BE690811A - - Google Patents
Info
- Publication number
- BE690811A BE690811A BE690811DA BE690811A BE 690811 A BE690811 A BE 690811A BE 690811D A BE690811D A BE 690811DA BE 690811 A BE690811 A BE 690811A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Resistance Heating (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Electrodes Of Semiconductors (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0097564 | 1965-06-11 | ||
| DES0100912 | 1965-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE690811A true BE690811A (xx) | 1967-05-16 |
Family
ID=25998118
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE681655D BE681655A (xx) | 1965-06-11 | 1966-05-26 | |
| BE690811D BE690811A (xx) | 1965-06-11 | 1966-12-07 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE681655D BE681655A (xx) | 1965-06-11 | 1966-05-26 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US3441812A (xx) |
| BE (2) | BE681655A (xx) |
| DE (2) | DE1483298B1 (xx) |
| FR (1) | FR1504284A (xx) |
| GB (2) | GB1106287A (xx) |
| NL (2) | NL6607137A (xx) |
| SE (1) | SE321723B (xx) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3664874A (en) * | 1969-12-31 | 1972-05-23 | Nasa | Tungsten contacts on silicon substrates |
| US3989546A (en) * | 1971-05-10 | 1976-11-02 | Arco Medical Products Company | Thermoelectric generator with hinged assembly for fins |
| DE2739242C2 (de) * | 1977-08-31 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Hochleistungsstromrichter |
| AU555193B2 (en) * | 1980-11-10 | 1986-09-18 | Edwin James Freeburn | Cooling device |
| US5028988A (en) * | 1989-12-27 | 1991-07-02 | Ncr Corporation | Method and apparatus for low temperature integrated circuit chip testing and operation |
| GB9015687D0 (en) * | 1990-07-17 | 1990-09-05 | Global Domestic Prod Ltd | Peltier devices |
| JP2002518989A (ja) * | 1996-12-02 | 2002-06-25 | ラリガン，パスカル | わずかな温度差から低消費電力の自立型装置に電気を供給することを可能にする熱出力変換器 |
| US5936193A (en) * | 1997-05-09 | 1999-08-10 | Parise; Ronald J. | Nighttime solar cell |
| US20060021648A1 (en) * | 1997-05-09 | 2006-02-02 | Parise Ronald J | Device and method to transmit waste heat or thermal pollution into deep space |
| JP4446064B2 (ja) * | 2004-07-07 | 2010-04-07 | 独立行政法人産業技術総合研究所 | 熱電変換素子及び熱電変換モジュール |
| KR20100056478A (ko) | 2007-08-21 | 2010-05-27 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | 고성능 열전 속성을 갖는 나노구조체 |
| US20110114146A1 (en) * | 2009-11-13 | 2011-05-19 | Alphabet Energy, Inc. | Uniwafer thermoelectric modules |
| US9240328B2 (en) | 2010-11-19 | 2016-01-19 | Alphabet Energy, Inc. | Arrays of long nanostructures in semiconductor materials and methods thereof |
| US8736011B2 (en) | 2010-12-03 | 2014-05-27 | Alphabet Energy, Inc. | Low thermal conductivity matrices with embedded nanostructures and methods thereof |
| US9051175B2 (en) | 2012-03-07 | 2015-06-09 | Alphabet Energy, Inc. | Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same |
| US9257627B2 (en) | 2012-07-23 | 2016-02-09 | Alphabet Energy, Inc. | Method and structure for thermoelectric unicouple assembly |
| US9082930B1 (en) | 2012-10-25 | 2015-07-14 | Alphabet Energy, Inc. | Nanostructured thermolectric elements and methods of making the same |
| WO2015157501A1 (en) | 2014-04-10 | 2015-10-15 | Alphabet Energy, Inc. | Ultra-long silicon nanostructures, and methods of forming and transferring the same |
| DE102016209683A1 (de) * | 2016-06-02 | 2017-12-07 | Mahle International Gmbh | Thermoelektrisches Modul |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH328594A (fr) * | 1954-07-03 | 1958-03-15 | Csf | Dispositif électronique comportant un élément semi-conducteur |
