NL2023740B1 - Method and device for growing mushrooms, container, substrate package and device for use in such a method and welding device and method for welding foil - Google Patents

Abstract

You | The present invention relates to a method for growing mushrooms, comprising the steps of a) assembling a substrate package in the form of a column having a central shaft, and an upright extending through the shaft; b) placing the substrate package in a cultivation room; and c) carrying out a cultivation process and harvesting mushrooms during this process, wherein in step a) the substrate package is assembled on a holder formed by a support member having a bearing surface for the substrate package, and the support stand, which is connected to and extends perpendicular to the bearing surface; and wherein the method further comprises the step of: measuring and/or controlling, at least during step c), the airflow through the central shaft.

Description

Brief description: Method and device for growing mushrooms, container, substrate package and device for use in such method and welding device and method for sealing foil Description The present invention relates, according to a first aspect, to a method for growing mushrooms comprising the steps of: a) assembling a substrate package comprising an amount of mycelium-enriched substrate and a vapor-permeable foil envelope delimiting the substrate, the substrate package being substantially in the form of a column, such as a cylinder, with a central hollow shaft, through which extends an upright; b) placing the substrate package with the upright in a cultivation space; and ¢) allowing a process to continue growing the mycelium and causing mushrooms to grow on the outer periphery, through the envelope, or at least through an opening provided in the envelope, of the substrate package and harvesting during this process of mushrooms. Incidentally, it was mentioned here that it is not necessary for the substrate package to remain in one space during step c). The substrate package can be moved in step ¢) within a space, but also between spaces. For example, the substrate package can be moved from a room for further growth to a room where cultivation takes place.

Such a method is known in which a stand in the form of a pipe is inserted into a foil bag, after which the bag is filled with mycelium-enriched substrate. Alternatively, the bag is filled, after which the pipe is inserted into the substrate package. A mixed form is also possible. The substrate package thus formed, including the upright, is loaded on a kind of trolley which has a hole for receiving the upright in the supporting platform and transported to a cultivation area. The cultivation area has a floor with holes that are suitable for placing an upright. The actual growth/production of mushrooms takes place in the cultivation area. If the grower is of the opinion that the substrate has become depleted to such an extent that the substrate package must be replaced, the substrate package is removed from the cultivation area again with a hand cart.

The method described above enjoys a number of advantages over mushroom cultivation on cultivation beds, known from mushroom cultivation,

which method is particularly suitable for mass production and which method requires large investments in the cultivation space and machinery. The method described above also has advantages over mushroom cultivation in bottles, which method is often used in Asia and which is very capital intensive, both in terms of space and equipment, for the handling and storage of the bottles and the harvesting of mushrooms from the bottles. . For example, both the bed system and the bottle system are suitable for efficient mass production of mushrooms. In short, the bed and bottle system are only efficient for large-scale cultivation, but less suitable for smaller-scale mushroom production.

The method according to the present invention is based on the production of mushrooms on bags and packages with substrate in many shapes and sizes, in which no standard can be found. A disadvantage of relatively small substrate packages is that they involve a lot of handling costs. A drawback with relatively large substrate packages is that the substrate from the core becomes warm due to forcing and growth of mycelium and outgrowth of fruit bodies, and that the climate in the core of such bags and packages with substrate is difficult or impossible to control. . The shaft in the columnar substrate package from the introduction provides better airflow through the substrate and a more even temperature in the substrate. When hot gas, for example air, flows through the shaft, a chimney effect is created. The warmer the gas in the shaft, the harder the gas flow and the better the cooling caused by the draft. Because of the draft, warm air is extracted from the core of the substrate. In short, the shaft allows climate control for the substrate package from the core, instead of climate control by means of exchange of air through the outer surface. The method described in the introduction is easily scalable and makes efficient use of space. A substrate package, often about two meters high and with a diameter of about 40 cm, has a relatively large growing surface and when the growing surface has a circular cross-section, the fruiting bodies of mushrooms get more and more space as the stem grows further out of the substrate and the circumference of the mushroom grows. the fruiting bodies increase. This helps to improve growing conditions and prevent damage to mushrooms during growth and harvesting. It is noted that, although a columnar and in particular cylindrical cross-section is preferred for the substrate package, other shapes are also possible in order to achieve the same advantageous harvesting method. One can envisage cross-sections consisting of, instead of a circular shape, a polygonal shape, such as a hexagon, octagon, decagon or dodecagon, an oval shape and variants thereof. However, it has been found that this known method is very labour-intensive and that the growth of mushrooms over the circumference and the height of the substrate package formed from loosely poured substrate is often not very uniform due to the uncontrolled amount of substrate when poured into the bag. The same applies, incidentally, to the quality differences between different bags of substrate.

An improved form of the method described is known, with which mushrooms can be grown in a more efficient manner than with the method known from the introduction, in that in step a) the substrate package is assembled on a holder formed by a support member with a supporting surface for the substrate package, and the upright, which is connected to and extends at an angle, for example at right angles, to the bearing surface, and which is preferably upright. It is preferred that the substrate package remains connected to the holder during steps a) to ¢), but it is conceivable that the upright is temporarily or permanently removed from the substrate package during or between steps of the method.

Because a holder is provided with a support member and an upright extending at an angle relative thereto and connected thereto, the upright always extends at an angle, for instance vertically, at least when the supporting surface is kept horizontal. It is therefore not necessary to always align the upright approximately vertically, as in the known method, when the bag is filled with substrate. Furthermore, like the upright from the known method, the holder does not have to be placed in holes provided in the floor or another surface. The support member, provided that it is slightly flat on the underside and parallel to the support surface, makes it possible to deposit the substrate package at any desired location on a substrate.

The present invention now aims to provide an improvement over the above known methods.

According to a first aspect of the present invention, the method comprises actively influencing substrate conditions prevailing in the substrate package during slack c). By actively intervening in the relevant conditions,

for example, by actively influencing the temperature and the relative humidity in the substrate, the respective conditions can be optimized for a good forcing and growth of mycelium and outgrowth of fruiting bodies, the object of the present invention is achieved.

