NL6604965A - - Google Patents

Info

Publication number
NL6604965A
NL6604965A NL6604965A NL6604965A NL6604965A NL 6604965 A NL6604965 A NL 6604965A NL 6604965 A NL6604965 A NL 6604965A NL 6604965 A NL6604965 A NL 6604965A NL 6604965 A NL6604965 A NL 6604965A
Authority
NL
Netherlands
Application number
NL6604965A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6604965A priority Critical patent/NL6604965A/xx
Priority to NL6604964A priority patent/NL6604964A/xx
Priority to NL6704097A priority patent/NL6704097A/xx
Priority to GB1656667A priority patent/GB1175122A/en
Priority to CH509067A priority patent/CH476396A/de
Priority to DK199267A priority patent/DK117909B/da
Priority to DE1967N0030311 priority patent/DE1614236B2/de
Priority to AT341867A priority patent/AT275607B/de
Priority to ES339180A priority patent/ES339180A0/es
Priority to US3476990D priority patent/US3476990A/en
Priority to SE508267A priority patent/SE342359B/xx
Priority to BR18857967A priority patent/BR6788579D0/pt
Priority to FR102840A priority patent/FR1524436A/fr
Priority to BE697075D priority patent/BE697075A/xx
Publication of NL6604965A publication Critical patent/NL6604965A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/4805—Shape
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)
NL6604965A 1966-04-14 1966-04-14 NL6604965A (fr)

Priority Applications (14)

Application Number Priority Date Filing Date Title
NL6604965A NL6604965A (fr) 1966-04-14 1966-04-14
NL6604964A NL6604964A (fr) 1966-04-14 1966-04-14
NL6704097A NL6704097A (fr) 1966-04-14 1967-03-18
GB1656667A GB1175122A (en) 1966-04-14 1967-04-11 Improvements in and relating to Semiconductor Devices
CH509067A CH476396A (de) 1966-04-14 1967-04-11 Halbleitervorrichtung und Verfahren zum Betrieb der Halbleitervorrichtung
DK199267A DK117909B (da) 1966-04-14 1967-04-11 Halvlederapparat.
DE1967N0030311 DE1614236B2 (de) 1966-04-14 1967-04-11 Halbleiteranordnung
AT341867A AT275607B (de) 1966-04-14 1967-04-11 Halbleitervorrichtung und Schaltung mit einer Halbleitervorrichtung
ES339180A ES339180A0 (es) 1966-04-14 1967-04-12 Un dispositivo semiconductor.
US3476990D US3476990A (en) 1966-04-14 1967-04-12 Housing and lead structure for high frequency semiconductor device operation
SE508267A SE342359B (fr) 1966-04-14 1967-04-12
BR18857967A BR6788579D0 (pt) 1966-04-14 1967-04-13 Um dispositivo semi-condutor
FR102840A FR1524436A (fr) 1966-04-14 1967-04-14 Dispositif semi-conducteur et circuit équipé d'un tel dispositif
BE697075D BE697075A (fr) 1966-04-14 1967-04-14

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6604964A NL6604964A (fr) 1966-04-14 1966-04-14
NL6604965A NL6604965A (fr) 1966-04-14 1966-04-14
NL6704097A NL6704097A (fr) 1966-04-14 1967-03-18

Publications (1)

Publication Number Publication Date
NL6604965A true NL6604965A (fr) 1967-10-16

Family

ID=27351363

Family Applications (3)

Application Number Title Priority Date Filing Date
NL6604965A NL6604965A (fr) 1966-04-14 1966-04-14
NL6604964A NL6604964A (fr) 1966-04-14 1966-04-14
NL6704097A NL6704097A (fr) 1966-04-14 1967-03-18

Family Applications After (2)

Application Number Title Priority Date Filing Date
NL6604964A NL6604964A (fr) 1966-04-14 1966-04-14
NL6704097A NL6704097A (fr) 1966-04-14 1967-03-18

Country Status (11)

Country Link
US (1) US3476990A (fr)
AT (1) AT275607B (fr)
BE (1) BE697075A (fr)
BR (1) BR6788579D0 (fr)
CH (1) CH476396A (fr)
DE (1) DE1614236B2 (fr)
DK (1) DK117909B (fr)
ES (1) ES339180A0 (fr)
GB (1) GB1175122A (fr)
NL (3) NL6604965A (fr)
SE (1) SE342359B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
GB2150747B (en) * 1983-12-02 1987-04-23 Philips Electronic Associated Pyroelectric infra-red radiation detector
EP0439652A1 (fr) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Transistor SMD de haute fréquence avec deux connexions d'émetteur
EP0439653A1 (fr) * 1990-01-31 1991-08-07 Siemens Aktiengesellschaft Transistor SMD de haute fréquence avec deux connexions d'émetteur
DE59010921D1 (de) * 1990-01-31 2001-06-21 Infineon Technologies Ag Chipträger für ein Mikrowellen-Halbleiterbauelement
JP3913574B2 (ja) * 2002-02-27 2007-05-09 三洋電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903630A (en) * 1956-09-21 1959-09-08 Rca Corp Semiconductor devices
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3264712A (en) * 1962-06-04 1966-08-09 Nippon Electric Co Semiconductor devices

Also Published As

Publication number Publication date
ES339180A0 (es) 1968-04-16
US3476990A (en) 1969-11-04
NL6704097A (fr) 1968-09-19
GB1175122A (en) 1969-12-23
CH476396A (de) 1969-07-31
DE1614236A1 (de) 1970-08-20
AT275607B (de) 1969-10-27
NL6604964A (fr) 1967-10-16
DK117909B (da) 1970-06-15
BR6788579D0 (pt) 1973-12-27
DE1614236B2 (de) 1977-06-08
BE697075A (fr) 1967-10-16
SE342359B (fr) 1972-01-31

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