NL6810890A - - Google Patents

Info

Publication number
NL6810890A
NL6810890A NL6810890A NL6810890A NL6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A
Authority
NL
Netherlands
Application number
NL6810890A
Other versions
NL144120B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6810890A publication Critical patent/NL6810890A/xx
Publication of NL144120B publication Critical patent/NL144120B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142Metallic substrates having insulating layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
NL686810890A 1967-08-03 1968-07-31 Werkwijze voor het vervaardigen van een dunnelaagschakeling, alsmede de volgens deze werkwijze verkregen schakeling. NL144120B (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB3574867 1967-08-03
GB939168 1968-02-27

Publications (2)

Publication Number Publication Date
NL6810890A true NL6810890A (cg-RX-API-DMAC7.html) 1969-02-05
NL144120B NL144120B (nl) 1974-11-15

Family

ID=26242903

Family Applications (1)

Application Number Title Priority Date Filing Date
NL686810890A NL144120B (nl) 1967-08-03 1968-07-31 Werkwijze voor het vervaardigen van een dunnelaagschakeling, alsmede de volgens deze werkwijze verkregen schakeling.

Country Status (6)

Country Link
JP (1) JPS4919551B1 (cg-RX-API-DMAC7.html)
CA (1) CA924418A (cg-RX-API-DMAC7.html)
DE (1) DE1765884A1 (cg-RX-API-DMAC7.html)
FR (1) FR1584094A (cg-RX-API-DMAC7.html)
NL (1) NL144120B (cg-RX-API-DMAC7.html)
SE (1) SE347861B (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU470249A1 (ru) * 1972-12-20 1976-08-05 Предприятие П/Я Г-4515 Микросхема
JPS5211843U (cg-RX-API-DMAC7.html) * 1975-07-14 1977-01-27
CA1137649A (en) * 1980-07-10 1982-12-14 Guy J. Chaput Electrical circuit on porcelain coated metal substrate
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method
FR2763780B1 (fr) * 1997-05-20 1999-08-13 Sagem Procede de fabrication de circuits imprimes sur substrat metallique
NL1033519C2 (nl) * 2007-03-08 2008-09-16 Yun Tai Werkwijze voor warmteoverdracht bij halfgeleiders.
EP3749054A1 (en) 2019-06-03 2020-12-09 Patentbox Internacional, S.L. Arrangement of elements in an electric heating plate and its manufacturing procedure

Also Published As

Publication number Publication date
DE1765884A1 (de) 1972-02-03
FR1584094A (cg-RX-API-DMAC7.html) 1969-12-12
JPS4919551B1 (cg-RX-API-DMAC7.html) 1974-05-18
NL144120B (nl) 1974-11-15
SE347861B (cg-RX-API-DMAC7.html) 1972-08-14
CA924418A (en) 1973-04-10

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