In a preferred embodiment of the present invention, the method comprises, at least during step c), measuring and/or controlling a fluid flow through the central hollow shaft. The fluid is usually air, preferably with the spatial environment of the substrate package. But the fluid can also be a gas or liquid, for which purpose the upright is connected to a gas or liquid supply. For this purpose, fluid control means are preferably provided which measure and/or control the flow of fluid through the central hollow shaft of the substrate package. These fluid control means may include sensors, such as a temperature sensor or a humidity sensor, flow promoting means, such as a fan, and flow restricting means, such as a shaft sealing cap. The inventor of the present method has recognized that the shaft of the substrate package provides the option of actively influencing, or at least regulating to a significant extent, the climate (humidity, temperature) in the substrate package. For example, air can rise through the shaft. Since heating and mycelial growth and thus heat are formed in the substrate, at least during step c), the already described chimney effect can occur in the shaft due to heated air which rises from the substrate in the shaft with an air-permeable shaft wall and which rises in the shaft with an air-impermeable wall. is heated indirectly by air from the substrate via conduction through the shaft wall. Fluid control means can stimulate or hinder the chimney effect, depending on the situation in which heat is ideally dissipated or in which heat is preferably not dissipated. The present invention provides a method of cooling the substrate, but at a particular stage of cultivation and/or under particular conditions it may be desirable to heat the temperature of the substrate package. Heating also falls under the term 'controlling' the climate in the substrate package.

The temperature and/or moisture sensors can be located in the central hollow shaft for indirect measurement, but a direct measurement of temperature and/or moisture via a sensor in the substrate itself is also conceivable. The fluid flow through the shaft during the cultivation process can hereby be measured and/or adjusted in a targeted manner in order to optimize the temperature and/or the degree of humidity in the substrate. The optimum fluid flow may vary over the course of the culturing process. The term “during” in this document, unless explicitly defined otherwise, is to be interpreted broadly and includes both “during an entire step” and “during only part of a step”.

To this end, according to a second aspect, the present invention provides a holder suitable for use in the first aspect of the present invention, wherein the holder is formed by a support member with a bearing surface for a substrate package, and an upright, which is connected to and arranged at an angle. for example extends perpendicular to the supporting surface and is herein preferably oriented upright, and wherein the upright comprises a hollow upright, and wherein the holder is provided with fluid control means, which are designed for actively influencing substrate conditions prevailing in the substrate package. It is noted here that the position of the fluid control means in or on the container partly depends on the function of the relevant fluid control means. For instance, various fluid control means can be arranged in the shaft via the holder, whereby the gradient of a relevant parameter (such as for instance air humidity and temperature) in the shaft can be made more transparent in order to subsequently monitor the flow of fluid through parts of the hollow shaft of the substrate package more specifically. controlled influence. It is for instance conceivable to provide fluid control means, such as for instance temperature sensors, at the inflow and outflow openings of the hollow shaft. It is emphatically stated here that the terms “upright” and “column” seem to suggest a vertical orientation. However, this is only a preferred orientation, but a column does not have to be upright, especially during the entire process.

In an alternative or additional embodiment, the invention provides a system designed to control, or at least significantly regulate, the climate in the substrate package at least during step c) by means of measuring and/or controlled influencing of the flow of fluid. through the hollow shaft. To this end, the system preferably comprises fluid control means adapted for cooperation with the container according to the present invention. Preferably, the fluid control means, for instance one or more fans, are in fluid communication with the hollow shaft of one or more containers.

Because the upright has a fixed, preferably vertical, orientation with respect to the supporting member connected thereto, and is thus assembled into a stable holder, the holder with the substrate package which is formed around it and which is later formed, lends itself much more than the known bag. with separate stand for mechanical manipulation during the cultivation process, and thus ultimately also for automation steps. Thus, the container and the method according to the first and second aspect of the invention, each individually and especially in combination, thus provide the possibility for efficiency improvement with respect to the known system, as will be further elucidated below, and the intended object has been achieved.

Preferably, an upright is used which is made of heat-conducting material, preferably metal. Thermally conductive material is suitable for transferring or at least conducting excess heat from the core of the substrate to the interior of the upright, from where the heat in the shaft can be removed upwardly from the substrate package by a fluid flow. When the substrate is heated, heat is then supplied through the shaft and conducted through the heat-conducting wall into the substrate. Metals are generally excellent heat conductors and moreover provide the necessary strength, which contributes to the durability of a container.

Preferably a hollow upright is used which is provided with an air and moisture impermeable wall. A chimney effect can easily be achieved in a hollow upright, whereby excess heat and any excess moisture can be quickly removed from the substrate package. An air and/or moisture-permeable wall of the holder simplifies transport of air and/or heat from the substrate package into the hollow upright. However, it has been found that with a post with a wall which does not allow air to pass through, but which does conduct heat, even better results can be achieved. Heat from the substrate package is then conducted through the wall of the upright, whereby fluid present in the hollow upright heats up and rises. Moisture that is led in the airflow towards the upright condenses against the outer wall of the upright and drains down the upright.

For good support by the upright of the substrate, it is preferred that the substrate connects to the upright. However, it is also possible that the shaft of the substrate package has a larger cross-section than the cross-section of the upright, whereby air and/or moisture can more easily move up and down the outer wall of the upright, respectively. In addition, there is a risk that in the event of a poor connection of the substrate to the wall of the upright, air collected near the upright has an insulating effect, which may reduce the effect of the invention.

For a good discharge of excess heat and moisture, the holder comprises at the top and preferably also at the bottom a fluid passage opening which opens into the cavity or shaft of the substrate package and communicates with the environment.

It is advantageous if at least one sensor is provided, for instance a temperature sensor and/or a moisture sensor, and the temperature and/or the fluid humidity of fluid flowing through or out of the shaft of the substrate package, or the humidity in the substrate package itself, is at least one sensor is measured. In this way an image can be obtained of the substrate conditions prevailing in the substrate package. This feedback can be a reason to actively influence the environmental conditions or can be an indication of the growth rate of mycelium or mushrooms.

