NL2026967B1 - Automatic vacuum reflow soldering device adopting contact temperature control - Google Patents
Automatic vacuum reflow soldering device adopting contact temperature control Download PDFInfo
- Publication number
- NL2026967B1 NL2026967B1 NL2026967A NL2026967A NL2026967B1 NL 2026967 B1 NL2026967 B1 NL 2026967B1 NL 2026967 A NL2026967 A NL 2026967A NL 2026967 A NL2026967 A NL 2026967A NL 2026967 B1 NL2026967 B1 NL 2026967B1
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- Netherlands
- Prior art keywords
- heating
- heating chamber
- chamber
- contact temperature
- reflow soldering
- Prior art date
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- 238000005476 soldering Methods 0.000 title claims abstract description 60
- 238000010438 heat treatment Methods 0.000 claims abstract description 227
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 238000001816 cooling Methods 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 14
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 7
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 claims description 7
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000112 cooling gas Substances 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 6
- 235000019253 formic acid Nutrition 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 230000004069 differentiation Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an automatic vacuum reflow soldering device adopting contact temperature control comprising heating chamber (11), chamber cover (2), infrared radiant tubes, heating plate above the radiant tubes, contact temperature control mechanism, 5 vacuumizing mechanism and cooling mechanism. One end of the cover is hinged onto the heating chamber, the other end mounted onto the heating chamber through an automatic opening and closing coupler lock device, the heating chamber comprises a heating cavity comprising the radiant tubes, the contact temperature control mechanism comprises a main thermocouple mounted in the heating cavity contacting the bottom of the heating plate and a 10 movable thermocouple mounted on the chamber cover contacting the upper surface of the heating plate, both thermocouples electrically connected with a PID heating controller. The soldering device solves poor soldering quality caused by low heating efficiency and temperature and uneven heating and inconvenience caused by heavy chamber covers. 19
Description
TEMPERATURE CONTROL Technical Field The present invention relates to an automatic vacuum reflow soldering device adopting contact temperature control and belongs to the technical field of vacuum reflow soldering. Background With the rapid development of modern integrated circuits and electronic technologies, semiconductor products are more and more widely applied, and with the increasing requirements on the fine quality of semiconductor products, especially of the semiconductor metal packaging devices and semiconductor ceramic packaging devices, the soldering quality and the void ratio of traditional reflow soldering processes cannot meet the quality requirements of the semiconductor products.
In an existing traditional vacuum reflow oven, circuit boards are heated in a hot air circulation mode by hot air generated by filaments in a heating box, the air in the heating box is heated by heating tubes, and then the hot air is conveyed into the oven cavity of the reflow oven using a fan. For ensuring even air discharging of the heating box, the air outlet of the heating box is provided with a metal rectifying plate, which is provided with a plurality of uniformly distributed small holes for guiding the hot air. A soldering process of the circuit boards on a conveyor belt comprises that the solder paste on the circuit boards is heated by the hot air, soldering flux promotes the solder paste to melt, and finally the circuit boards are cooled by a cooling fan to solidify the solder paste to complete the soldering process. In the soldering mode with hot air heating, heat is transferred from the surface to the inner surface of the circuit boards for heating, accordingly the solder paste on the circuit boards is prone to producing bubbles during the heating process to result in pseudo soldering and seriously influence the product quality; according to incomplete statistics, the bubbles cause around 50% of defective products. Besides, because the efficiency of heat transfer by hot air is low, especially when applied to flexible circuit boards provided with fixtures, which are high in heat absorption capacity, a low-efficiency heating manner can directly lead to insufficient 1 heating, local high temperature or the like of the circuit boards to cause poor soldering such as circuit board deformation and further to seriously affect the product quality. Meanwhile, the rectifying plate does not generate heat and cannot reach a surface temperature meeting the gasification requirement of the soldering flux, so that the soldering flux is prone to being adhered and condensed onto the rectifying plate to result in maintenance and cleaning difficulty of the rectifying board. Also, the chamber door of the vacuum reflow oven is complex in structure and weighs more than 20KG, a female operator can hardly independently open or close the door manually, and automatic integration cannot be realized. The temperature control modes of most vacuum reflow ovens adopt integration of temperature sensing element insertion temperature control and heating plates, wherein the heating plates are inconvenient to disassemble and customize.
