NL6705522A - - Google Patents

Info

Publication number
NL6705522A
NL6705522A NL6705522A NL6705522A NL6705522A NL 6705522 A NL6705522 A NL 6705522A NL 6705522 A NL6705522 A NL 6705522A NL 6705522 A NL6705522 A NL 6705522A NL 6705522 A NL6705522 A NL 6705522A
Authority
NL
Netherlands
Application number
NL6705522A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6705522A priority Critical patent/NL6705522A/xx
Priority to DE19681704881 priority patent/DE1704881A1/de
Priority to GB1815568A priority patent/GB1210175A/en
Priority to AT372768A priority patent/AT281957B/de
Priority to BE713873D priority patent/BE713873A/xx
Priority to FR1567363D priority patent/FR1567363A/fr
Publication of NL6705522A publication Critical patent/NL6705522A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
NL6705522A 1967-04-20 1967-04-20 NL6705522A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL6705522A NL6705522A (nl) 1967-04-20 1967-04-20
DE19681704881 DE1704881A1 (de) 1967-04-20 1968-03-01 Verfahren zur Herstellung einer Platte mit flaechenhafter Verdrahtung
GB1815568A GB1210175A (en) 1967-04-20 1968-04-17 Printed wiring panels
AT372768A AT281957B (de) 1967-04-20 1968-04-17 Verfahren zur Herstellung einer Platte mit flächenhafter Verdrahtung
BE713873D BE713873A (nl) 1967-04-20 1968-04-18
FR1567363D FR1567363A (nl) 1967-04-20 1968-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6705522A NL6705522A (nl) 1967-04-20 1967-04-20

Publications (1)

Publication Number Publication Date
NL6705522A true NL6705522A (nl) 1968-10-21

Family

ID=19799898

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6705522A NL6705522A (nl) 1967-04-20 1967-04-20

Country Status (6)

Country Link
AT (1) AT281957B (nl)
BE (1) BE713873A (nl)
DE (1) DE1704881A1 (nl)
FR (1) FR1567363A (nl)
GB (1) GB1210175A (nl)
NL (1) NL6705522A (nl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2473834A1 (fr) * 1980-01-11 1981-07-17 Thomson Csf Procede de soudure automatique de microcomposants sur un circuit imprime, et circuit imprime equipe ainsi realise
DE3511300C2 (de) * 1985-03-28 1987-04-02 Daimler-Benz Ag, 7000 Stuttgart Elektromagnetkupplung zur Herstellung einer Rotationsverbindung
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
JPH0325996A (ja) * 1989-06-23 1991-02-04 Nitto Boseki Co Ltd 射出成形プリント配線板用転写シート及びその製造方法
DE10230712B4 (de) 2002-07-08 2006-03-23 Siemens Ag Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger

Also Published As

Publication number Publication date
GB1210175A (en) 1970-10-28
FR1567363A (nl) 1969-05-16
AT281957B (de) 1970-06-10
BE713873A (nl) 1968-10-18
DE1704881A1 (de) 1971-05-27

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