NL6807812A - - Google Patents

Info

Publication number
NL6807812A
NL6807812A NL6807812A NL6807812A NL6807812A NL 6807812 A NL6807812 A NL 6807812A NL 6807812 A NL6807812 A NL 6807812A NL 6807812 A NL6807812 A NL 6807812A NL 6807812 A NL6807812 A NL 6807812A
Authority
NL
Netherlands
Application number
NL6807812A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6807812A publication Critical patent/NL6807812A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
NL6807812A 1967-06-05 1968-06-04 NL6807812A (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64361367A 1967-06-05 1967-06-05
US2441070A 1970-03-13 1970-03-13

Publications (1)

Publication Number Publication Date
NL6807812A true NL6807812A (xx) 1968-12-06

Family

ID=26698414

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6807812A NL6807812A (xx) 1967-06-05 1968-06-04

Country Status (4)

Country Link
US (2) US3528906A (xx)
FR (1) FR1567715A (xx)
GB (1) GB1209968A (xx)
NL (1) NL6807812A (xx)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3664948A (en) * 1969-11-19 1972-05-23 Texas Instruments Inc Sputtering system
US3844924A (en) * 1970-08-03 1974-10-29 Texas Instruments Inc Sputtering apparatus for forming ohmic contacts for semiconductor devices
US3856654A (en) * 1971-08-26 1974-12-24 Western Electric Co Apparatus for feeding and coating masses of workpieces in a controlled atmosphere
US3933644A (en) * 1972-03-23 1976-01-20 Varian Associates Sputter coating apparatus having improved target electrode structure
CH558428A (de) * 1972-11-23 1975-01-31 Balzers Patent Beteilig Ag Target-wechselvorrichtung fuer die zerstaeubung mittels ionen.
US4021277A (en) * 1972-12-07 1977-05-03 Sprague Electric Company Method of forming thin film resistor
US3864239A (en) * 1974-04-22 1975-02-04 Nasa Multitarget sequential sputtering apparatus
DE2705611A1 (de) * 1977-02-10 1978-08-17 Siemens Ag Verfahren zum bedecken einer auf einem substrat befindlichen ersten schicht oder schichtenfolge mit einer weiteren zweiten schicht durch aufsputtern
JPS55134175A (en) * 1979-04-06 1980-10-18 Hitachi Ltd Microwave plasma etching unit
US4313783A (en) * 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US4297189A (en) * 1980-06-27 1981-10-27 Rockwell International Corporation Deposition of ordered crystalline films
US4511593A (en) * 1983-01-17 1985-04-16 Multi-Arc Vacuum Systems Inc. Vapor deposition apparatus and method
US4465577A (en) * 1983-03-31 1984-08-14 Gould, Inc. Method and device relating to thin-film cermets
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
US4931158A (en) * 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
NL9002176A (nl) * 1990-10-08 1992-05-06 Philips Nv Werkwijze voor het verminderen van deeltjescontaminatie tijdens sputteren en een sputterinrichting voor gebruik van een dergelijke werkwijze.
JPH06108242A (ja) * 1992-09-25 1994-04-19 Minolta Camera Co Ltd 薄膜電極および薄膜製造装置
US6964731B1 (en) * 1998-12-21 2005-11-15 Cardinal Cg Company Soil-resistant coating for glass surfaces
US6660365B1 (en) * 1998-12-21 2003-12-09 Cardinal Cg Company Soil-resistant coating for glass surfaces
US6974629B1 (en) 1999-08-06 2005-12-13 Cardinal Cg Company Low-emissivity, soil-resistant coating for glass surfaces
EP1713736B1 (en) 2003-12-22 2016-04-27 Cardinal CG Company Graded photocatalytic coatings and methods of making such coatings
JP2008505842A (ja) 2004-07-12 2008-02-28 日本板硝子株式会社 低保守コーティング
EP1628322A1 (de) * 2004-08-17 2006-02-22 Applied Films GmbH & Co. KG Haltevorrichtung für eine Blende
US7879209B2 (en) * 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
WO2006028774A2 (en) * 2004-09-03 2006-03-16 Cardinal Cg Company Coater having interrupted conveyor system
CA2586842C (en) * 2004-11-15 2013-01-08 Cardinal Cg Company Methods and equipment for depositing coatings having sequenced structures
US7923114B2 (en) 2004-12-03 2011-04-12 Cardinal Cg Company Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
US8092660B2 (en) 2004-12-03 2012-01-10 Cardinal Cg Company Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
US7989094B2 (en) * 2006-04-19 2011-08-02 Cardinal Cg Company Opposed functional coatings having comparable single surface reflectances
US20080011599A1 (en) 2006-07-12 2008-01-17 Brabender Dennis M Sputtering apparatus including novel target mounting and/or control
US7820296B2 (en) 2007-09-14 2010-10-26 Cardinal Cg Company Low-maintenance coating technology
WO2018093985A1 (en) 2016-11-17 2018-05-24 Cardinal Cg Company Static-dissipative coating technology
EP4032114A1 (en) * 2019-09-18 2022-07-27 Danmarks Tekniske Universitet A magnetron plasma sputtering arrangement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA702672A (en) * 1965-01-26 Philco Corporation Deposition of metal layers on insulating substrates in an inert atmosphere
US3267015A (en) * 1963-09-13 1966-08-16 Alloyd Electronics Corp Systems and processes for coating by evaporation
US3347772A (en) * 1964-03-02 1967-10-17 Schjeldahl Co G T Rf sputtering apparatus including a capacitive lead-in for an rf potential
US3369991A (en) * 1965-01-28 1968-02-20 Ibm Apparatus for cathode sputtering including a shielded rf electrode
US3410774A (en) * 1965-10-23 1968-11-12 Ibm Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece
US3361659A (en) * 1967-08-14 1968-01-02 Ibm Process of depositing thin films by cathode sputtering using a controlled grid

Also Published As

Publication number Publication date
US3528906A (en) 1970-09-15
US3677924A (en) 1972-07-18
FR1567715A (xx) 1969-05-16
GB1209968A (en) 1970-10-28

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