NL260951A - - Google Patents
Info
- Publication number
- NL260951A NL260951A NL260951DA NL260951A NL 260951 A NL260951 A NL 260951A NL 260951D A NL260951D A NL 260951DA NL 260951 A NL260951 A NL 260951A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13075A US3033537A (en) | 1960-03-07 | 1960-03-07 | Transistor cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL260951A true NL260951A (US07223432-20070529-C00017.png) |
Family
ID=21758173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL260951D NL260951A (US07223432-20070529-C00017.png) | 1960-03-07 |
Country Status (5)
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3146384A (en) * | 1961-08-11 | 1964-08-25 | Robert A Ruehle | Mounting device for semiconductors |
| NL124607C (US07223432-20070529-C00017.png) * | 1961-11-21 | |||
| US3241605A (en) * | 1962-04-10 | 1966-03-22 | U S Heat Sink | Thermal dissipator |
| US3262028A (en) * | 1962-04-17 | 1966-07-19 | Harold B Hermann | Electrical component mounting device |
| US3270250A (en) * | 1963-02-06 | 1966-08-30 | Ariel R Davis | Liquid vapor cooling of electrical components |
| US3261904A (en) * | 1963-09-16 | 1966-07-19 | United Aircraft Corp | Transistor mounting and heat transfer apparatus with adjustable pressure detachable mounting means |
| US3229756A (en) * | 1964-01-21 | 1966-01-18 | Laszlo Z Keresztury | Semiconductor heat sink and/or cooler |
| US3372733A (en) * | 1964-02-11 | 1968-03-12 | Russell J. Callender | Method of maintaining electrical characteristics of electron tubes and transistors an structure therefor |
| US3277957A (en) * | 1964-04-03 | 1966-10-11 | Westinghouse Electric Corp | Heat transfer apparatus for electronic component |
| US3499988A (en) * | 1965-10-08 | 1970-03-10 | Sanyo Electric Co | Loudspeaker apparatus with audio frequency amplifier mounted thereon |
| US3412788A (en) * | 1966-03-11 | 1968-11-26 | Mallory & Co Inc P R | Semiconductor device package |
| US3514771A (en) * | 1967-09-26 | 1970-05-26 | Sperry Rand Corp | Magnetic drum enclosure with heat transfer |
| US3739319A (en) * | 1971-04-14 | 1973-06-12 | Emerson Electric Co | Mechanical and electrical disconnect |
| DE2315192B2 (de) * | 1973-03-27 | 1978-02-23 | Klein, Schanzlin & Becker Ag, 6710 Frankenthal | Elektromotor fuer den einsatz bei hohen betriebstemperaturen |
| DE2334210C2 (de) * | 1973-07-05 | 1985-06-27 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Kühlkörper für Transistoren hoher Leistung |
| GB2157077B (en) * | 1984-04-05 | 1987-10-21 | Burr Brown Corp | Heat sinks for minimizing noise in precision electronic components |
| US4624303A (en) * | 1985-04-29 | 1986-11-25 | The Nippert Company | Heat sink mounting and method of making |
| US5148351A (en) * | 1991-05-02 | 1992-09-15 | G & W Electric Company | Cooling apparatus for enclosed current limiting fuses |
| SE500281C2 (sv) * | 1992-11-24 | 1994-05-24 | Asea Brown Boveri | Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning |
| US5397919A (en) * | 1993-03-04 | 1995-03-14 | Square Head, Inc. | Heat sink assembly for solid state devices |
| US5313099A (en) * | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
| US5784257A (en) * | 1997-02-21 | 1998-07-21 | Chip Coolers, Inc. | Heatsink assembly with adjustable retaining clip |
| US5774335A (en) * | 1997-04-08 | 1998-06-30 | Chip Coolers, Inc. | Heat sink assembly with height adjustable mounting clip |
| US5825622A (en) * | 1997-05-17 | 1998-10-20 | Chip Coolers, Inc. | Heat sink assembly with adjustable mounting clip |
| US6014315A (en) * | 1998-09-08 | 2000-01-11 | Chip Coolers, Inc. | Heat sink assembly with multiple pressure capability |
| US5945736A (en) * | 1998-09-28 | 1999-08-31 | Chip Coolers, Inc. | Heat sink assembly with snap-in cover plate having multiple pressure capability |
| US6021045A (en) * | 1998-10-26 | 2000-02-01 | Chip Coolers, Inc. | Heat sink assembly with threaded collar and multiple pressure capability |
| US6075699A (en) * | 1999-01-29 | 2000-06-13 | Chip Coolers, Inc. | Heat sink assembly with snap-in legs |
| US6201697B1 (en) | 1999-02-16 | 2001-03-13 | Chip Coolers, Inc. | Heat sink assembly with cam lock |
| US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
| US6304451B1 (en) | 1999-12-01 | 2001-10-16 | Tyco Electronics Logistics Ag | Reverse mount heat sink assembly |
| US6360816B1 (en) * | 1999-12-23 | 2002-03-26 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
| US6557626B1 (en) | 2000-01-11 | 2003-05-06 | Molex Incorporated | Heat sink retainer and Heat sink assembly using same |
| US6252774B1 (en) | 2000-03-28 | 2001-06-26 | Chip Coolers, Inc. | Multi-device heat sink assembly |
| US6293331B1 (en) | 2000-08-11 | 2001-09-25 | Tyco Electronics Logistics Ag | Vibration and shock resistant heat sink assembly |
| US6343012B1 (en) | 2000-11-13 | 2002-01-29 | Tyco Electronics Logistis Ag | Heat dissipation device with threaded fan module |
| US20040263007A1 (en) * | 2003-05-19 | 2004-12-30 | Wetherill Associates, Inc. | Thermal transfer container for semiconductor component |
| CN111315182B (zh) * | 2018-12-12 | 2022-02-08 | 台达电子工业股份有限公司 | 整合式电子装置 |
| USD987167S1 (en) * | 2020-03-23 | 2023-05-23 | Osram Gmbh | Heatsink for a lamp |
| GB2598343B (en) * | 2020-08-27 | 2022-11-30 | Continental Automotive Romania Srl | Circular heatsink |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1306175A (en) * | 1919-06-10 | Fob internal-combustion engines | ||
| US1441444A (en) * | 1919-01-20 | 1923-01-09 | Mitchell Parker | Spark plug |
| BE547698A (US07223432-20070529-C00017.png) * | 1955-05-10 | 1900-01-01 | ||
| US2889498A (en) * | 1955-11-08 | 1959-06-02 | Westinghouse Electric Corp | Semiconductor rectifier assembly |
| US2917286A (en) * | 1956-11-13 | 1959-12-15 | Siemens Edison Swan Ltd | Electronic equipment |
-
0
- NL NL260951D patent/NL260951A/xx unknown
-
1960
- 1960-03-07 US US13075A patent/US3033537A/en not_active Expired - Lifetime
-
1961
- 1961-02-02 GB GB3991/61A patent/GB921251A/en not_active Expired
- 1961-02-07 FR FR851953A patent/FR1280273A/fr not_active Expired
- 1961-02-13 DE DEP26574A patent/DE1188208B/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3033537A (en) | 1962-05-08 |
| GB921251A (en) | 1963-03-20 |
| FR1280273A (fr) | 1961-12-29 |
| DE1188208B (de) | 1965-03-04 |