The mushroom production can be further optimized if a controller is provided that directs the fluid flow through the cavity of the substrate pack. This is preferably possible on the basis of the value of temperature and/or air humidity that is fed back by the at least one sensor.

The shaft, or at least the upright extending through the shaft, is optionally closable by a closing means and can be or be closed during the cultivation phase. When the shaft is closed, for example at the top, the chimney effect is blocked. As a result, the substrate package is cooled and dehumidified less and the temperature in the substrate package is higher than when the shaft is fully opened. In this phase of the cultivation process, this benefits the development of the fruit bodies. When the shaft is closed at the bottom, a chimney effect still occurs somewhat, but to a lesser extent than with a shaft that is fully open. For example, a closed upright can also be used to fill it with a warm medium, for example water, to heat the substrate.

The substrate package is preferably assembled in that in step a) the container is guided from below into a columnar, such as a cylindrical, mold and the mold is subsequently filled from above with substrate, which is preferably compacted with a mortar. It is herein possible for the upright to lower during the assembly of the substrate package, or for the mold to be raised during the assembly of the substrate package. Due to the predictable orientation of the container and the use of a mold, the substrate package can be assembled efficiently and with fixed dimensions. Uniformity increases the predictability and thus also the controllability of the mushroom production.

When assembling the substrate package, the substrate package is moved downwards and a tubular film is preferably arranged around the substrate package when leaving the mould. The tubular foil thus keeps the substrate together and the substrate package in shape.

In addition, if jack pressure control means are provided when assembling the substrate package which control the pressure that the jack exerts on the substrate, it is possible to regulate the composition, such as the degree of compaction of the substrate in the substrate package over the height of the substrate package, at preference to be uniform. This is beneficial not only for an even growth of mushroom growth, but also for the airflow through the substrate package. The auger pressure control means which controls the pressure that the auger exerts on the substrate also provides the opportunity to increase the uniformity of the different substrate packs.

In the method, according to a third aspect of the invention, when assembling the substrate package, a distance measuring device and a weight or force measuring device are provided, wherein the distance measuring device directly or indirectly and continuously or discontinuously measures the instantaneous height of the substrate package during the assembly of the substrate package. and wherein the weight or force measuring means measure the instantaneous weight or the instantaneous force exerted on the carrier member during the assembly of the substrate package and corresponding to the distance measuring device, and wherein the results of the two measurements are fed back to a control of the jack to actuate the jack for assembling a substrate pack having a substantially uniform substrate density over the height of the substrate pack. This uniform density has the advantage that the climate within the substrate, at least in the height direction of the substrate (parallel to the longitudinal axis), is more constant than with a less uniform distribution. After all, in places where the density is higher, there is less room for air to flow through and it is expected that more heat will be generated, or at least a higher temperature prevails, than in places where the density is lower.

In a fourth aspect, the present invention relates to a substrate package comprising a quantity of mycelium-enriched substrate and a vapor-permeable film envelope delimiting the substrate, the substrate package being substantially in the form of a column, such as a cylinder, with a central hollow shaft, and an upright extending through the shaft. As discussed, a substrate package is known, consisting of a bag of air-permeable foil, filled with substrate and an upright extending therethrough. The disadvantages of such a substrate package have already been discussed above in relation to the first aspect of the invention.

According to the fourth aspect, the object of the present invention is to provide a substrate package with which the process of mushroom cultivation can be carried out in a more efficient manner. This is achieved according to the invention by a substrate which is carried by a support member of a holder formed by the support member with a bearing surface for the substrate package, and wherein the upright is connected to and extends perpendicular to the bearing surface. The advantages of such a substrate package correspond to the advantages discussed in relation to the first aspect of the invention.

In a preferred embodiment according to the fourth aspect of the present invention, the outer circumference of the upright corresponds at least substantially to the diameter of the central hollow shaft. That is, the outer periphery of the upright abuts the wall of the central hollow shaft extending through the substrate package.

The upright of the present invention is preferably hollow to permit fluid flow through the upright, allowing heat exchange between the substrate and fluid flow through the shaft through the wall of the hollow upright. The hollow upright provides the option of generating a climate control in the substrate package during the mushroom production by means of a fluid flow rising in the shaft.

If the holder has a fluid passage opening opening into the cavity of the sub-jet package at the top and preferably at the bottom, which communicates with the environment, this promotes the flow of fluid through the shaft and thus through the substrate.

It is preferred that the vapor-permeable foil is made of a perforated plastic, preferably biodegradable plastic. The plastic can, after it has been arranged around the substrate, be cut to create space for mushrooms growing from the substrate. The perforated film can serve for the exchange of gas, for example air, between the substrate and the environment. Incidentally, the perforations in the plastic are preferably so small that the plastic foil functions as a kind of filter, whereby competitor fungi are kept outside the substrate.

A substrate package composed in mushroom production according to the present process typically has a height of 2 meters and a diameter of 40 cm. The shaft has a diameter of 10 cm. However, the invention can perfectly be applied to substrate packages with other dimensions, for example where the substrate package has a height of between 100 and 250 cm, preferably between 150 and 225 cm, and an outer diameter in the range of 25 to 60 cm. cm, preferably between 30 and 50 cm and the shaft has a diameter ranging from 3 to 20 cm, preferably from 5 to 15 cm.

Further, a cylindrical shape is preferred for various reasons. Such a shape results in the thickness of the substrate package, measured from the shaft or shaft, being uniform. But the invention can also be implemented with substrate packages with a different cross-sectional shape as already described above.

