NL283249A - - Google Patents
Info
- Publication number
- NL283249A NL283249A NL283249DA NL283249A NL 283249 A NL283249 A NL 283249A NL 283249D A NL283249D A NL 283249DA NL 283249 A NL283249 A NL 283249A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES75819A DE1190107B (de) | 1961-09-19 | 1961-09-19 | Thermokompressionsverfahren zum Anbringen der Kontaktelektrode oder Zuleitung eines Halbleiterbauelements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL283249A true NL283249A (https=) | 1900-01-01 |
Family
ID=7505644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL283249D NL283249A (https=) | 1961-09-19 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3274667A (https=) |
| CH (1) | CH396224A (https=) |
| DE (1) | DE1190107B (https=) |
| GB (1) | GB993280A (https=) |
| NL (1) | NL283249A (https=) |
| SE (1) | SE305033B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1106163A (en) * | 1964-03-02 | 1968-03-13 | Post Office | Improvements in or relating to the bonding of metals to semiconductor, metallic or non-metallic surfaces |
| US3348016A (en) * | 1964-04-29 | 1967-10-17 | Western Electric Co | Apparatus for attaching leads to electrical components |
| US3515952A (en) * | 1965-02-17 | 1970-06-02 | Motorola Inc | Mounting structure for high power transistors |
| US3442003A (en) * | 1965-07-26 | 1969-05-06 | Teledyne Inc | Method for interconnecting thin films |
| US3459918A (en) * | 1967-01-13 | 1969-08-05 | Ibm | Welding of electrical elements having voltage sensitive components |
| US3577042A (en) * | 1967-06-19 | 1971-05-04 | Int Rectifier Corp | Gate connection for controlled rectifiers |
| US3617682A (en) * | 1969-06-23 | 1971-11-02 | Gen Electric | Semiconductor chip bonder |
| US3660632A (en) * | 1970-06-17 | 1972-05-02 | Us Navy | Method for bonding silicon chips to a cold substrate |
| GB1389542A (en) * | 1971-06-17 | 1975-04-03 | Mullard Ltd | Methods of securing a semiconductor body to a support |
| US3783348A (en) * | 1972-10-30 | 1974-01-01 | Rca Corp | Encapsulated semiconductor device assembly |
| US3878553A (en) * | 1972-12-26 | 1975-04-15 | Texas Instruments Inc | Interdigitated mesa beam lead diode and series array thereof |
| JPS5444881A (en) * | 1977-09-16 | 1979-04-09 | Nec Corp | Electrode wiring structure of integrated circuit |
| DE2929623C2 (de) * | 1979-07-21 | 1981-11-26 | W.C. Heraeus Gmbh, 6450 Hanau | Feinstdraht aus einer Aluminiumlegierung |
| US4441248A (en) * | 1982-12-02 | 1984-04-10 | Stanley Electric Company, Ltd. | On-line inspection method and system for bonds made to electronic components |
| GB2162686B (en) * | 1984-08-02 | 1988-05-11 | Stc Plc | Thermistors |
| US5038453A (en) * | 1988-07-22 | 1991-08-13 | Rohm Co., Ltd. | Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3068412A (en) * | 1962-12-11 | Electrical contact and method of making the same | ||
| US1938499A (en) * | 1931-01-19 | 1933-12-05 | Budd Edward G Mfg Co | Apparatus for electric welding |
| US2372211A (en) * | 1942-05-11 | 1945-03-27 | Progressive Welder Company | Welding apparatus |
| US2796510A (en) * | 1955-10-10 | 1957-06-18 | Rohr Aircraft Corp | Method of resistance welding sandwich panels |
| GB846559A (en) * | 1956-01-18 | 1960-08-31 | Telefunken Gmbh | Improvements in or relating to a method of securing electrical components to circuit panels having adhering conductors |
| US2946119A (en) * | 1956-04-23 | 1960-07-26 | Aeroprojects Inc | Method and apparatus employing vibratory energy for bonding metals |
| NL113327C (https=) * | 1956-10-31 | 1900-01-01 | ||
| US2996800A (en) * | 1956-11-28 | 1961-08-22 | Texas Instruments Inc | Method of making ohmic connections to silicon semiconductors |
| GB846155A (en) * | 1956-12-07 | 1960-08-24 | Du Pont | Improvements in or relating to the manufacture of monovinylacetylene |
| AT203550B (de) * | 1957-03-01 | 1959-05-25 | Western Electric Co | Halbleitereinrichtung und Verfahren zu deren Herstellung |
| DE1050449B (https=) * | 1957-04-18 | 1959-02-12 | ||
| US3109225A (en) * | 1958-08-29 | 1963-11-05 | Rca Corp | Method of mounting a semiconductor device |
| US3061923A (en) * | 1959-05-11 | 1962-11-06 | Knapp Mills Inc | Method of making composite sheets |
| US3091849A (en) * | 1959-09-14 | 1963-06-04 | Pacific Semiconductors Inc | Method of bonding materials |
| US3115697A (en) * | 1960-08-31 | 1963-12-31 | Pacific Semiconductors Inc | Method of making a low resistance ohmic contact |
| US3125803A (en) * | 1960-10-24 | 1964-03-24 | Terminals |
-
0
- NL NL283249D patent/NL283249A/xx unknown
-
1961
- 1961-09-19 DE DES75819A patent/DE1190107B/de active Pending
-
1962
- 1962-09-14 GB GB35068/62A patent/GB993280A/en not_active Expired
- 1962-09-17 CH CH1098762A patent/CH396224A/de unknown
- 1962-09-17 US US223976A patent/US3274667A/en not_active Expired - Lifetime
- 1962-09-18 SE SE10061/62A patent/SE305033B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB993280A (en) | 1965-05-26 |
| CH396224A (de) | 1965-07-31 |
| SE305033B (https=) | 1968-10-14 |
| US3274667A (en) | 1966-09-27 |
| DE1190107B (de) | 1965-04-01 |