Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1203—Rectifying Diode
  • H01L2924/12033—Gunn diode

Landscapes

• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Thin Film Transistor (AREA)
• Electrodes Of Semiconductors (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Die Bonding (AREA)
• Wire Bonding (AREA)
• Bipolar Transistors (AREA)
• Formation Of Insulating Films (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19750988

Family Applications (2)

Family Applications Before (1)

Country Status (8)

Families Citing this family (4)

Family Cites Families (3)

• 0
  • NL NL110563D patent/NL110563C/xx active
  • BE BE571409D patent/BE571409A/xx unknown
  • NL NL221029D patent/NL221029A/xx unknown
• 1958
  • 1958-09-18 US US761911A patent/US2929971A/en not_active Expired - Lifetime
  • 1958-09-19 DE DEN15603A patent/DE1246883B/de active Pending
  • 1958-09-19 GB GB30047/58A patent/GB902153A/en not_active Expired
  • 1958-09-20 ES ES0244241A patent/ES244241A1/es not_active Expired
  • 1958-09-20 CH CH6417058A patent/CH368873A/de unknown
  • 1958-09-22 FR FR1210353D patent/FR1210353A/fr not_active Expired
• 1959
  • 1959-01-16 ES ES0246605A patent/ES246605A1/es not_active Expired

Also Published As

Similar Documents