According to a fifth aspect, the present invention relates to an assembling device for assembling a substrate package, the device comprising a frame, a vertical columnar mold held to the frame, a jack, e.g. in the form of a hollow screw, a container conveyor arranged for transporting holders for substrate packages to below the mould, a substrate package conveyor adapted for discharging the holder with the substrate package from below the mould, after assembly of a sub-jet package, wherein the holder conveyor and the mold are arranged such that between the holder conveyor and the mold has sufficient space for the containers to pass, an elevator for raising and lowering a container from the container conveyor in the mold, and a substrate conveyor for feeding the substrate up the mold and introducing the substrate into the mold. The assembly device preferably includes a control device that controls the movement of the container before and after assembly and the movement and weight of the auger. The container conveyor and the substrate conveyor may be parts of an integral container-and-substrate conveyor, wherein the container can for instance be taken off the conveyor for assembling a substrate package, and after assembly can be placed on the same conveyor for further transporting the container with substrate.

The assembly device preferably comprises a weight or force measuring device which measures the instantaneous weight or the instantaneous force exerted on the support member during the assembly of the substrate package. The result of the measurement can be used to control the pressure of the jack. while assembling the substrate package.

The assembly device preferably comprises a distance measuring device which during. assembling the substrate pack directly or indirectly and continuously or discontinuously measures the instantaneous height of the substrate pack. The results of the distance measuring device can also be used to adjust the assembly process, for example the pressure of the jack.

The assembly device preferably comprises a tubular foil device with which, when used, a tubular foil is created which serves as an envelope for a substrate package that is assembled during the assembly of the substrate package. Preferably, the tubular foil device comprises or cooperates with a welding device further described in this document and defined in the claims.

The present invention further relates to the sealing of a flat foil to a tubular foil. A known method for this makes use of sealing bars. In the known method, the foil is supplied intermittently, i.e. supplied over a specific distance. The distance corresponds to the length of a sealing bar. The supply is then stopped and transformed from flat foil into tubular foil by means of the sealing bar. This cycle repeats.

In the packaging industry, welding devices and methods are known for welding a flat foil to a tubular film. An elongated flat film is fed to a filling device. This is done step-by-step, wherein the foil is always transported over a distance which corresponds to the height of a package to be formed, after which the transport is temporarily interrupted, i.e. the supply of foil is stopped. Prior to being welded to a tubular film, the foil is folded in such a way that the two side edges come into contact with each other, for instance overlap each other. The folded film passes two opposing sealing bars whose length corresponds substantially to the length (height) of a package to be formed, and during the interruption of the transport the contacting side edges of the foil are sealed by the sealing bars. welded together. As a rule, a double transverse weld is also applied across the width of the film at the same time. The lower transverse seal closes the tubular foil at the top of a package filled in a previous step and the upper transverse seal forms the closed bottom side of a package to be filled in a next step. The tubular foil is then transported further over a distance which corresponds to the length of a package, wherein the newly formed tube with the sides and bottom welded together is filled with a product to be packaged. In the next welding step, the top of the packaging is welded shut.

Such a welding device and method are used for packaging relatively small quantities of product which are supplied properly, that is to say, evenly dosed. The device and method are used for high speed packaging of foodstuffs, such as candy or animal feed. However, the device and method are less suitable for manufacturing relatively long packages, i.e. packages in which a longitudinal weld has to be arranged over a relatively large distance during production. In this document, the length of a package is understood to mean the distance in the longitudinal direction of the film. Relatively long sealing bars are required for relatively long packages, wherein the correct orientation of the foil between the sealing bars increases more than directly proportionally with increasing length of the sealing bars. The method is also less suitable when the supply of product to be packaged is not constant, in the sense that the period of time between two interruptions of the supply of film and the sealing of the film varies depending on the supply speed of material to be packaged.

According to a sixth aspect, the object of the present invention is to provide a method which is more suitable than the known method for manufacturing relatively long packages, and/or which is particularly suitable for applying a seal in dependence on the feed rate of the material. foil, especially a long continuous weld.

As a result of which a flat foil to be welded passes the welding element at varying speed.

This object is achieved according to the present invention by a method in which it is possible for a sealing element to be in substantially continuous contact with the foil to be welded and in which the sealing element welds the foil together when the sealing element passes through the foil.

This allows an uninterrupted weld to be applied over a large distance.

For adapting to the varying speed, a speed sensor is preferably provided for detecting the transport speed.

This can take place directly or indirectly and the speed sensor does not therefore have to be fixedly connected to the welding device.

Means are further provided which are suitable for varying the heat supply to the welding element in dependence on the observed transport speed of the foil.

Thus, the temperature, in use, is adapted to the length of time during which the foil is in contact with the sealing element as it passes the sealing element for the application of a reliable seal.

It is conceivable that a higher temperature is required if the contact time of the foil with the welding element is shortened and vice versa.

The temperature is thus controlled on the basis of decelerations and accelerations in the transport speed of the film.

It will be clear that instead of one flat foil, two flat foils can also be supplied, the two flat foils being welded to each other on either side by means of welding elements.

It is also possible to weld together three or more flat foils of the same material or of different materials.

In a preferred embodiment according to the invention, the film is fed at a varying speed, wherein the feed speed of the film is measured and the heating, and thus the temperature, of the sealing element is controlled in dependence on the feed speed.

Thus, the speed of the welding can be made dependent on an earlier or later step in a process.

The sealing element is preferably a heat controlled roller which runs over the foil to be welded.

A counter tread is then provided, wherein the foil moves between the hot roll and the counter tread.

Optionally, the supply of the film is interrupted for applying a transverse weld, which can be applied by means of a transverse beam oriented perpendicularly to the longitudinal direction of the film.

Alternatively, it is possible that the supply of the film is not interrupted and the transverse sealing beam is moved along with the film during the application of the transverse seal at the momentary feed rate of the film.

According to a seventh aspect, the present invention relates to a welding device for welding together foils in contact with each other.

International patent application WO 2012/055414 A1 discloses a welding device in which a roller with a cylindrical surface rotates about an axis. Means press the contacting part of two layers of material to be welded together against the surface of the roll. Transport means transport the material to be welded along the roller at a constant speed. A welding surface is provided on the periphery of the roller, which surface is locally heated to a temperature close to the melting temperature of the material to be welded. The heat transfer to the welding surface can be quickly interrupted, and the welding surface cooled, so that the welding surface can remain in contact with the material to be welded when the transport is interrupted. In this way it is prevented that material which remains in contact with the welding surface during interruption of the transport, i.e. stationary, can melt.

