NL303035A - - Google Patents
Info
- Publication number
- NL303035A NL303035A NL303035DA NL303035A NL 303035 A NL303035 A NL 303035A NL 303035D A NL303035D A NL 303035DA NL 303035 A NL303035 A NL 303035A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US256631A US3300340A (en) | 1963-02-06 | 1963-02-06 | Bonded contacts for gold-impregnated semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL303035A true NL303035A (cg-RX-API-DMAC7.html) | 1900-01-01 |
Family
ID=22972956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL303035D NL303035A (cg-RX-API-DMAC7.html) | 1963-02-06 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3300340A (cg-RX-API-DMAC7.html) |
| BE (1) | BE643429A (cg-RX-API-DMAC7.html) |
| CH (1) | CH431727A (cg-RX-API-DMAC7.html) |
| DE (1) | DE1236081B (cg-RX-API-DMAC7.html) |
| GB (1) | GB1010398A (cg-RX-API-DMAC7.html) |
| NL (1) | NL303035A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2051687A1 (cg-RX-API-DMAC7.html) * | 1969-07-11 | 1971-04-09 | Rca Corp |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1313871A (en) * | 1970-03-16 | 1973-04-18 | Mullard Ltd | Semiconductor devices |
| DE2044494B2 (de) * | 1970-09-08 | 1972-01-13 | Siemens AG, 1000 Berlin u 8000 München | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik |
| US3949120A (en) * | 1970-12-02 | 1976-04-06 | Robert Bosch G.M.B.H. | Method of making high speed silicon switching diodes |
| US3830657A (en) * | 1971-06-30 | 1974-08-20 | Ibm | Method for making integrated circuit contact structure |
| US3968272A (en) * | 1974-01-25 | 1976-07-06 | Microwave Associates, Inc. | Zero-bias Schottky barrier detector diodes |
| US4065588A (en) * | 1975-11-20 | 1977-12-27 | Rca Corporation | Method of making gold-cobalt contact for silicon devices |
| JPS5915376B2 (ja) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | 電子回路部品 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2736847A (en) * | 1954-05-10 | 1956-02-28 | Hughes Aircraft Co | Fused-junction silicon diodes |
| NL97268C (cg-RX-API-DMAC7.html) * | 1955-04-22 | 1900-01-01 | ||
| AT197436B (de) * | 1955-06-13 | 1958-04-25 | Philips Nv | Verfahren zum Anbringen eines Kontaktes auf Silizium |
| NL251064A (cg-RX-API-DMAC7.html) * | 1955-11-04 | |||
| DE1058632B (de) * | 1955-12-03 | 1959-06-04 | Deutsche Bundespost | Verfahren zur beliebigen Verringerung des Sperrwiderstandes einer Legierungs-elektrode von Halbleiteranordnungen |
| BE564212A (cg-RX-API-DMAC7.html) * | 1957-01-25 | |||
| US2957112A (en) * | 1957-12-09 | 1960-10-18 | Westinghouse Electric Corp | Treatment of tantalum semiconductor electrodes |
| BE575275A (cg-RX-API-DMAC7.html) * | 1958-02-03 | 1900-01-01 | ||
| NL125999C (cg-RX-API-DMAC7.html) * | 1958-07-17 | |||
| NL241982A (cg-RX-API-DMAC7.html) * | 1958-08-13 | 1900-01-01 | ||
| NL243218A (cg-RX-API-DMAC7.html) * | 1958-12-24 | |||
| US3196325A (en) * | 1960-02-16 | 1965-07-20 | Microwave Ass | Electrode connection to mesa type semiconductor device |
| US3171067A (en) * | 1960-02-19 | 1965-02-23 | Texas Instruments Inc | Base washer contact for transistor and method of fabricating same |
| US3214654A (en) * | 1961-02-01 | 1965-10-26 | Rca Corp | Ohmic contacts to iii-v semiconductive compound bodies |
| US3169304A (en) * | 1961-06-22 | 1965-02-16 | Giannini Controls Corp | Method of forming an ohmic semiconductor contact |
| US3132408A (en) * | 1962-01-18 | 1964-05-12 | Gen Electric | Method of making semiconductor strain sensitive devices |
-
0
- NL NL303035D patent/NL303035A/xx unknown
-
1963
- 1963-02-06 US US256631A patent/US3300340A/en not_active Expired - Lifetime
-
1964
- 1964-01-29 DE DEST21617A patent/DE1236081B/de active Pending
- 1964-01-31 GB GB4205/64A patent/GB1010398A/en not_active Expired
- 1964-02-05 CH CH133564A patent/CH431727A/de unknown
- 1964-02-06 BE BE643429D patent/BE643429A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2051687A1 (cg-RX-API-DMAC7.html) * | 1969-07-11 | 1971-04-09 | Rca Corp |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1236081B (de) | 1967-03-09 |
| BE643429A (cg-RX-API-DMAC7.html) | 1964-08-06 |
| US3300340A (en) | 1967-01-24 |
| CH431727A (de) | 1967-03-15 |
| GB1010398A (en) | 1965-11-17 |