NL6613526A - - Google Patents

Info

Publication number
NL6613526A
NL6613526A NL6613526A NL6613526A NL6613526A NL 6613526 A NL6613526 A NL 6613526A NL 6613526 A NL6613526 A NL 6613526A NL 6613526 A NL6613526 A NL 6613526A NL 6613526 A NL6613526 A NL 6613526A
Authority
NL
Netherlands
Application number
NL6613526A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6613526A priority Critical patent/NL6613526A/xx
Priority to DE19671586838 priority patent/DE1586838A1/de
Priority to US670388A priority patent/US3472365A/en
Publication of NL6613526A publication Critical patent/NL6613526A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/10—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/82—Separable, striplike plural articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
NL6613526A 1966-09-26 1966-09-26 NL6613526A (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
NL6613526A NL6613526A (de) 1966-09-26 1966-09-26
DE19671586838 DE1586838A1 (de) 1966-09-26 1967-09-25 Gebrauchsverpackung fuer aus Metallplatten gestanzte kleinformatige Gegenstaende
US670388A US3472365A (en) 1966-09-26 1967-09-25 Utility packing for small-sized objects,punched from metal sheets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6613526A NL6613526A (de) 1966-09-26 1966-09-26

Publications (1)

Publication Number Publication Date
NL6613526A true NL6613526A (de) 1968-03-27

Family

ID=19797759

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6613526A NL6613526A (de) 1966-09-26 1966-09-26

Country Status (3)

Country Link
US (1) US3472365A (de)
DE (1) DE1586838A1 (de)
NL (1) NL6613526A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439644A1 (fr) * 1978-10-24 1980-05-23 Bendix Corp Support de charges de soudure et procede de fabrication de celui-ci

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2092710B1 (de) * 1970-06-10 1975-01-10 Nief Louis
DE2538239C3 (de) * 1975-08-28 1978-08-17 L. Schuler Gmbh, 7320 Goeppingen Vorrichtung zum Fördern von ausgestanzten Teilen
JPS5847270B2 (ja) * 1978-07-21 1983-10-21 富士電機株式会社 ろう付け品の製造方法
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4655382A (en) * 1985-11-12 1987-04-07 Raychem Corp. Materials for use in forming electronic interconnect
DE3608101A1 (de) * 1986-03-12 1987-09-17 Metallgesellschaft Ag Lottraeger
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
EP0316106A1 (de) * 1987-11-10 1989-05-17 Ormco Corporation Spender für orthodontische Spannvorrichtungen
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
JPH03205024A (ja) * 1990-01-04 1991-09-06 Topcon Corp 瞬き検出装置
US5341980A (en) * 1990-02-19 1994-08-30 Hitachi, Ltd. Method of fabricating electronic circuit device and apparatus for performing the same method
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5673846A (en) 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
DE19535971A1 (de) * 1995-09-27 1997-04-10 Fraunhofer Ges Forschung Magazin für die Fixierung von Kleinteilen
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
DE19709136A1 (de) * 1997-03-06 1998-09-10 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung und Magazinierung von Mikrobauteilen, Magazin und Montageverfahren für Mikrobauteile
US6710454B1 (en) 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
DE102004013688A1 (de) * 2004-03-18 2005-10-06 Behr Gmbh & Co. Kg Lotfolien zum Löten von Bauteilen, insbesondere Platten von Wärmeübertragern
WO2005120765A1 (ja) * 2004-06-08 2005-12-22 Senju Metal Industry Co., Ltd 高融点金属粒分散フォームソルダの製造方法
WO2007032429A1 (ja) * 2005-09-15 2007-03-22 Senju Metal Industry Co., Ltd. フォームはんだとその製造方法
US10081852B2 (en) * 2005-09-15 2018-09-25 Senju Metal Industry Co., Ltd. Solder preform and a process for its manufacture
WO2009054911A2 (en) * 2007-10-19 2009-04-30 Porex Corporation Oriented molded articles and methods of making and using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1072551B (de) * 1960-06-02 München Hanns Balzer Zündsteinverpackung
US1375479A (en) * 1918-09-21 1921-04-19 Baker & Co Inc Package for dental solder and the like
US2027667A (en) * 1934-03-03 1936-01-14 Seaver Brinkman Gerstenberger Holding device
US2815121A (en) * 1954-06-09 1957-12-03 Makatag Machine Corp Tag patch supply
US3211284A (en) * 1962-07-23 1965-10-12 Edgar P Anstett Nailing strip
US3327089A (en) * 1963-10-14 1967-06-20 Lattner Bros Machining Co Perforated tape reel feeder for weld studs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439644A1 (fr) * 1978-10-24 1980-05-23 Bendix Corp Support de charges de soudure et procede de fabrication de celui-ci

Also Published As

Publication number Publication date
DE1586838A1 (de) 1970-09-10
US3472365A (en) 1969-10-14

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