NL6709523A - - Google Patents

Info

Publication number
NL6709523A
NL6709523A NL6709523A NL6709523A NL6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A NL 6709523 A NL6709523 A NL 6709523A
Authority
NL
Netherlands
Application number
NL6709523A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6709523A priority Critical patent/NL6709523A/xx
Priority to US742250A priority patent/US3537169A/en
Priority to DE19681752727 priority patent/DE1752727B2/de
Priority to SE09339/68A priority patent/SE330415B/xx
Priority to AT648268A priority patent/AT296389B/de
Priority to CH1008368A priority patent/CH483726A/de
Priority to GB1233083D priority patent/GB1233083A/en
Priority to ES355847A priority patent/ES355847A1/es
Priority to BE717795D priority patent/BE717795A/xx
Priority to FR1574319D priority patent/FR1574319A/fr
Publication of NL6709523A publication Critical patent/NL6709523A/xx

Links

Classifications

    • H10P72/0442—
    • H10P52/00—
    • H10P72/0428—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
NL6709523A 1967-07-08 1967-07-08 NL6709523A (cg-RX-API-DMAC10.html)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL6709523A NL6709523A (cg-RX-API-DMAC10.html) 1967-07-08 1967-07-08
US742250A US3537169A (en) 1967-07-08 1968-07-03 Method of severing a semiconductor wafer
DE19681752727 DE1752727B2 (de) 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe
SE09339/68A SE330415B (cg-RX-API-DMAC10.html) 1967-07-08 1968-07-05
AT648268A AT296389B (de) 1967-07-08 1968-07-05 Verfahren und Vorrichtung zum Zerlegen einer Halbleiterscheibe
CH1008368A CH483726A (de) 1967-07-08 1968-07-05 Verfahren zum Zerlegen einer Halbleiterscheibe
GB1233083D GB1233083A (cg-RX-API-DMAC10.html) 1967-07-08 1968-07-05
ES355847A ES355847A1 (es) 1967-07-08 1968-07-06 Metodo para separar una oblea semiconductora.
BE717795D BE717795A (cg-RX-API-DMAC10.html) 1967-07-08 1968-07-08
FR1574319D FR1574319A (cg-RX-API-DMAC10.html) 1967-07-08 1968-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6709523A NL6709523A (cg-RX-API-DMAC10.html) 1967-07-08 1967-07-08

Publications (1)

Publication Number Publication Date
NL6709523A true NL6709523A (cg-RX-API-DMAC10.html) 1969-01-10

Family

ID=19800665

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6709523A NL6709523A (cg-RX-API-DMAC10.html) 1967-07-08 1967-07-08

Country Status (10)

Country Link
US (1) US3537169A (cg-RX-API-DMAC10.html)
AT (1) AT296389B (cg-RX-API-DMAC10.html)
BE (1) BE717795A (cg-RX-API-DMAC10.html)
CH (1) CH483726A (cg-RX-API-DMAC10.html)
DE (1) DE1752727B2 (cg-RX-API-DMAC10.html)
ES (1) ES355847A1 (cg-RX-API-DMAC10.html)
FR (1) FR1574319A (cg-RX-API-DMAC10.html)
GB (1) GB1233083A (cg-RX-API-DMAC10.html)
NL (1) NL6709523A (cg-RX-API-DMAC10.html)
SE (1) SE330415B (cg-RX-API-DMAC10.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US3920168A (en) * 1975-01-15 1975-11-18 Barrie F Regan Apparatus for breaking semiconductor wafers
US4085038A (en) * 1976-12-15 1978-04-18 Western Electric Co., Inc. Methods of and apparatus for sorting parts of a separated article
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
DE3888685T2 (de) * 1988-10-10 1994-10-20 Ibm Verfahren zum Brechen eines plattenförmigen Werkstücks, insbesondere eines Halbleiterplättchens, und Vorrichtung zum Brechen des genannten zwischen zwei Folien sandwichartig angeordneten Werkstücks.
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
US6228685B1 (en) 1994-07-07 2001-05-08 Tessera, Inc. Framed sheet processing
US6541852B2 (en) 1994-07-07 2003-04-01 Tessera, Inc. Framed sheets
US5668062A (en) * 1995-08-23 1997-09-16 Texas Instruments Incorporated Method for processing semiconductor wafer with reduced particle contamination during saw
US6182546B1 (en) 1997-03-04 2001-02-06 Tessera, Inc. Apparatus and methods for separating microelectronic packages from a common substrate
US6217972B1 (en) 1997-10-17 2001-04-17 Tessera, Inc. Enhancements in framed sheet processing
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
NL284964A (cg-RX-API-DMAC10.html) * 1961-11-10 1900-01-01
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
US3384279A (en) * 1966-08-23 1968-05-21 Western Electric Co Methods of severing brittle material along prescribed lines

Also Published As

Publication number Publication date
BE717795A (cg-RX-API-DMAC10.html) 1969-01-08
AT296389B (de) 1972-02-10
CH483726A (de) 1969-12-31
DE1752727A1 (de) 1971-05-19
SE330415B (cg-RX-API-DMAC10.html) 1970-11-16
ES355847A1 (es) 1970-01-01
GB1233083A (cg-RX-API-DMAC10.html) 1971-05-26
DE1752727B2 (de) 1972-05-10
US3537169A (en) 1970-11-03
FR1574319A (cg-RX-API-DMAC10.html) 1969-07-11

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