According to the seventh aspect, the object of the present invention is to provide a splicing device which is better than the known splicing device for manufacturing relatively long packages from flat film, wherein the feed unit of the film to be welded varies or can at least vary. This object is achieved according to the present invention by a welding device for welding together vapour-permeable contacting, for example overlapping, parts of flat foil, and comprising: a welding roller provided with a welding element over the tread, which at least substantially the entire circumference of the welding roller is provided with a welding element, - a counter bearing surface situated opposite the running surface of the welding roller, - control means for controlling the heating of the welding element - a supply device which, when used, supplies an elongated flat foil to the feeding a splicer, feeding two side edges of the film in contact with each other between the tread of the splice roller and the counter tread, - a speed sensor suitable for measuring the feed rate of the film, and

- drive means which drive the welding roller in dependence on the feed speed of the film, the welding device being designed to adjust, on the basis of results from the speed sensor, the temperature of the welding element so as to allow two parts in contact with each other and between the tread and to weld the flat foil parts passing the counter face together.

Advantages of such a welding device have already been mentioned above. By measuring the feed rate of the flat foil, the temperature of the welding element can be adapted to the instantaneous feed rate. It is preferred that the device comprises cooling means, or at least a supply device for cooling means, designed to cool the welding element, preferably quickly, if desired.

The cooling means can be used at a relatively rapid to abrupt deceleration of the transport speed to rapidly lower the temperature of the welding element, possibly also of the tread, in order to prevent melting of the foil in such situations. Sometimes a cooling element does not cool itself quickly enough when the heating of the welding element is interrupted. This also prevents the foil from being welded together reliably, or even not at all, at a high feed rate.

In a preferred embodiment of the invention, the welding device comprises cooling means controllable by the control device, with which the welding element can be actively cooled. The cooling means make it possible to cool the welding element quickly when the feed rate is rapidly reduced, so as to prevent the foil from melting through.

A simple embodiment for this provides that the cooling means comprise fluid channels extending through the welding roller to the running surface, through which a cooling fluid can be guided to the running surface. In addition, when channels are provided for the discharge of cooling fluid used for cooling the welding element, a rapid flow of cooling fluid through the welding roller is possible. Depending on the feed rate of the foil and the temperature of the sealing element, coolant can be fed to the cooling element. Insulation means can be provided in a supply channel for cooling fluid in order to prevent heat exchange with (the supply channel in) the welding roller during supply of cooling fluid. This improves the controllability of the cooling process.

Preferably, the welding element comprises a welding wire wrapped around the running surface of the reel, wherein the welding wire preferably has two ends which are connected to a voltage source. A welding wire can thus be heated in a simple manner, for instance by means of sliding contacts.

When a sensor suitable for measuring the feed rate of the film is provided, or is communicatively connected to the control means, the temperature of the welding element can be set or adjusted in dependence on a feed rate sensor in question. The feed speed of the foil can be measured directly, but also indirectly, for example by the speed of the welding roller that is driven by the passing foil. It is preferred that the welding device is provided with, or is communicatively connected to, a sensor suitable for measuring the current temperature of the cooling element. A temperature registered by the temperature sensor can be fed back to the control means and used by the control means for setting or adjusting the temperature of the welding element. Optionally, the result of a measurement performed by the temperature sensor can be adjusted in order to adjust the feed speed of the foil and, optionally, a feed of material to be poured into the package to be assembled. For example, if due to circumstances the temperature of the welding element is not sufficiently high, the relevant speed can be reduced to prevent the formation of bad welds.

In order to prevent the risk of an unintended adhesion of foil to the welding roller and/or the counter tread, it is preferred that non-stick material is provided on the tread or counter tread, respectively.

The device is preferably suitable for use in a packaging machine with which packages are manufactured from a flat foil and the packages are filled during their manufacture with a product to be poured or introduced into a partially formed package. In known devices, a partially formed package has a front panel, a back panel, a welded bottom, a folded side edge and a fully welded side edge (or two folded side edges and a fully welded seam on the back panel or alternatively two welded side edges). In the present invention, the weld can be made during the filling of the package.

The device is furthermore preferably suitable for use in the method and/or the system for growing mushrooms as described above.

The invention will be elucidated below with reference to the appended drawing, in which: FIG. 1 is a perspective view of a container according to the present invention; fig. 2 is a perspective view of a substrate package according to the present invention; fig. 3 is a perspective view of a system for assembling a substrate package according to the present invention; and FIG. Figure 4 shows a welding roller of a welding device according to the present invention. Figure 1 shows a holder 1 according to the present invention, wherein the holder 1 comprises a support member 2 with a bearing surface 3 for supporting a substrate package (not shown}, and an upright 4, which is connected to and extends at right angles to the support surface 3. In this exemplary embodiment, the upright 4 is designed as a hollow upright. The support member 2 is designed in such a way that the support element 3, and thus a lower end of the hollow upright 4, rests on any surface. distance A is located from a substrate on which the container is or has been placed. This distance A is chosen such that suction of air (shown in figure 1 with arrows P1) as cooling medium or fluid by means of the interspace 6 created by the carrier member 2 to the lower end of the hollow upright 4. The air drawn in by the hollow upright 4 is then passed through the hollow upright 4 (and therefore upright 4) is guided to leave the holder via the upper end 8 of the hollow upright 4 .

Although not shown in figure 1, the upright 4 can be provided with openings, for instance in the wall of the hollow upright 4, to better regulate the temperature and humidity of the substrate package (not shown in figure 1) to be carried by the holder 1 . However, a solid wall is preferred. Regulation of the temperature and humidity of the substrate package to be carried by the holder 1 is in any case regulated by means of the fluid control means according to the present invention. Such a fluid control means, for example air control means, is preferably shown in the form of a cover 9 near the top end of the hollow upright 4. Near the bottom of the upright 4, a plug 7 is shown, with which the bottom of the hollow upright 4 can be closed. .