| NL98125C (xx) * | 1954-08-26 | 1900-01-01 | ||
| DE1080313B (de) * | 1954-09-18 | 1960-04-21 | Siemens Planiawerke Ag | Molybdaendisilizid enthaltende Werkstuecke fuer hohe Temperaturen, insbesondere elektrisches Heizelement |
| US2902392A (en) * | 1954-09-18 | 1959-09-01 | Siemens Planiawerke Ag | Work pieces for high temperature operation and method of making them |
| DE1189282B (de) * | 1954-12-28 | 1965-03-18 | Siemens Planiawerke Ag | Verwendung einer Sinterlegierung aus Kohlenstoff, Silizium und Molybdaen als Werkstoff zur Herstellung von warmfesten, elektrisch leitenden Teilen |
| BE547698A (xx) * | 1955-05-10 | 1900-01-01 | ||
| US2898743A (en) * | 1956-07-23 | 1959-08-11 | Philco Corp | Electronic cooling device and method for the fabrication thereof |
| DE1155609B (de) * | 1956-12-04 | 1963-10-10 | Union Carbide Corp | Ausgangsmaterial zur Herstellung oxydationsbestaendiger und hochtemperaturfester Gegenstaende, insbesondere selbst regenerierende Schutzueberzuege fuer Metallkoerper |
| US2952786A (en) * | 1957-04-12 | 1960-09-13 | Minnesota Mining & Mfg | Temperature compensated crystal device |
| DE1120154B (de) * | 1958-04-29 | 1961-12-21 | Union Carbide Corp | Gesinterte feuerfeste Hartmetallegierung auf der Grundlage von Molybdaendisilicid |
| US3086886A (en) * | 1958-06-04 | 1963-04-23 | Schwarzkopf Dev Co | Process of providing oxidizable refractory-metal bodies with a corrosion-resistant surface coating |
| SE175893C1 (xx) * | 1958-07-16 | 1961-07-04 | Kanthal Ab | |
| US2955145A (en) * | 1958-07-16 | 1960-10-04 | Kanthal Ab | Thermo-electric alloys |
| US2994203A (en) * | 1960-01-14 | 1961-08-01 | Westinghouse Electric Corp | Thermoelectric cooling device |
| BE638315A (xx) * | 1961-06-09 | |||
| US3256699A (en) * | 1962-01-29 | 1966-06-21 | Monsanto Co | Thermoelectric unit and process of using to interconvert heat and electrical energy |
| US3192065A (en) * | 1962-06-01 | 1965-06-29 | North American Aviation Inc | Method of forming molybdenum silicide coating on molybdenum |
| US3342567A (en) * | 1963-12-27 | 1967-09-19 | Rca Corp | Low resistance bonds to germaniumsilicon bodies and method of making such bonds |
-
1965
- 1965-06-11 DE DE19651483298 patent/DE1483298B1/de active Pending
- 1965-12-11 DE DE19651489283 patent/DE1489283B2/de active Pending
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1966
- 1966-05-24 NL NL6607137A patent/NL6607137A/xx unknown
- 1966-05-26 BE BE681655D patent/BE681655A/xx unknown
- 1966-06-13 GB GB26335/66A patent/GB1106287A/en not_active Expired
- 1966-12-07 US US599934A patent/US3441812A/en not_active Expired - Lifetime
- 1966-12-07 BE BE690811D patent/BE690811A/xx unknown
- 1966-12-09 NL NL6617324A patent/NL6617324A/xx unknown
- 1966-12-09 FR FR86935A patent/FR1504284A/fr not_active Expired
- 1966-12-09 SE SE16915/66A patent/SE321723B/xx unknown
- 1966-12-12 GB GB55640/66A patent/GB1106260A/en not_active Expired
-
1969
- 1969-06-09 US US834595A patent/US3523832A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE1489283A1 (de) | 1970-02-26 |
| SE321723B (xx) | 1970-03-16 |
| FR1504284A (fr) | 1967-12-01 |
| GB1106287A (en) | 1968-03-13 |
| BE681655A (xx) | 1966-10-31 |
| GB1106260A (en) | 1968-03-13 |
| US3441812A (en) | 1969-04-29 |
| NL6607137A (xx) | 1966-12-12 |
| NL6617324A (xx) | 1967-06-12 |
| US3523832A (en) | 1970-08-11 |
| DE1483298B1 (de) | 1971-01-28 |
| DE1489283B2 (de) | 1970-10-15 |