NL6709523A - - Google Patents

Info

Publication number
NL6709523A
NL6709523A NL6709523A NL6709523A NL6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A
Authority
NL
Netherlands
Application number
NL6709523A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6709523A priority Critical patent/NL6709523A/xx
Priority to US742250A priority patent/US3537169A/en
Priority to SE09339/68A priority patent/SE330415B/xx
Priority to GB1233083D priority patent/GB1233083A/en
Priority to CH1008368A priority patent/CH483726A/de
Priority to DE19681752727 priority patent/DE1752727B2/de
Priority to AT648268A priority patent/AT296389B/de
Priority to ES355847A priority patent/ES355847A1/es
Priority to FR1574319D priority patent/FR1574319A/fr
Priority to BE717795D priority patent/BE717795A/xx
Publication of NL6709523A publication Critical patent/NL6709523A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)
NL6709523A 1967-07-08 1967-07-08 NL6709523A (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL6709523A NL6709523A (ja) 1967-07-08 1967-07-08
US742250A US3537169A (en) 1967-07-08 1968-07-03 Method of severing a semiconductor wafer
SE09339/68A SE330415B (ja) 1967-07-08 1968-07-05
GB1233083D GB1233083A (ja) 1967-07-08 1968-07-05
CH1008368A CH483726A (de) 1967-07-08 1968-07-05 Verfahren zum Zerlegen einer Halbleiterscheibe
DE19681752727 DE1752727B2 (de) 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe
AT648268A AT296389B (de) 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe
ES355847A ES355847A1 (es) 1967-07-08 1968-07-06 Metodo para separar una oblea semiconductora.
FR1574319D FR1574319A (ja) 1967-07-08 1968-07-08
BE717795D BE717795A (ja) 1967-07-08 1968-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6709523A NL6709523A (ja) 1967-07-08 1967-07-08

Publications (1)

Publication Number Publication Date
NL6709523A true NL6709523A (ja) 1969-01-10

Family

ID=19800665

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6709523A NL6709523A (ja) 1967-07-08 1967-07-08

Country Status (10)

Country Link
US (1) US3537169A (ja)
AT (1) AT296389B (ja)
BE (1) BE717795A (ja)
CH (1) CH483726A (ja)
DE (1) DE1752727B2 (ja)
ES (1) ES355847A1 (ja)
FR (1) FR1574319A (ja)
GB (1) GB1233083A (ja)
NL (1) NL6709523A (ja)
SE (1) SE330415B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4085038A (en) * 1976-12-15 1978-04-18 Western Electric Co., Inc. Methods of and apparatus for sorting parts of a separated article
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
EP0363548B1 (en) * 1988-10-10 1994-03-23 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
US6228685B1 (en) 1994-07-07 2001-05-08 Tessera, Inc. Framed sheet processing
US6541852B2 (en) 1994-07-07 2003-04-01 Tessera, Inc. Framed sheets
US5668062A (en) * 1995-08-23 1997-09-16 Texas Instruments Incorporated Method for processing semiconductor wafer with reduced particle contamination during saw
US6182546B1 (en) 1997-03-04 2001-02-06 Tessera, Inc. Apparatus and methods for separating microelectronic packages from a common substrate
US6217972B1 (en) 1997-10-17 2001-04-17 Tessera, Inc. Enhancements in framed sheet processing
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
NL284964A (ja) * 1961-11-10 1900-01-01
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
US3384279A (en) * 1966-08-23 1968-05-21 Western Electric Co Methods of severing brittle material along prescribed lines

Also Published As

Publication number Publication date
FR1574319A (ja) 1969-07-11
US3537169A (en) 1970-11-03
DE1752727A1 (de) 1971-05-19
SE330415B (ja) 1970-11-16
ES355847A1 (es) 1970-01-01
AT296389B (de) 1972-02-10
DE1752727B2 (de) 1972-05-10
CH483726A (de) 1969-12-31
BE717795A (ja) 1969-01-08
GB1233083A (ja) 1971-05-26

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