NL241488A - - Google Patents

Info

Publication number
NL241488A
NL241488A NL241488DA NL241488A NL 241488 A NL241488 A NL 241488A NL 241488D A NL241488D A NL 241488DA NL 241488 A NL241488 A NL 241488A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL241488A publication Critical patent/NL241488A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/958Passivation layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
NL241488D 1958-07-21 NL241488A (US20110009641A1-20110113-C00116.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US749620A US2913358A (en) 1958-07-21 1958-07-21 Method for forming passivation films on semiconductor bodies and articles resulting therefrom

Publications (1)

Publication Number Publication Date
NL241488A true NL241488A (US20110009641A1-20110113-C00116.png) 1900-01-01

Family

ID=25014506

Family Applications (1)

Application Number Title Priority Date Filing Date
NL241488D NL241488A (US20110009641A1-20110113-C00116.png) 1958-07-21

Country Status (3)

Country Link
US (1) US2913358A (US20110009641A1-20110113-C00116.png)
GB (1) GB925084A (US20110009641A1-20110113-C00116.png)
NL (1) NL241488A (US20110009641A1-20110113-C00116.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL241492A (US20110009641A1-20110113-C00116.png) * 1958-07-21
NL231410A (US20110009641A1-20110113-C00116.png) * 1958-09-16
NL122784C (US20110009641A1-20110113-C00116.png) * 1959-04-15
US2963630A (en) * 1959-10-20 1960-12-06 Jr John W Irvine Surface treatment of semiconductive devices
US3114663A (en) * 1960-03-29 1963-12-17 Rca Corp Method of providing semiconductor wafers with protective and masking coatings
NL259748A (US20110009641A1-20110113-C00116.png) * 1960-04-30
DE1195411B (de) * 1960-05-10 1965-06-24 Intermetall Halbleiterbauelement mit festhaftender Oberflaechenschutzschicht auf dem Halbleiterkoerper
US3115424A (en) * 1961-04-20 1963-12-24 Int Rectifier Corp Process for the passivation of semiconductors
US3242007A (en) * 1961-11-15 1966-03-22 Texas Instruments Inc Pyrolytic deposition of protective coatings of semiconductor surfaces
NL286978A (US20110009641A1-20110113-C00116.png) * 1961-12-27
DE1274240B (de) * 1962-06-04 1968-08-01 Licentia Gmbh Mit einem lufttrocknenden UEberzugslack versehenes Gleichrichterelement
US3339274A (en) * 1964-03-16 1967-09-05 Hughes Aircraft Co Top contact for surface protected semiconductor devices
US3278813A (en) * 1964-04-22 1966-10-11 Gen Electric Transistor housing containing packed, earthy, nonmetallic, electrically insulating material
US3414433A (en) * 1965-07-07 1968-12-03 Westinghouse Electric Corp Encapsulation of semiconductor
JP2674701B2 (ja) * 1986-05-01 1997-11-12 日東電工株式会社 半導体装置
JPH04261049A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP3424835B2 (ja) * 1991-12-27 2003-07-07 松下電器産業株式会社 カラー固体撮像装置およびカラーフィルタ
KR100345677B1 (ko) * 1999-12-13 2002-07-27 주식회사 하이닉스반도체 이미지센서의 결함 분석 방법
US6841802B2 (en) 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754456A (en) * 1956-07-10 Madelung
US2798189A (en) * 1953-04-16 1957-07-02 Sylvania Electric Prod Stabilized semiconductor devices
NL89173C (US20110009641A1-20110113-C00116.png) * 1955-05-03
US2832702A (en) * 1955-08-18 1958-04-29 Hughes Aircraft Co Method of treating semiconductor bodies for translating devices

Also Published As

Publication number Publication date
US2913358A (en) 1959-11-17
GB925084A (en) 1963-05-01

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