NL302444A - - Google Patents
Info
- Publication number
- NL302444A NL302444A NL302444DA NL302444A NL 302444 A NL302444 A NL 302444A NL 302444D A NL302444D A NL 302444DA NL 302444 A NL302444 A NL 302444A
- Authority
- NL
- Netherlands
Links
Classifications
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- H10W72/20—
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- H10P95/00—
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- H10W70/481—
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- H10W72/00—
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- H10W90/00—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45639—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H10W72/536—
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- H10W72/552—
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- H10W72/5525—
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- H10W72/555—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1963S0086552 DE1439272B2 (de) | 1963-08-05 | 1963-08-05 | Verfahren zum gleichzeitigen herstellen einer groesseren anzahl von halbleitergleichrichteranordnungen mit einem oder mehreren halbleiterkoerpern |
| GB5247165A GB1057965A (en) | 1963-08-05 | 1965-12-10 | A method of manufacturing semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL302444A true NL302444A (cg-RX-API-DMAC10.html) | 1900-01-01 |
Family
ID=25997336
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL302444D NL302444A (cg-RX-API-DMAC10.html) | 1963-08-05 | ||
| NL302444A NL142279B (nl) | 1963-08-05 | 1963-12-23 | Werkwijze voor het vervaardigen van halfgeleiderinrichtingen en halfgeleiderinrichting vervaardigd onder toepassing van de werkwijze. |
| NL6617291A NL6617291A (cg-RX-API-DMAC10.html) | 1963-08-05 | 1966-12-09 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL302444A NL142279B (nl) | 1963-08-05 | 1963-12-23 | Werkwijze voor het vervaardigen van halfgeleiderinrichtingen en halfgeleiderinrichting vervaardigd onder toepassing van de werkwijze. |
| NL6617291A NL6617291A (cg-RX-API-DMAC10.html) | 1963-08-05 | 1966-12-09 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3371836A (cg-RX-API-DMAC10.html) |
| DE (2) | DE1439272B2 (cg-RX-API-DMAC10.html) |
| GB (2) | GB1020466A (cg-RX-API-DMAC10.html) |
| NL (3) | NL142279B (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2434355A (en) * | 1945-09-24 | 1948-01-13 | Mitchell Camera Corp | Automatic loop replenisher |
| DE1614364C3 (de) * | 1966-06-01 | 1979-04-05 | Rca Corp., New York, N.Y. (V.St.A.) | Verfahren zur Montage eines Halbleiter-Kristallelementes |
| DE1564867C3 (de) * | 1966-06-30 | 1975-04-10 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen |
| US3791640A (en) * | 1972-07-21 | 1974-02-12 | R Clugage | Compression hold-down elements |
| DE3446780A1 (de) * | 1984-12-21 | 1986-07-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen |
| CN105197432B (zh) * | 2015-09-30 | 2017-09-12 | 苏州市灵通玻璃制品有限公司 | 一种冰箱面板玻璃周转装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2058128A (en) * | 1934-10-08 | 1936-10-20 | Howard F Brubach | Slide holder |
| US2321071A (en) * | 1941-06-18 | 1943-06-08 | Bell Telephone Labor Inc | Method of assembling dry rectifiers and the like with solder |
| US2693634A (en) * | 1951-12-05 | 1954-11-09 | Atlas Powder Co | Igniter jig for electric blasting initiators |
| US2766510A (en) * | 1953-11-04 | 1956-10-16 | Erie Resistor Corp | Method and apparatus for making condensers |
| US3168885A (en) * | 1959-03-13 | 1965-02-09 | Cornell Dubilier Electric | Method and apparatus for the manufacture of capacitors |
| BE630750A (cg-RX-API-DMAC10.html) * | 1962-04-09 | 1963-04-08 |
-
0
- NL NL302444D patent/NL302444A/xx unknown
-
1963
- 1963-08-05 DE DE1963S0086552 patent/DE1439272B2/de not_active Withdrawn
- 1963-12-23 NL NL302444A patent/NL142279B/xx unknown
-
1964
- 1964-08-03 US US38704764 patent/US3371836A/en not_active Expired - Lifetime
- 1964-08-04 GB GB3163364A patent/GB1020466A/en not_active Expired
-
1965
- 1965-12-10 GB GB5247165A patent/GB1057965A/en not_active Expired
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1966
- 1966-12-07 DE DE19661539881 patent/DE1539881A1/de active Pending
- 1966-12-09 NL NL6617291A patent/NL6617291A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1439272B2 (de) | 1977-05-26 |
| NL6617291A (cg-RX-API-DMAC10.html) | 1967-06-12 |
| NL142279B (nl) | 1974-05-15 |
| GB1020466A (en) | 1966-02-16 |
| DE1539881A1 (de) | 1970-01-08 |
| GB1057965A (en) | 1967-02-08 |
| DE1439272A1 (de) | 1969-12-18 |
| US3371836A (en) | 1968-03-05 |