NL289731A - - Google Patents
Info
- Publication number
- NL289731A NL289731A NL289731DA NL289731A NL 289731 A NL289731 A NL 289731A NL 289731D A NL289731D A NL 289731DA NL 289731 A NL289731 A NL 289731A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US177732A US3322656A (en) | 1962-03-06 | 1962-03-06 | Metal surface of improved bonding quality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL289731A true NL289731A (US07935154-20110503-C00006.png) |
Family
ID=22649766
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL289731D NL289731A (US07935154-20110503-C00006.png) | 1962-03-06 | ||
| NL128730D NL128730C (US07935154-20110503-C00006.png) | 1962-03-06 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL128730D NL128730C (US07935154-20110503-C00006.png) | 1962-03-06 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3322656A (US07935154-20110503-C00006.png) |
| GB (1) | GB1042761A (US07935154-20110503-C00006.png) |
| NL (2) | NL128730C (US07935154-20110503-C00006.png) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3518168A (en) * | 1966-11-18 | 1970-06-30 | Revere Copper & Brass Inc | Electrolytic process of preparing a copper foil for a plastic coat |
| US3857681A (en) * | 1971-08-03 | 1974-12-31 | Yates Industries | Copper foil treatment and products produced therefrom |
| US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
| US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
| JPS599050A (ja) * | 1982-07-08 | 1984-01-18 | 日立電線株式会社 | 銅張積層板の製造方法 |
| US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
| US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
| US4532014A (en) * | 1984-11-13 | 1985-07-30 | Olin Corporation | Laser alignment system |
| US4551210A (en) * | 1984-11-13 | 1985-11-05 | Olin Corporation | Dendritic treatment of metallic surfaces for improving adhesive bonding |
| US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
| US4549941A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Electrochemical surface preparation for improving the adhesive properties of metallic surfaces |
| US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
| US4961828A (en) * | 1989-04-05 | 1990-10-09 | Olin Corporation | Treatment of metal foil |
| US5057193A (en) * | 1989-04-05 | 1991-10-15 | Olin Corporation | Anti-tarnish treatment of metal foil |
| JP2717911B2 (ja) | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
| US6270645B1 (en) | 1997-09-26 | 2001-08-07 | Circuit Foil Usa, Inc. | Simplified process for production of roughened copper foil |
| US6174426B1 (en) | 1999-08-12 | 2001-01-16 | Usx Corporation | Tin-plated steel with adhesion promoter |
| CN112941581B (zh) * | 2021-01-27 | 2022-04-08 | 河海大学 | 一种利用镀铜废水处理混凝土的方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2522474A (en) * | 1942-07-02 | 1950-09-12 | Battelle Memorial Institute | Treatment of zinc surfaces |
| US2420886A (en) * | 1942-12-03 | 1947-05-20 | Westinghouse Electric Corp | Application of solid lubricant coatings to surfaces |
| GB853521A (en) * | 1945-01-06 | 1960-11-09 | Atomic Energy Authority Uk | Electro-plating uranium with protective metals |
| US2493092A (en) * | 1946-01-11 | 1950-01-03 | United Chromium Inc | Method of electrodepositing copper and baths therefor |
| US2593922A (en) * | 1947-04-16 | 1952-04-22 | Sprague Electric Co | Insulated electrical conductor |
| US2802897A (en) * | 1952-07-18 | 1957-08-13 | Gen Electric | Insulated electrical conductors |
| US2745898A (en) * | 1952-09-20 | 1956-05-15 | Gen Electric | Insulated electric conductors |
| US2760890A (en) * | 1953-10-14 | 1956-08-28 | Chemical Corp | Composition for and method of producing corrosion resistant metal coating |
| US2783194A (en) * | 1955-03-04 | 1957-02-26 | Fred I Nobel | Iodate-containing plating baths |
| US2932599A (en) * | 1955-05-09 | 1960-04-12 | Sanders Associates Inc | Method of preparation of thermoplastic resin coated printed circuit |
| US2887442A (en) * | 1956-10-22 | 1959-05-19 | Metallic Industry Nv | Process for the electrolytic deposition of copper |
| US3053692A (en) * | 1958-01-29 | 1962-09-11 | Allied Res Products Inc | Protective coating |
| US3198672A (en) * | 1960-08-18 | 1965-08-03 | Internat Protected Metals Inc | Preparation of cupric oxide surfaces |
| US3114683A (en) * | 1960-10-07 | 1963-12-17 | Sanders Associates Inc | Copper oxidation |
| US3220897A (en) * | 1961-02-13 | 1965-11-30 | Esther S Conley | Conducting element and method |
| NL282244A (US07935154-20110503-C00006.png) * | 1964-10-29 |
-
0
- NL NL289731D patent/NL289731A/xx unknown
- NL NL128730D patent/NL128730C/xx active
-
1962
- 1962-03-06 US US177732A patent/US3322656A/en not_active Expired - Lifetime
-
1963
- 1963-02-27 GB GB7838/63A patent/GB1042761A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL128730C (US07935154-20110503-C00006.png) | |
| US3322656A (en) | 1967-05-30 |
| GB1042761A (en) | 1966-09-14 |
