NL6602549A - - Google Patents
Info
- Publication number
- NL6602549A NL6602549A NL6602549A NL6602549A NL6602549A NL 6602549 A NL6602549 A NL 6602549A NL 6602549 A NL6602549 A NL 6602549A NL 6602549 A NL6602549 A NL 6602549A NL 6602549 A NL6602549 A NL 6602549A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H10P95/00—
-
- H10P14/47—
-
- H10W20/40—
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- H10W72/012—
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- H10W70/05—
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- H10W72/019—
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- H10W72/244—
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- H10W72/922—
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- H10W72/9445—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43591865A | 1965-03-01 | 1965-03-01 | |
| US511780A US3408271A (en) | 1965-03-01 | 1965-12-06 | Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6602549A true NL6602549A (en:Method) | 1966-09-02 |
Family
ID=27030742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6602549A NL6602549A (en:Method) | 1965-03-01 | 1966-02-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3408271A (en:Method) |
| DE (1) | DE1564066B2 (en:Method) |
| GB (1) | GB1100718A (en:Method) |
| NL (1) | NL6602549A (en:Method) |
| SE (1) | SE316238B (en:Method) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1175667A (en) * | 1966-04-07 | 1969-12-23 | Associated Semiconductor Mft | Improvements in the Electrodeposition of Metals using a Composite Mask |
| US3484341A (en) * | 1966-09-07 | 1969-12-16 | Itt | Electroplated contacts for semiconductor devices |
| NL6701136A (en:Method) * | 1967-01-25 | 1968-07-26 | ||
| US3623961A (en) * | 1968-01-12 | 1971-11-30 | Philips Corp | Method of providing an electric connection to a surface of an electronic device and device obtained by said method |
| US3625837A (en) * | 1969-09-18 | 1971-12-07 | Singer Co | Electroplating solder-bump connectors on microcircuits |
| GB1337283A (en) * | 1969-12-26 | 1973-11-14 | Hitachi Ltd | Method of manufacturing a semiconductor device |
| US4113578A (en) * | 1973-05-31 | 1978-09-12 | Honeywell Inc. | Microcircuit device metallization |
| US4011143A (en) * | 1973-06-25 | 1977-03-08 | Honeywell Inc. | Material deposition masking for microcircuit structures |
| US3987226A (en) * | 1974-11-27 | 1976-10-19 | The Bendix Corporation | Face plate for an acoustical optical image tube |
| JPH03142934A (ja) * | 1989-10-30 | 1991-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置の配線接続構造 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2834723A (en) * | 1953-12-31 | 1958-05-13 | Northern Engraving & Mfg Co | Method of electroplating printed circuits |
| US2861029A (en) * | 1955-12-14 | 1958-11-18 | Western Electric Co | Methods of making printed wiring circuits |
| US3253320A (en) * | 1959-02-25 | 1966-05-31 | Transitron Electronic Corp | Method of making semi-conductor devices with plated area |
| US3208921A (en) * | 1962-01-02 | 1965-09-28 | Sperry Rand Corp | Method for making printed circuit boards |
| NL287926A (en:Method) * | 1962-01-19 | 1900-01-01 |
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1965
- 1965-12-06 US US511780A patent/US3408271A/en not_active Expired - Lifetime
-
1966
- 1966-02-04 GB GB5010/66A patent/GB1100718A/en not_active Expired
- 1966-02-21 DE DE1564066A patent/DE1564066B2/de active Pending
- 1966-02-25 NL NL6602549A patent/NL6602549A/xx unknown
- 1966-02-28 SE SE2605/66A patent/SE316238B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3408271A (en) | 1968-10-29 |
| DE1564066A1 (de) | 1970-01-15 |
| DE1564066B2 (de) | 1974-07-04 |
| SE316238B (en:Method) | 1969-10-20 |
| GB1100718A (en) | 1968-01-24 |