Cover 9 is provided for being able to close or unlock the upper end 8 of the hollow upright 4 in order to thus inhibit or promote the suction effect of air.

At the top end 8 of the hollow upright are a schematically shown temperature sensor 12 and a moisture sensor 13, which, when used, measure the temperature and moisture content, respectively, of the fluid flow passing the sensors 12, 13.

The cover 9 has a shape, the central part 9b of which adjoins the shape of the top end 8 of the hollow upright 4, around which central part 9b a flange 9a extends.

When used, the central part 9b closes off the hollow inside of the hollow upright 4, while the flange 9a closes off any play between the hollow upright 4 and the shaft 5 formed by the inner wall of the substrate material (not shown in figure 1).

When the cover 9 is arranged on a substrate package, the cover 9 blocks, or at least impedes, an air flow through the shaft, both through the hollow upright 4 and through the possible space between substrate and upright 4. Figure 2 shows a substrate package 10 according to the present invention. invention again.

The holder 1 from figure 1 is partly recognizable herein, wherein the hollow upright 4 (and thus also the central shaft, ie the central hollow space in the substrate material 11 through which the hollow upright 4 extends} is completely surrounded or bounded, respectively, by substrate material. 11. In this exemplary embodiment, the substrate material 11 fits closely to the hollow upright 4, so that the formation of an air flow between the shaft 5 and the hollow upright 4 is prevented as much as possible.

The substrate material 11 has the shape of a cylinder in figure 2, but other embodiments are also conceivable.

The substrate material is wrapped with a non-drawn gas-permeable foil.

When a substrate package is used, i.e. during the continued growth of the mycelium and during the growth of mushrooms, heat development occurs in the substrate material 11, as a result of which the temperature in the substrate material 11 rises.

As a result, air in the shaft 5 of the substrate material 11, i.e. in the hollow upright 4 and/or between the substrate material 11 and the upright 4, heats up relative to the air in the substrate material 11 by withdrawing heat from the substrate material. surroundings.

When air is used as the fluid, as in this exemplary embodiment, the warmer air rises and the air pressure in the shaft 5 falls. As a result, air is drawn from below the shaft 5 into the shaft 5, and the drawn air will also heat up in the shaft. . The draft thus generated and indicated here by arrows P1, P2 can be artificially stimulated or slowed down by means of air control means, which can comprise the passive temperature sensor 12 and/or the moisture sensor 13 . Temperature and/or moisture sensors can alternatively or additionally be incorporated in the substrate material 11 at defined positions. In such a case, the temperature and humidity in the substrate material 11 can be measured directly, rather than indirectly based on an airflow through the hollow post 4. Measuring temperature and moisture content, sending information to a (remote) ) control device and the actuation of active air control means, such as for instance a fan, is generally known per se and will not be described in detail in this document.

The measurement results of the temperature 12 and humidity sensors 13 can be sent to a control device (not shown) and processed there. On the basis of the measurement results, measures can be taken, whether or not by the control device, to influence the fluid flow through the shaft 5. This can be done by means of active air control means, such as a fan (not shown) that blows air into the shaft or pulls air out of the treasure just at the top of the shaft, or a plug such as cover 9 at the top or plug 7 at the bottom of the shaft. hollow upright 5 which impedes or even blocks such an airflow.

Figure 3 shows a system 20 for assembling a substrate pack 10 according to the present invention. The system 20 shown in Figure 3 has already formed a substrate pack 10, which is placed on a container conveyor 21, such as rails.

The system 20 comprises a device 22 for assembling a substrate package 10 comprising a frame 23, a vertical columnar hollow mold 24 which is connected to the frame 23 and which is shown partly cut away in figure 3 for a clear explanation. In figure 3 the mold 24 is fixed in a fixed position with the frame 23. It is also conceivable to have the mold 24 movable back and forth (preferably in vertical direction) with the frame 23.

The device 22 further comprises a jack 25 in the form of a hollow screw located in the mold 24 by means of a gear transmission 39 .

Through the cavity is fed the substrate material 11, which is pressed by the underside 25a of the screw as the screw rotates.

It is noted that the mold 24 is placed such that the container conveyor 21 is designed for transporting containers 1 for substrate packages 10 to below the mold 24, and for discharging the substrate package 10 from under the mold 24 after a substrate package 10 has been assembled. device 22 of figure 3 further comprises an elevator 26 for moving a container 1 upward and downward from the container conveyor 21 in the mold 24 along the frame 23. In addition, the device 22 is further provided with a substrate conveyor 27 for transferring it to a funnel 28. supply the substrate material 11 to be formed into a substrate package package above the mold 24 and pour into the mold 24 a weighing sensor 38 which measures the weight of the substrate package forming during filling on the elevator 26 on which the substrate package rests.

Furthermore, a composite distance sensor 29a, 29b is provided, with which the position of the bearing surface 3 at 29b of a holder 1 relative to a reference position at 29a is determined.

This distance increases during the assembly of a substrate package.

On the basis of the measurement results of, on the one hand, the distance measured by the measuring sensor and, on the other hand, the weight measured by the weighing sensor, it can be deduced whether a homogeneous filling, or compaction, of the substrate package is maintained during the assembly of a substrate package.

A welding device 30 is attached to the frame 23, which is described in more detail below with reference to Fig. 4 .

A roll 42 of plastic film is placed on two cylinders 41a, 41b, which may or may not be driven in rotation.

The foil serves to encase a substrate package 10 which is assembled by the device, so that the substrate package 10a is held together.

Hereinafter, the operation of the system 20 will be explained.

When the device 22 has deposited a composite substrate package 10 on the container conveyor 21, it is discharged to a processing space for further scalding and growth of mycelium or mushrooms, respectively.