In conclusion, existing vacuum reflow soldering devices have the following problems: 1, the hot air reflow oven serves as a heating device and is low in heating speed and the highest heating temperature and uneven in circuit board heating to lead to bubbles of the solder paste, which then results in problems of poor welding such as pseudo soldering and circuit board deformation; 2, the surface temperature of the rectifying plate is low to cause adhesion and condensation of the soldering flux and difficulty in maintenance and cleaning; 3, although with the convenience in heat source control, the infrared welding technology adopted in the prior art has the problems of shielding of photosensitive points, influence on heating effects due to weight difference of elements and PCBs, large temperature difference and the like; 4, the screw threads of a chamber cover are prone to causing secondary pollution and reducing the granularity after long-term application, and a common screw-thread door locking device made of thin materials is easy to deform under external impact and poor in durability; meanwhile, the chamber cover is too heavy and inconvenient to operate by female operators; 5, temperature control in the prior art adopts a heating plate insertion mode, which leads to inconvenient disassembly.
Summary of the Invention In order to overcome the defects in the prior art, the present invention provides an automatic vacuum reflow soldering device adopting contact temperature control to solve the technical problems of poor product soldering quality caused by low heating efficiency, uneven 2 heating and low heating temperature as well as the problem of operation inconvenience of heavy chamber covers in vacuum reflow soldering devices in the prior art.
The technical solution is as follows: an automatic vacuum reflow soldering device adopting contact temperature control comprises a heating chamber, a chamber cover forming a sealed chamber with the heating chamber, a plurality of infrared radiant tubes installed in the heating chamber, a heating plate arranged above the infrared radiant tubes, a contact temperature control mechanism, a vacuumizing mechanism communicated with the heating chamber, and a cooling mechanism, wherein one end of the chamber cover is hinged onto the heating chamber, and the other end of the chamber cover is mounted in a detachable and sealed mode onto the heating chamber through an automatic opening and closing coupler lock device; a heating cavity is formed in the heating chamber, and a plurality of the infrared radiant tubes are mounted in the heating cavity, and the inside of the heating cavity is provided with a supporting mechanism for arranging the heating plate; the contact temperature control mechanism comprises a main thermocouple and a movable thermocouple, the main thermocouple is mounted in the heating cavity and in contact with the bottom of the heating plate, and the movable thermocouple is mounted on the chamber cover and in contact with the upper surface of the heating plate; the automatic vacuum reflow soldering device adopting contact temperature control also comprises a PID (proportion-integration-differentiation) heating controller, and both the main thermocouple and the movable thermocouple are electrically connected with the PID heating controller through data cables.
Based on the technical solution above, the present invention can be improved as follows: Further, the movable thermocouple adopts a platinum-rhodium wire with a diameter of 0.5 mm and a length of 300 mm, and the tail end of the platinum rhodium wire serves as a detecting point.
Further, both ends of the infrared radiant tubes penetrate through the side walls of the heating chamber and are then fixed by tube sealing blocks, and the infrared radiant tubes are arranged at equal intervals.
Further, the chamber cover is in a bottomless cuboid structure and is provided with an observation hole, which is provided with quartz glass.
Further, the bottom surface of the heating plate is in contact with a bracket mounted on the inner bottom surface of the heating chamber, the inner four corners of the heating chamber are provided with supporting seats for supporting the four corners of the heating plate, the heating plate is made of aluminum, silicon nitride or graphite, and the surface of the heating plate 1s coated with an optical coating.
Further, a vacuumizing outlet is formed in the center of the bottom of the heating chamber and communicated with the vacuumizing mechanism through a pipeline.
Further, the cooling mechanism comprises a water cooling mechanism arranged on the outer bottom surface of the heating chamber and an air cooling mechanism communicated with the heating cavity of the heating chamber.
Further, the water cooling mechanism comprises a water cooling plate arranged on the outer bottom surface of the heating chamber, and the water cooling plate is provided with a cold water inlet and a warm water outlet.
