NL260810A - - Google Patents

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Publication number
NL260810A
NL260810A NL260810DA NL260810A NL 260810 A NL260810 A NL 260810A NL 260810D A NL260810D A NL 260810DA NL 260810 A NL260810 A NL 260810A
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NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL260810A publication Critical patent/NL260810A/xx

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Wire Processing (AREA)
NL260810D 1961-02-03 NL260810A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL260810 1961-02-03

Publications (1)

Publication Number Publication Date
NL260810A true NL260810A (nl)

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NL260810D NL260810A (nl) 1961-02-03

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Country Link
US (1) US3136032A (nl)
DE (1) DE1180851B (nl)
ES (1) ES274223A1 (nl)
GB (1) GB970428A (nl)
NL (1) NL260810A (nl)

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* Cited by examiner, † Cited by third party
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US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3451122A (en) * 1964-06-11 1969-06-24 Western Electric Co Methods of making soldered connections
US3296577A (en) * 1964-10-21 1967-01-03 Westinghouse Electric Corp Electrical connector assembly and method
US3257707A (en) * 1965-02-01 1966-06-28 Gen Dynamics Corp Electrical interconnection process
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3524247A (en) * 1969-02-11 1970-08-18 Burroughs Corp Soldering method
US3665589A (en) * 1969-10-23 1972-05-30 Nasa Lead attachment to high temperature devices
US3665590A (en) * 1970-01-19 1972-05-30 Ncr Co Semiconductor flip-chip soldering method
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
BE794969A (fr) * 1972-02-11 1973-08-06 Glaverbel Procede et dispositif de fabrication d'une unite vitree
BE794970A (fr) * 1972-02-11 1973-08-06 Glaverbel Procede et dispositif de fabrication d'une unite vitree
DE2622000A1 (de) * 1976-05-18 1977-12-01 Bosch Gmbh Robert Verfahren und vorrichtung zum anloeten eines drahtes
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods
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DE1050449B (nl) * 1957-04-18 1959-02-12

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ES274223A1 (es) 1962-06-16
DE1180851B (de) 1964-11-05
US3136032A (en) 1964-06-09
GB970428A (en) 1964-09-23

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