NL6810890A - - Google Patents
Info
- Publication number
- NL6810890A NL6810890A NL6810890A NL6810890A NL6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A NL 6810890 A NL6810890 A NL 6810890A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H10W70/05—
-
- H10W70/6875—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemical Coating By Surface Reaction (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3574867 | 1967-08-03 | ||
| GB939168 | 1968-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL6810890A true NL6810890A (cg-RX-API-DMAC10.html) | 1969-02-05 |
| NL144120B NL144120B (nl) | 1974-11-15 |
Family
ID=26242903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL686810890A NL144120B (nl) | 1967-08-03 | 1968-07-31 | Werkwijze voor het vervaardigen van een dunnelaagschakeling, alsmede de volgens deze werkwijze verkregen schakeling. |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS4919551B1 (cg-RX-API-DMAC10.html) |
| CA (1) | CA924418A (cg-RX-API-DMAC10.html) |
| DE (1) | DE1765884A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR1584094A (cg-RX-API-DMAC10.html) |
| NL (1) | NL144120B (cg-RX-API-DMAC10.html) |
| SE (1) | SE347861B (cg-RX-API-DMAC10.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU470249A1 (ru) * | 1972-12-20 | 1976-08-05 | Предприятие П/Я Г-4515 | Микросхема |
| JPS5211843U (cg-RX-API-DMAC10.html) * | 1975-07-14 | 1977-01-27 | ||
| CA1137649A (en) * | 1980-07-10 | 1982-12-14 | Guy J. Chaput | Electrical circuit on porcelain coated metal substrate |
| IL110431A (en) * | 1994-07-25 | 2001-08-08 | Microcomponents And Systems Lt | Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method |
| FR2763780B1 (fr) * | 1997-05-20 | 1999-08-13 | Sagem | Procede de fabrication de circuits imprimes sur substrat metallique |
| NL1033519C2 (nl) * | 2007-03-08 | 2008-09-16 | Yun Tai | Werkwijze voor warmteoverdracht bij halfgeleiders. |
| EP3749054A1 (en) | 2019-06-03 | 2020-12-09 | Patentbox Internacional, S.L. | Arrangement of elements in an electric heating plate and its manufacturing procedure |
-
1968
- 1968-07-29 CA CA026221A patent/CA924418A/en not_active Expired
- 1968-07-31 NL NL686810890A patent/NL144120B/xx unknown
- 1968-07-31 DE DE19681765884 patent/DE1765884A1/de active Pending
- 1968-08-01 SE SE10389/68A patent/SE347861B/xx unknown
- 1968-08-02 FR FR1584094D patent/FR1584094A/fr not_active Expired
- 1968-08-03 JP JP43054658A patent/JPS4919551B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA924418A (en) | 1973-04-10 |
| SE347861B (cg-RX-API-DMAC10.html) | 1972-08-14 |
| FR1584094A (cg-RX-API-DMAC10.html) | 1969-12-12 |
| DE1765884A1 (de) | 1972-02-03 |
| JPS4919551B1 (cg-RX-API-DMAC10.html) | 1974-05-18 |
| NL144120B (nl) | 1974-11-15 |