Further, the air cooling mechanism comprises a plurality of cooling gas nozzles mounted on the side wall of the heating chamber, which are mounted in a penetrating mode on the side wall of the heating chamber through vacuum penetrating sealing members and are communicated with a nitrogen storage tank.
Further, the side wall of the heating chamber 1s also provided with reducing gas nozzles, which are mounted in a penetrating mode on the side wall of the heating chamber through vacuum penetrating sealing members and communicated with a formic acid storage tank.
Further, both side surfaces of the rear of the chamber cover are provided with an upper rotating connecting rod, both side surfaces of the rear of the heating chamber are provided with a lower rotating connecting rod, and the upper rotating connecting rod and the lower rotating connecting rod are rotatably mounted through a rotating shaft to achieve hinge mounting of the chamber cover and the heating chamber.
Further, the automatic opening and closing coupler lock device comprises a cylinder connecting rod, an opening cylinder, two upper lock seats arranged at two ends of the front surface of the chamber cover, a first linkage shaft rotatably arranged on the front surface of the heating chamber, and two rotating rings fixedly arranged at two ends of the first linkage shaft, wherein one end of the cylinder connecting rod is rotatably arranged at one end of the 4 upper rotating connecting rod, the other end of the cylinder connecting rod is fixedly mounted onto the cylinder rod of the opening cylinder, the tail portion of the opening cylinder is hinged onto a cylinder tail supporting seat, the cylinder tail supporting seat and the heating chamber are both fixedly mounted on the upper surface of a mounting bottom plate, the bottom of each upper lock seat is provided with a U-shaped opening which is provided with the rotating shaft, one end of each rotating ring is in a hook shape, the other end of the rotating ring is rotatably provided with the cylinder rod of the locking cylinder, the lower surface of the mounting bottom plate is further provided with cylinder tail supporting seats, and the tail portion of each locking cylinder is hinged to the corresponding cylinder tail supporting seat on the lower surface of the mounting bottom plate.
Further, the cylinder rods of the two locking cylinders are rotatably mounted onto the end portions of the two rotating rings respectively, and a second linkage shaft is rotatably arranged between the two rotating rings.
Further, the automatic opening and closing coupler lock device also comprises a damping mechanism, the damping mechanism comprises a tension spring, one end of the tension spring is fixedly mounted at one end of the upper rotating connecting rod, which is far away from the end fixed onto the chamber cover, and the other end of the tension spring is adjustably mounted on the mounting bottom plate.
Further, the end portion of the tension spring is mounted on an L-shaped spring seat through an eyebolt, and the bottom of the spring seat is mounted into a bar-shaped hole mounted in the mounting base plate through a screw.
Further, a damper is mounted between the upper rotating connecting rod and the lower rotating connecting rod.
Further, the automatic vacuum reflow soldering device adopting contact temperature control also comprises a protective cover which is made of a L-type metal plate, the upper surface of the protective cover is level to the upper surface of the heating chamber, the bottom of the protective cover is fixed onto the mounting bottom plate, the protective cover internally covers all the parts of the automatic opening and closing coupler lock device on the mounting bottom plate except the upper lock seats, and the top of the protective cover is also provided with rectangular openings for inserting the U-shaped openings of the upper lock seats.
5
Further, the upper surface of the heating chamber is also provided with a convex sealing strip, which is an O-shaped sealing ring.
Further, the bottom of the heating chamber is also provided with a safe temperature sensor for monitoring the temperature in the heating cavity.
