NL6617324A - - Google Patents
Info
- Publication number
- NL6617324A NL6617324A NL6617324A NL6617324A NL6617324A NL 6617324 A NL6617324 A NL 6617324A NL 6617324 A NL6617324 A NL 6617324A NL 6617324 A NL6617324 A NL 6617324A NL 6617324 A NL6617324 A NL 6617324A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Resistance Heating (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Electrodes Of Semiconductors (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0097564 | 1965-06-11 | ||
| DES0100912 | 1965-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6617324A true NL6617324A (hr) | 1967-06-12 |
Family
ID=25998118
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6607137A NL6607137A (hr) | 1965-06-11 | 1966-05-24 | |
| NL6617324A NL6617324A (hr) | 1965-06-11 | 1966-12-09 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6607137A NL6607137A (hr) | 1965-06-11 | 1966-05-24 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US3441812A (hr) |
| BE (2) | BE681655A (hr) |
| DE (2) | DE1483298B1 (hr) |
| FR (1) | FR1504284A (hr) |
| GB (2) | GB1106287A (hr) |
| NL (2) | NL6607137A (hr) |
| SE (1) | SE321723B (hr) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3664874A (en) * | 1969-12-31 | 1972-05-23 | Nasa | Tungsten contacts on silicon substrates |
| US3989546A (en) * | 1971-05-10 | 1976-11-02 | Arco Medical Products Company | Thermoelectric generator with hinged assembly for fins |
| DE2739242C2 (de) * | 1977-08-31 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Hochleistungsstromrichter |
| AU555193B2 (en) * | 1980-11-10 | 1986-09-18 | Edwin James Freeburn | Cooling device |
| US5028988A (en) * | 1989-12-27 | 1991-07-02 | Ncr Corporation | Method and apparatus for low temperature integrated circuit chip testing and operation |
| GB9015687D0 (en) * | 1990-07-17 | 1990-09-05 | Global Domestic Prod Ltd | Peltier devices |
| WO1998025333A2 (fr) * | 1996-12-02 | 1998-06-11 | Pascal Laligant | Convertisseur de puissance a consommation reduite a partir d'une source de tres faible tension |
| US5936193A (en) * | 1997-05-09 | 1999-08-10 | Parise; Ronald J. | Nighttime solar cell |
| US20060021648A1 (en) * | 1997-05-09 | 2006-02-02 | Parise Ronald J | Device and method to transmit waste heat or thermal pollution into deep space |
| JP4446064B2 (ja) * | 2004-07-07 | 2010-04-07 | 独立行政法人産業技術総合研究所 | 熱電変換素子及び熱電変換モジュール |
| RU2515969C2 (ru) | 2007-08-21 | 2014-05-20 | Члены Правления Университета Калифорнии | Наноструктуры с высокими термоэлектрическими свойствами |
| US20110114146A1 (en) * | 2009-11-13 | 2011-05-19 | Alphabet Energy, Inc. | Uniwafer thermoelectric modules |
| US9240328B2 (en) | 2010-11-19 | 2016-01-19 | Alphabet Energy, Inc. | Arrays of long nanostructures in semiconductor materials and methods thereof |
| US8736011B2 (en) | 2010-12-03 | 2014-05-27 | Alphabet Energy, Inc. | Low thermal conductivity matrices with embedded nanostructures and methods thereof |
| US9051175B2 (en) | 2012-03-07 | 2015-06-09 | Alphabet Energy, Inc. | Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same |
| US9257627B2 (en) | 2012-07-23 | 2016-02-09 | Alphabet Energy, Inc. | Method and structure for thermoelectric unicouple assembly |
| US9082930B1 (en) | 2012-10-25 | 2015-07-14 | Alphabet Energy, Inc. | Nanostructured thermolectric elements and methods of making the same |
| WO2015157501A1 (en) | 2014-04-10 | 2015-10-15 | Alphabet Energy, Inc. | Ultra-long silicon nanostructures, and methods of forming and transferring the same |
