NL283807A - - Google Patents

Info

Publication number
NL283807A
NL283807A NL283807DA NL283807A NL 283807 A NL283807 A NL 283807A NL 283807D A NL283807D A NL 283807DA NL 283807 A NL283807 A NL 283807A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL283807A publication Critical patent/NL283807A/xx
Priority claimed from GB3505961A external-priority patent/GB1042331A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
NL283807D 1961-09-29 NL283807A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB3505961A GB1042331A (en) 1961-09-29 1961-09-29 Improvements relating to printed electric circuits and to the manufacture of such circuits
GB3829061 1961-10-26
GB932862 1962-03-10

Publications (1)

Publication Number Publication Date
NL283807A true NL283807A (ko)

Family

ID=27255347

Family Applications (1)

Application Number Title Priority Date Filing Date
NL283807D NL283807A (ko) 1961-09-29

Country Status (4)

Country Link
US (2) US3439109A (ko)
DE (2) DE1515646A1 (ko)
GB (2) GB1042333A (ko)
NL (1) NL283807A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671811A (en) * 1968-09-16 1972-06-20 Tdk Electronics Co Ltd Diode matrix card
US4900878A (en) * 1988-10-03 1990-02-13 Hughes Aircraft Company Circuit terminations having improved electrical and structural integrity
US5977618A (en) * 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5915752A (en) * 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US6054756A (en) 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US6361959B1 (en) 1994-07-07 2002-03-26 Tessera, Inc. Microelectronic unit forming methods and materials
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US5629239A (en) * 1995-03-21 1997-05-13 Tessera, Inc. Manufacture of semiconductor connection components with frangible lead sections
US20020151111A1 (en) * 1995-05-08 2002-10-17 Tessera, Inc. P-connection components with frangible leads and bus
US6329607B1 (en) 1995-09-18 2001-12-11 Tessera, Inc. Microelectronic lead structures with dielectric layers
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US6069406A (en) * 1997-05-20 2000-05-30 Shinko Electric Industries Co., Ltd. Wiring patterned film and production thereof
US6274822B1 (en) 1998-03-27 2001-08-14 Tessera, Inc. Manufacture of semiconductor connection components with frangible lead sections

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2974284A (en) * 1961-03-07 Rotors for electrical indicating instruments
US3030612A (en) * 1956-12-07 1962-04-17 Sperry Rand Corp Magnetic apparatus and methods
US3053929A (en) * 1957-05-13 1962-09-11 Friedman Abraham Printed circuit
US3159821A (en) * 1957-09-25 1964-12-01 Sperry Rand Corp Magnetic core matrix
US3052823A (en) * 1958-06-12 1962-09-04 Rogers Corp Printed circuit structure and method of making the same
US3098951A (en) * 1959-10-29 1963-07-23 Sippican Corp Weldable circuit cards
US2998475A (en) * 1959-12-03 1961-08-29 Raymond C Grimsinger Printed electrical circuit panel having angularly disposed sections
NL268251A (ko) * 1960-08-24
NL136150C (ko) * 1961-10-28
US3293620A (en) * 1961-11-03 1966-12-20 Ford Motor Co Thin film magnetic memory having nondestructive readout
US3228093A (en) * 1962-02-05 1966-01-11 Schjeldahl Co G T Method of making mounted circuitry connections

Also Published As

Publication number Publication date
US3439109A (en) 1969-04-15
DE1524833A1 (de) 1971-02-04
GB1042334A (en) 1966-09-14
DE1515646A1 (de) 1969-08-28
US3460105A (en) 1969-08-05
GB1042333A (en) 1966-09-14

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