The present invention has the advantages that: the infrared radiant tubes and the heating plate above the infrared radiant tubes are applied as an infrared radiation non-contact heating manner to provide heat for the heating chamber, so that the heating speed and temperature can be high; the main thermocouple is used for detecting the surface temperature of the heating plate, the movable thermocouple is used for detecting the temperature of the element or fixture subjected to vacuum reflow soldering, the temperature data collected by the main thermocouple and the movable thermocouple is processed by the PID heating controller and fed back to the infrared radiant tubes, so that the heating speed of every area of the heating plate inside the heating chamber can be controlled, the heating evenness and efficiency can be increased, and further the product soldering quality can be ensured; by means of the movable thermocouple, the temperature of workpieces on the heating plate can be conveniently detected, so that convenience and rapidity can be achieved, and time and labor can be saved; the infrared radiant tubes arranged at equal intervals can further improve the heating evenness; the bottomless cuboid structure of the chamber cover and arrangement of the observation hole made of quartz glass can improve the space utilization rate and facilitate observation of soldering conditions, and time and labor can be saved and convenience and rapidity achieved; by means of the bracket and the supporting seats, the heating plate is convenient to place and free from deformation to achieve contact type temperature control, meanwhile, the heating plate is convenient and rapid to take and place, plugging and unplugging of the thermocouples can be saved during replacement of the heating plate, so that the cleaning and maintenance are convenient, and time and labor can be saved; the heating plate made of aluminum, silicon nitride or graphite and the optical coating can help increase the highest heating rate to 200 °C/min, and the heating evenness of the heating plate is better than +/-1%; by means of the water cooling mechanism and the air cooling mechanism, the water cooling plate can help reduce the temperature at the bottom of the heating chamber, nitrogen is sprayed in for rapidly cooling elements on the heating plate in the heating cavity of the heating chamber, the highest 6 cooling rate can reach 100 °C/min, and the high cooling speed helps improve the soldering efficiency; formic acid is applied to reducing elements oxidized due to high temperature, so that the soldering quality of the elements can be ensured; the automatic opening and closing coupler lock device can realize automatic opening and closing of the chamber cover, so that the defects of traditional thread locks can be solved, time and labor can be saved, meanwhile, automation facilitates independent operation by female operators, and the labor intensity can be reduced, the opening cylinder drives to rotatably open and close the chamber cover, the locking cylinders can drive the rotating rings to rotate and fasten the upper lock seats on the chamber cover so as to achieve locking between the chamber cover and the heating chamber, the tension spring can control the opening angle of the chamber cover, and the damper can buffer the opening momentum of the chamber cover; the protective cover can protect the parts around the heating chamber from dust and water, thereby prolonging the service life of equipment.
Brief Description of Figures FIG. 1 is an overall structural diagram I of the present invention; FIG. 2 is an overall structural diagram II of the present invention; FIG. 3 is the front view of the present invention; FIG. 4 is the right side view of the present invention; FIG. 5 is the left side view of the present invention; FIG. 6 is the top view of the present invention; FIG. 7 is the schematic view of the opened chamber cover of the present invention; FIG. 8 is the schematic view of the heating chamber; FIG. 9 is the top schematic view of the heating chamber.
In the figures: l-observation hole, 2-chamber cover, 3-upper rotating connecting rod, 4-damper, 5-cylinder connecting rod, 6-lower rotating connecting rod, 7-opening cylinder, 8-cylinder tail supporting seat, 9-rotating ring, l0-upper lock seat, 11-heating chamber, 12-first linkage shaft, 13-bearing pedestal, 14-tension spring, 15-eyebolt, 16-spring seat, 17-mounting bottom plate, 18-locking cylinder, 19-second linkage shaft, 21-tube sealing block, 22-protective cover, 23-heating plate, 24-sealing strip, 25-upper surface of the heating chamber, 26-rectangular opening, 27-infrared radiant tube, 28-main thermocouple, 7
29-supporting seat, 30-cooling gas nozzle, 3 1-safe temperature sensor, 32-vacuumizing outlet, 33-bracket, 34-reducing gas nozzle. Detailed Description The principles and features of the present invention are described below with reference to the accompanying drawings. The embodiment described is merely used for illustrating the present invention but not limiting the scope of the present invention.