| DE102016209683A1 (de) * | 2016-06-02 | 2017-12-07 | Mahle International Gmbh | Thermoelektrisches Modul |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH328594A (fr) * | 1954-07-03 | 1958-03-15 | Csf | Dispositif électronique comportant un élément semi-conducteur |
| NL190331A (hr) * | 1954-08-26 | 1900-01-01 | ||
| US2902392A (en) * | 1954-09-18 | 1959-09-01 | Siemens Planiawerke Ag | Work pieces for high temperature operation and method of making them |
| DE1080313B (de) * | 1954-09-18 | 1960-04-21 | Siemens Planiawerke Ag | Molybdaendisilizid enthaltende Werkstuecke fuer hohe Temperaturen, insbesondere elektrisches Heizelement |
| DE1189282B (de) * | 1954-12-28 | 1965-03-18 | Siemens Planiawerke Ag | Verwendung einer Sinterlegierung aus Kohlenstoff, Silizium und Molybdaen als Werkstoff zur Herstellung von warmfesten, elektrisch leitenden Teilen |
| NL109558C (hr) * | 1955-05-10 | 1900-01-01 | ||
| US2898743A (en) * | 1956-07-23 | 1959-08-11 | Philco Corp | Electronic cooling device and method for the fabrication thereof |
| DE1155609B (de) * | 1956-12-04 | 1963-10-10 | Union Carbide Corp | Ausgangsmaterial zur Herstellung oxydationsbestaendiger und hochtemperaturfester Gegenstaende, insbesondere selbst regenerierende Schutzueberzuege fuer Metallkoerper |
| US2952786A (en) * | 1957-04-12 | 1960-09-13 | Minnesota Mining & Mfg | Temperature compensated crystal device |
| DE1120154B (de) * | 1958-04-29 | 1961-12-21 | Union Carbide Corp | Gesinterte feuerfeste Hartmetallegierung auf der Grundlage von Molybdaendisilicid |
| US3086886A (en) * | 1958-06-04 | 1963-04-23 | Schwarzkopf Dev Co | Process of providing oxidizable refractory-metal bodies with a corrosion-resistant surface coating |
| US2955145A (en) * | 1958-07-16 | 1960-10-04 | Kanthal Ab | Thermo-electric alloys |
| SE175893C1 (hr) * | 1958-07-16 | 1961-07-04 | Kanthal Ab | |
| US2994203A (en) * | 1960-01-14 | 1961-08-01 | Westinghouse Electric Corp | Thermoelectric cooling device |
| BE638315A (hr) * | 1961-06-09 | |||
| US3256699A (en) * | 1962-01-29 | 1966-06-21 | Monsanto Co | Thermoelectric unit and process of using to interconvert heat and electrical energy |
| US3192065A (en) * | 1962-06-01 | 1965-06-29 | North American Aviation Inc | Method of forming molybdenum silicide coating on molybdenum |
| US3342567A (en) * | 1963-12-27 | 1967-09-19 | Rca Corp | Low resistance bonds to germaniumsilicon bodies and method of making such bonds |
-
1965
- 1965-06-11 DE DE19651483298 patent/DE1483298B1/de active Pending
- 1965-12-11 DE DE19651489283 patent/DE1489283B2/de active Pending
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1966
- 1966-05-24 NL NL6607137A patent/NL6607137A/xx unknown
- 1966-05-26 BE BE681655D patent/BE681655A/xx unknown
- 1966-06-13 GB GB26335/66A patent/GB1106287A/en not_active Expired
- 1966-12-07 BE BE690811D patent/BE690811A/xx unknown
- 1966-12-07 US US599934A patent/US3441812A/en not_active Expired - Lifetime
- 1966-12-09 SE SE16915/66A patent/SE321723B/xx unknown
- 1966-12-09 NL NL6617324A patent/NL6617324A/xx unknown
- 1966-12-09 FR FR86935A patent/FR1504284A/fr not_active Expired
- 1966-12-12 GB GB55640/66A patent/GB1106260A/en not_active Expired
-
1969
- 1969-06-09 US US834595A patent/US3523832A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US3441812A (en) | 1969-04-29 |
| DE1489283A1 (de) | 1970-02-26 |
| BE681655A (hr) | 1966-10-31 |
| GB1106260A (en) | 1968-03-13 |
| DE1489283B2 (de) | 1970-10-15 |
| BE690811A (hr) | 1967-05-16 |
| NL6607137A (hr) | 1966-12-12 |
| SE321723B (hr) | 1970-03-16 |
| FR1504284A (fr) | 1967-12-01 |
| GB1106287A (en) | 1968-03-13 |
| DE1483298B1 (de) | 1971-01-28 |
| US3523832A (en) | 1970-08-11 |