Subsequently, an empty container 1 is carried by the container conveyor 21 to the elevator 26 and raised by the fifth 26 until the bearing surface 3 of the carrier member 2 contacts, or is at least close to, the lower end of the mold 24. The elevator 26 can thereby pass the rails of the container conveyor through vertical slots (not shown) provided for this purpose in the container conveyor 21 when the containers 1 are moved vertically, and keep a path free for the carrying brackets. Although the mold is shown here cut-away, the wall of the mold 24 is continuous all around. Substrate material is then supplied via substrate conveyor 27 and poured into the funnel 39 . The substrate material passes from the hopper through the conveying portion of the helical jack 25 onto the bearing surface 3 of the container 1. By rotatingly driving the helical jack 25 with gear transmission 39, the underside 25a of the jack presses the substrate material. Simultaneously, the elevator 26 is moved downwards. The weight of the substrate material collected on the support surface and the pressure of the auger is sensed by the weighing sensor. The position of the bearing surface 3 of the container 1 The control device (not shown) is programmed to control the movement of the lift 26 on the basis of the data from the distance sensors 29a, 29b, and the weight sensor 38, with the aim of achieving a uniformity as possible. density of the substrate 11 in the substrate package 10 being assembled.

When the elevator moves downwards, a tubular foil is also arranged around the substrate package 10 . The downward movement of the flat foil and the lift 26 is synchronized by the control device. The foil is thus pulled down at the end past the welding device 30 to past the lower end of the mold 24 and, when it is used, to beyond the support surface 3 of the holder 1, so that during and after assembling the substrate package no or as little substrate as possible. 11 at the bottom can leak out. Alternatively, the flat film is frictionally pulled through the tread 33 (see Fig. 4) and unwound from the roll of flat film 42 . The film unwinds from the roll of flat film 42 and is guided to the mold 24 to wrap around the mold 24 . Both sides of the flat foil are brought into overlapping position with each other (alternatively, they can be brought into contact with each other with the end sides) and guided along the welding device 30 . The welding device 30 welds the sides of the flat foil together and thus a tubular foil is formed, which is arranged around the substrate package where the substrate package being formed together with the holder 1 exits the mold 24 . Next, the substrate package 10 is placed on the container conveyor and the above steps are repeated with the next container 1 .

Figure 4 illustrates a portion of welding apparatus 30 for use in the present invention, showing a welding roll 31 with a welding element 32 passed over the race 33 of the welding roll 31 . Carbon brushes 34 are provided for the supply of the welding element 32 . In addition to the welding element 32, two insulating zones 35 are provided on the tread which insulate the welding element 32 from the rest of the tread.

33. Even further outwards, cooling holes 36 are provided over the tread 33 on both sides, which are connected via a cooling channel 37 via a hollow shaft 43 to an integrated cooling medium reservoir 40 which is provided with an air supply 41. The furrow also runs through the hollow shaft 43. wiring required for the controller.

The welding roller 31 is rotationally driven by means of a gear transmission 42 in communication with a control device as described hereinafter, and wherein a gear 42a driven via drive motor 44 transmits rotational movement to the hollow shaft 43 through a connection with the hollow shaft. 43 connected gear 42b. The hollow shaft 43 is supported by two bearing blocks 44. Adjusting rings 45 are provided on one of the bearing blocks 44 for a good positioning of the welding roller 31.

In use, two or more layers of foil are guided between the running surface 33 of the welding roller 31 and a counter running surface (not shown here). The counter face can be designed in different ways. It is important that during sealing it provides a counter pressure to the welding roller 31 and that no or minimal heat leaks away through the counter face during welding. To this end, in the exemplary embodiment, a static plastic surface is provided on the outside of the mold 24. This can be of compact design in order to prevent the counter face from forming an obstruction for the tube to be formed by the foil. The passing foil is heated by the sealing element 32 to a desired temperature, at which time the overlapping layers of foil melt together. This in itself is a known method. With the welding device according to the present invention, the temperature of the welding element 32, or at least of heat transferred to the foil, can be influenced quickly. On the one hand, by heating the welding element 32 by means of the carbon brushes 34 and wiring (quickly). On the other hand, by passing cooling medium from the reservoir 40 via the hollow shaft 43 and the channel 37 to the cooling holes 36 for rapid cooling. A sensor (not shown) measures the speed at which the foil to be welded passes the sealing roller 31 . The welding roller 31 is driven by means of the control device (not shown), such that the running surface 33 and thus also the welding element 32 has at least substantially the same speed as the passing foil. When the speed of the film and the welding element 32 increases, the temperature of the welding element 32 (if desired) is increased. If, on the other hand, the feed speed of the film to be welded decreases, possibly to a standstill, the temperature of the welding element 32 (if desired) is increased. } is lowered and the film is cooled if necessary by the cooling medium in order to prevent the film from melting through. Thus, the sealing element 32 can both heat up quickly and cool down quickly, whereby the speed of the film can be varied to a much greater extent than in hitherto known welding devices for foil.

The person skilled in the art in the field of foil welding can determine the desired temperature on the basis of the foil material to be welded and the speed of the foil, i.e. a temperature (range) at which the overlapping passing layers of foil ‚ are fused to each other, but at which the foil does not melt.

A device as described in this document can also be used for other purposes than for welding tubular film for columns of compost. In fact it gives producers, for example in the packaging industry, the possibility to look at the packaging process differently. Until now, when a supply of product to be packaged is irregular, measures had to be taken in the supply line to make the supply more regular.

Such measures can lead to loss of packaging capacity or to undesirable buffers in the packaging line. With the welding device according to the present invention, such measures are not necessary.

Only some embodiments of the present invention are described in the figures and the description. However, many variants and modifications, whether obvious or not, are conceivable within the scope of the present invention, which is limited only by the appended claims.