According to FIG. 1-6, an automatic vacuum reflow soldering device adopting contact temperature control comprises a heating chamber 11, a chamber cover 2 forming a sealed chamber with the heating chamber 11, a plurality of infrared radiation tubes 27 arranged in the heating chamber 11, a heating plate 23 arranged above the infrared radiation tubes 27, a contact temperature control mechanism, a vacuumizing mechanism communicated with the heating chamber 11, and a cooling mechanism, wherein both the heating chamber 11 and the chamber cover 2 are made of quartz glass, one end of the chamber cover 2 is hinged onto the heating chamber 11, and the other end of the chamber cover 2 is mounted in a detachable and sealed mode onto the heating chamber 11 through an automatic opening and closing coupler locking device and used for isolating inside and outside air, so that the inner vacuum state of the heating chamber 11 avoids being influenced; according to FIG. 7-9, the upper surface of the heating chamber 11 is provided with a convex sealing strip 24, which is an O-shaped sealing ring; a heating cavity is formed in the heating chamber 11, and a plurality of the infrared radiant tubes 27 are mounted in the heating cavity for providing heat energy for infrared radiation non-contact heating, the power of every infrared radiant tube 27 is 750-900 W, and the number of the infrared radiant tube is 3-6; the inside of the heating cavity is provided with a supporting mechanism for arranging the heating plate 23, a contact type temperature control mechanism comprises a main thermocouple 28 and a movable thermocouple, the main thermocouple 28 is mounted in the heating cavity and in contact with the bottom of the heating plate 23, and the movable thermocouple is mounted on the chamber cover 2 and in contact with the upper surface of the heating plate 23; the automatic vacuum reflow soldering device adopting contact temperature control also comprises a PID (proportion-differentiation-integration) heating controller, and both the main thermocouple 28 and the movable thermocouple are electrically connected with the PID heating controller 8 through data cables. The infrared radiant tubes 27 and the heating plate 23 above the infrared radiant tube 27 are applied as an infrared radiation non-contact heating manner to provide heat for the heating chamber 11, so that the heating speed and temperature can be high; the main thermocouple 28 is used for detecting the surface temperature of the heating plate 23, the movable thermocouple is used for detecting the temperature of the element or fixture subjected to vacuum reflow soldering, the temperature data collected by the main thermocouple 28 and the movable thermocouple is processed by the PID heating controller and fed back to the infrared radiant tubes 27, so that the heating speed of every area of the heating plate 23 inside the heating chamber 11 can be controlled, the heating evenness and efficiency can be increased, and further the product soldering quality can be ensured.
The movable thermocouple adopts a platinum-rhodium wire with a diameter of 0.5 mm and a length of 300 mm, the bent shape and angle of the platinum-rhodium wire can be adjusted as required, and the tail end of the platinum-rhodium wire serves as a detecting point; by means of the movable thermocouple, the temperature of workpieces on the heating plate 23 can be conveniently detected, so that convenience and rapidity can be achieved, and time and labor can be saved.
Both ends of the infrared radiant tubes 27 penetrate through the side walls of the heating chamber 11 and are then fixed by tube sealing blocks 21, and the infrared radiant tubes are arranged at equal intervals; the infrared radiant tubes 27 arranged at equal intervals can further improve the heating evenness.
The chamber cover 2 is in a bottomless cuboid structure and is provided with an observation hole 1, which is round, square or in other shapes and is provided with high temperature resisting quartz glass; the arrangement of the bottomless cuboid structure of the chamber cover 2 and the observation hole 1 made of the quartz glass can improve the space utilization rate and facilitate observation of soldering conditions, and time and labor can be saved and convenience and rapidity achieved.
According to FIG. 8-9, the bottom surface of the heating plate 23 is in contact with a bracket 33 mounted on the inner bottom surface of the heating chamber 11, the inner four corners of the heating chamber 11 are provided with supporting seats 29 for supporting the four corners of the heating plate, the heating plate 23 is made of aluminum, silicon nitride or 9 graphite, and the surface of the heating plate 23 is coated with an optical coating; by means of the bracket 33 and the supporting seats 29, the heating plate 23 is convenient to place and free from deformation, meanwhile, the heating plate 23 is convenient and rapid to take and place, the cleaning and maintenance are convenient, and time and labor can be saved; the heating plate 23 made of aluminum, silicon nitride or graphite and the optical coating can help increase the highest heating rate to 200 °C/min, and the heating evenness of the heating plate 23 is better than +/-1%.
A vacuumizing outlet 32 is formed in the center of the bottom of the heating chamber 11, and the vacuumizing outlet 32 is communicated with the vacuumizing mechanism through a pipeline.
