 1972-02-15
JPS553815B1 (nl) 1980-01-26
MY7300496A (en) 1973-12-31
DE1800347B2 (de) 1971-07-29
DE1800347A1 (de) 1969-06-26

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