Claims (27)

CONCLUSIONS A method for growing mushrooms, comprising the steps of: a) assembling a substrate package comprising an amount of mycelium-enriched substrate and a covering of vapor-permeable film bounding the substrate, the substrate package being substantially in the form of a column, such as a cylinder, having a central shaft, and an upright extending through the shaft; b) placing the substrate package with the upright in a cultivation space; and ¢) carrying out a process of continuing to grow the mycelium and growing mushrooms on the outer periphery of the substrate package and harvesting mushrooms during this process, wherein: - in step a) the substrate package is assembled on a holder formed by a support member having a support surface for the substrate package, and the upright, which is connected to and extends at an angle, for example perpendicular to the support surface; characterized in that the method further comprises the step of: - actively influencing the substrate conditions prevailing in the substrate package during step c). A method according to claim 1, comprising the step of, at least during step c), measuring and/or controlling the fluid flow through the central shaft. Method according to claim 1 or 2, wherein the method further comprises the step of: - measuring, at least during step c}), the temperature and/or the humidity of fluid flowing through or out of the central shaft. A method according to claim 3, wherein the method further comprises the step of: - controlling the fluid flow through the central shaft on the basis of the measured value of the temperature and/or the air humidity. A method according to any one of the preceding claims, wherein the method further comprises the step of: - during step c), limiting to a minimum the flows of a fluid, for instance air, through or out of the central shaft, preferably by closing the central shaft. Method according to one or more of the preceding claims, wherein in step a) the container is guided from below into a columnar mold and the mold is subsequently filled from above with substrate, which is preferably compacted with a mortar. A method according to any one of the preceding claims, wherein a hollow upright is used, and wherein the step or steps of measuring, controlling and/or limiting the fluid flow is at least measuring, controlling and/or limiting the fluid flow through the hollow upright. 8. Holder apparently intended for use in the method according to one of the preceding claims, wherein the holder is formed by a support member with a supporting surface for a substrate package, and an upright, which is connected to and extends at an angle, for instance at right angles. relative to the supporting surface, and wherein the upright comprises a hollow upright, characterized in that the holder is provided with fluid control means, adapted for actively influencing substrate conditions prevailing in the substrate package. 9. Holder according to claim 8, wherein the upright is made of heat-conducting material, preferably metal. 10. Holder according to claim 8 or 9, wherein the upright is provided with an air- and moisture-impermeable wall. 11. Holder as claimed in any of the claims 8-10, wherein the holder comprises at the top and preferably also at the bottom a fluid passage opening opening into the hollow upright. 12. Container as claimed in any of the claims 8-11, wherein at least one sensor is provided, and wherein the temperature and/or the fluid humidity of fluid flowing through or out of the hollow upright is measured by the at least one sensor. 13. Holder according to claim 12, wherein a control is provided which controls the fluid flow through the hollow upright, preferably on the basis of the value of temperature and/or air humidity fed back by the at least one sensor. A container according to any one of claims 8-13, wherein the hollow upright is closable and is or will be closed during the cultivation phase. A substrate package comprising an amount of mycelium-enriched substrate and a vapor permeable film envelope defining the substrate, the substrate package being substantially in the form of a column having a central shaft, and an upright extending through the shaft, the substrate is carried by a carrier member of a container formed by the carrier member having a bearing surface for the substrate package, and wherein the carrier is connected to and extends at an angle, for example perpendicular to the bearing surface. 16. Substrate package according to claim 15, wherein the upright is hollow and preferably has an air and moisture impermeable wall. 17. Substrate package according to claim 15 or 16, wherein the holder comprises at the top and preferably at the bottom a fluid passage opening opening into the cavity of the substrate package. A substrate package according to any one of claims 15-17, wherein the vapor-permeable foil is made of a perforated plastic. A substrate package according to any one of claims 15-18, wherein the container is closely enclosed by the substrate. A substrate package according to any one of claims 15-19, wherein the substrate package has a height ranging between 100 and 250 cm, preferably between 150 and 225 cm, an outer diameter ranging from 25 to 60 cm, preferably between 30 and 50 cm and the shaft has a diameter ranging from 3 to 20 cm, preferably from 5 to 15 cm. An assembly device for assembling a substrate package according to any one of claims 15-20 for a method according to any one of claims 1-6, the device comprising: - a frame, - a vertical columnar mold which is held to the frame, - a jack, - a container conveyor designed for transporting containers for substrate packages to below the mould, - a substrate package conveyor designed for discharging the container with the substrate package from below the mold after assembly of a substrate package, - wherein the container conveyor and the mold are arranged in such a way that there is sufficient space between the first conveyor and the mold for the containers to pass, - an elevator for raising and lowering a holder from the container conveyor in the mold, and - a substrate conveyor for feeding the substrate upwards into the mould. 22. Device as claimed in claim 21, comprising a weight or force measuring device which measures the momentary weight or force that is exerted on the support member during the assembly of the substrate package. A device as claimed in claim 21 or 22, comprising a distance measuring device which during. assembling the substrate pack directly or indirectly and continuously or discontinuously measures the instantaneous height of the substrate pack. 24. Device as claimed in one or more of the claims 21 to 23, comprising a tubular foil device with which, when used, a tubular foil is created which serves as an envelope of a substrate package which is assembled during the assembly of the substrate package. 25. Welding device for welding together parts of flat foil that are in contact with each other, and comprising: - a welding roller provided with a welding element over the running surface, wherein the welding element extends over at least substantially the entire circumference of the welding roller - a counter bearing surface located opposite the running surface of the welding roller, - control means for heating the welding element - a supply device which, in use, supplies an elongated flat film to the welding device, wherein two side edges of the film are in contact with each other, for example overlapping each other, between the running surface of the welding roller and the counter-race are fed, - a speed sensor suitable for measuring the feed rate of the film, and - drive means which drive the welding roller in dependence on the feed rate of the film, the welding device being designed so as to act on the basis of results of the speed sensor in the temperature of the welding element in order to weld together two flat foil parts which are in contact with each other and which pass between the tread and the counter tread 286. Welding device as claimed in claim 25, comprising cooling means controllable by the control device with which the welding element can be actively cooled. 27. Welding device according to claim 26, wherein the cooling means comprise fluid channels extending through the welding roller to the running surface, through which a cooling fluid can be guided to the running surface. - wherein a temperature sensor suitable for measuring the current temperature of the welding element on the running surface is provided on or near the welding device.