The cooling mechanism comprises a water cooling mechanism installed on the outer bottom surface of the heating chamber 11 and an air cooling mechanism communicated with the heating cavity of the heating chamber 11; the water cooling mechanism comprises a water cooling plate installed on the outer bottom surface of the heating chamber 11, and the water cooling plate is provided with a cold water inlet and a warm water outlet; the air cooling mechanism comprises a plurality of cooling gas nozzles 30 mounted on the side wall of the heating chamber 11, which are mounted in a penetrating mode on the side wall of the heating chamber 11 through vacuum penetrating sealing members, the vacuum penetrating sealing members are used for preventing vacuum electric conduction inside the heating chamber 11 and short circuit of a metal housing of the device, the vacuum pressure of the vacuum penetrating sealing members is 500-5 Pa, the bearable temperature is 400-700 °C, and the diameter is 20-40 mm; the cooling gas nozzles 30 are communicated with a nitrogen storage tank; by means of the water cooling mechanism and the air cooling mechanism, the water cooling plate can help reduce the temperature at the bottom of the heating chamber 11, nitrogen is sprayed in for rapidly cooling elements on the heating plate 23 in the heating cavity of the heating chamber 11, the highest cooling rate can reach 100 °C/min, and the high cooling speed helps improve the soldering efficiency.
The side wall of the heating chamber 11 is also provided with reducing gas nozzles 34, which are mounted in a penetrating mode on the side wall of the heating chamber 11 through vacuum penetrating sealing members, and the reducing gas nozzles 34 are communicated 10 with a formic acid storage tank; formic acid is applied to reducing elements oxidized due to high temperature, so that the soldering quality of the elements can be ensured.
Both side surfaces of the rear of the chamber cover 2 are provided with an upper rotating connecting rod 3, both side surfaces of the rear of the heating chamber 11 are provided with a lower rotating connecting rod 6, and the upper rotating connecting rod 3 and the lower rotating connecting rod 6 are rotatably mounted through a rotating shaft to achieve hinge mounting of the chamber cover 2 and the heating chamber 11. According to FIG. 3-6, the automatic opening and closing coupler lock device comprises a cylinder connecting rod 5, an opening cylinder 7, two upper lock seats 10 arranged at two ends of the front surface of the chamber cover 2, a first linkage shaft 12 rotatably arranged on the front surface of the heating chamber 11, and two rotating rings 9 fixedly arranged at two ends of the first linkage shaft 12, wherein one end of the cylinder connecting rod 5 is rotatably arranged at one end of the upper rotating connecting rod 3, the other end of the cylinder connecting rod 5 is fixedly mounted onto the cylinder rod of the opening cylinder 7, the tail portion of the opening cylinder 7 is hinged onto a cylinder tail supporting seat 8, the cylinder tail supporting seat 8 and the heating chamber 11 are both fixedly mounted on the upper surface of a mounting bottom plate 17, the bottom of each upper lock seat 10 is provided with a U-shaped opening which 1s provided with the rotating shaft, one end of each rotating ring 9 is in a hook shape, the other end of the rotating ring 9 is rotatably provided with the cylinder rod of the locking cylinder 18, the lower surface of the mounting bottom plate 17 is further provided with the cylinder tail supporting seats 8, and the tail portion of each locking cylinder 18 is hinged to the corresponding cylinder tail supporting seat 8 on the lower surface of the mounting bottom plate 17; the cylinder rods of the two locking cylinders 18 are rotatably mounted onto the end portions of the two rotating rings 9 respectively, and a second linkage shaft 19 is rotatably arranged between the two rotating rings 9; the automatic opening and closing coupler lock device also comprises a damping mechanism, the damping mechanism comprises a tension spring 14, one end of the tension spring 14 is fixedly mounted at one end of the upper rotating connecting rod 3, which is far away from the end fixed onto the chamber cover 2, and the other end of the tension spring 14 is adjustably mounted on the mounting bottom platel7; the end portion of the tension spring 14 is mounted on an L-shaped spring 11 seat 16 through an eyebolt 15, and the bottom of the spring seat 16 is mounted into a bar-shaped hole in the mounting bottom plate 17 through a screw; a damper 4 is mounted between the upper rotating connecting rod 3 and the lower rotating connecting rod 6; the automatic vacuum reflow soldering device adopting contact temperature control also comprises a protective cover 22, and the protective cover 22 is made of a L-type metal plate, the upper surface of the protective cover 22 is level to the upper surface of the heating chamber 11, the bottom of the protective cover 22 is fixed onto the mounting bottom plate 17, the protective cover 22 internally covers all the parts of the automatic opening and closing coupler lock device on the mounting bottom plate 17 except the upper lock seats 10, and the top of the protective cover 22 is also provided with rectangular openings for inserting the U-shaped openings of the upper lock seats 10. By means of the automatic opening and closing coupler lock device, the defects of traditional thread locks can be solved, time and labor can be saved; meanwhile, automation facilitates independent operation by female operators, and the labor intensity can be reduced; the opening cylinder 7 is provided to drive the chamber cover 2 for rotating opening and closing, the locking cylinders 18 is provided to drive the rotating rings 9 to rotate and fasten the upper lock seats 10 on the chamber cover 2 so as to achieve locking between the chamber cover 2 and the heating chamber 11, the tension spring 14 is provided to control the maximum opening angle of the chamber cover 2, and the damper 4 is provided to buffer the opening momentum of the chamber cover 2, and the protective cover 22 is provided to protect the parts around the heating chamber 11 from dust and water, thereby prolonging the service life of the device.
The bottom of the heating chamber 11 is also provided with a safe temperature sensor 31 for monitoring the temperature in the heating cavity. The working principles are as follows: when the device is applied to vacuum reflow soldering operation on a workpiece, the workpiece is placed on the heating plate, then a manipulator works to place the heating plate 23 onto the supporting seats 29, the opening cylinder 7 extend outs the cylinder rod to close the chamber cover 2, and the locking cylinders 18 extend out the cylinder rods to rotate the rotating rings 9 to fasten the upper locking seats 10; the vacuumizing mechanism works to vacuumize the inside of the heating chamber 11, then the infrared radiant tubes 27 work to rapidly heat the air inside the heating chamber 11 to 12 increase the temperature, the temperature of the heating plate 23 is increased along, the temperature of the element on the heating plate 23 is the same to that of the heating plate 23, and the solder paste is heated to melt; the main thermocouple 28 and the movable thermocouple detect the temperatures of the heating plate 23 and the element respectively and feed signals back to the PID heating controller; after the temperature reaches a system set value and is kept for a period of time, the solder paste is molten, the infrared radiant tubes 27 stop heating, the cooling gas nozzles 30 inlet nitrogen gas for cooling, and meanwhile, the water cooling plate at the bottom of the heating chamber 11 is inlet with cooling water for cooling; after cooling is completed, the reducing gas nozzles 34 inlet the formic acid to reduce the gas inside the heating chamber 11; the locking cylinders 18 retract the cylinder rods to drive the rotating ring 9 to rotate and separate from the upper locking seats 10, the opening cylinder 7 retracts the cylinder rod and drives the chamber cover 2 to open, and the heating plate 23 and the element can be taken out.
Above described is merely a preferred embodiment of the present invention and is not to be construed as limiting the invention.
Any modifications, equivalent replacements, improvements and the like that fall within the spirits and principles of the present invention shall fall into the scope of protection of the present invention. 13
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2026967A NL2026967B1 (en) | 2020-11-24 | 2020-11-24 | Automatic vacuum reflow soldering device adopting contact temperature control |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2026967A NL2026967B1 (en) | 2020-11-24 | 2020-11-24 | Automatic vacuum reflow soldering device adopting contact temperature control |
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| Publication Number | Publication Date |
|---|---|
| NL2026967B1 true NL2026967B1 (en) | 2022-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2026967A NL2026967B1 (en) | 2020-11-24 | 2020-11-24 | Automatic vacuum reflow soldering device adopting contact temperature control |
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| NL (1) | NL2026967B1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111715964A (en) * | 2020-07-07 | 2020-09-29 | 烟台华创智能装备有限公司 | Automatic vacuum reflow soldering equipment adopting contact type temperature control |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111715964A (en) * | 2020-07-07 | 2020-09-29 | 烟台华创智能装备有限公司 | Automatic vacuum reflow soldering equipment adopting contact type temperature control |
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