NL2010185A - Lithographic apparatus and device manufacturing method. - Google Patents
Lithographic apparatus and device manufacturing method. Download PDFInfo
- Publication number
- NL2010185A NL2010185A NL2010185A NL2010185A NL2010185A NL 2010185 A NL2010185 A NL 2010185A NL 2010185 A NL2010185 A NL 2010185A NL 2010185 A NL2010185 A NL 2010185A NL 2010185 A NL2010185 A NL 2010185A
- Authority
- NL
- Netherlands
- Prior art keywords
- metrology
- frame
- deformation
- clause
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 14
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 230000005855 radiation Effects 0.000 claims description 30
- 238000000059 patterning Methods 0.000 claims description 21
- 238000001459 lithography Methods 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 34
- 239000002826 coolant Substances 0.000 abstract description 3
- 239000012071 phase Substances 0.000 description 30
- 238000005259 measurement Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 20
- 230000006870 function Effects 0.000 description 14
- 229910002092 carbon dioxide Inorganic materials 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229960004424 carbon dioxide Drugs 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000006094 Zerodur Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261592243P | 2012-01-30 | 2012-01-30 | |
| US201261592243 | 2012-01-30 | ||
| US201261652924P | 2012-05-30 | 2012-05-30 | |
| US201261652924 | 2012-05-30 | ||
| US201261710288P | 2012-10-05 | 2012-10-05 | |
| US201261710288 | 2012-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2010185A true NL2010185A (en) | 2013-08-01 |
Family
ID=47666109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2010185A NL2010185A (en) | 2012-01-30 | 2013-01-25 | Lithographic apparatus and device manufacturing method. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9618859B2 (enExample) |
| JP (1) | JP6140191B2 (enExample) |
| NL (1) | NL2010185A (enExample) |
| WO (1) | WO2013113634A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013113633A1 (en) | 2012-01-30 | 2013-08-08 | Asml Netherlands B.V. | Lithographic apparatus with a metrology system for measuring a position of a substrate table |
| DE102014203144A1 (de) * | 2014-02-21 | 2015-08-27 | Carl Zeiss Smt Gmbh | Baugruppe eines optischen Systems, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| USRE49142E1 (en) * | 2014-08-06 | 2022-07-19 | Asml Netherlands B.V. | Lithographic apparatus and an object positioning system |
| CN109856921A (zh) * | 2017-11-30 | 2019-06-07 | 上海微电子装备(集团)股份有限公司 | 光刻装置及其主基板结构与主基板单元 |
| CN109900199B (zh) * | 2019-03-25 | 2021-03-30 | 西安电子科技大学 | 一种用于管道形变检测的弯曲传感器结构及方法 |
| CN110763357A (zh) * | 2019-11-08 | 2020-02-07 | 江苏科技大学 | 一种电容式温度传感器及使用方法 |
| DE102019219179A1 (de) * | 2019-12-09 | 2021-06-10 | Carl Zeiss Smt Gmbh | Optisches Element und Lithographiesystem |
| DE102021200604A1 (de) * | 2021-01-25 | 2022-07-28 | Carl Zeiss Smt Gmbh | Optisches system, lithographieanlage und verfahren |
| KR20230131202A (ko) * | 2021-01-28 | 2023-09-12 | 칼 짜이스 에스엠테 게엠베하 | 광학 시스템 및 광학 시스템을 동작시키는 방법 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3149472B2 (ja) | 1991-08-30 | 2001-03-26 | 株式会社ニコン | 走査露光装置および物体の移動測定装置 |
| JPH07270122A (ja) | 1994-03-30 | 1995-10-20 | Canon Inc | 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法 |
| EP1039510A4 (en) | 1997-11-14 | 2003-11-12 | Nikon Corp | EXPOSURE DEVICE, MANUFACTURING METHOD THEREOF, AND EXPOSURE METHOD |
| JPH11243052A (ja) | 1997-11-14 | 1999-09-07 | Nikon Corp | 露光装置 |
| DE10046379A1 (de) | 2000-09-20 | 2002-03-28 | Zeiss Carl | System zur gezielten Deformation von optischen Elementen |
| US20040244963A1 (en) * | 2003-06-05 | 2004-12-09 | Nikon Corporation | Heat pipe with temperature control |
| US20050057102A1 (en) * | 2003-09-11 | 2005-03-17 | Nikon Corporation | Holding member, coolant, cooling method and cooling device, linear motor device, stage device, and exposure apparatus |
| US7102729B2 (en) | 2004-02-03 | 2006-09-05 | Asml Netherlands B.V. | Lithographic apparatus, measurement system, and device manufacturing method |
| US20100163221A1 (en) * | 2005-11-30 | 2010-07-01 | Koninklijke Philips Electronics, N.V. | Local control of heat flow to more accurately regulate machine temperatures |
| US20080073563A1 (en) * | 2006-07-01 | 2008-03-27 | Nikon Corporation | Exposure apparatus that includes a phase change circulation system for movers |
| US8687166B2 (en) | 2007-05-24 | 2014-04-01 | Asml Netherlands B.V. | Lithographic apparatus having an encoder position sensor system |
| US7740362B1 (en) * | 2008-02-19 | 2010-06-22 | Jefferson Science Associates | Mirror with thermally controlled radius of curvature |
| NL2003223A (en) | 2008-09-30 | 2010-03-31 | Asml Netherlands Bv | Projection system, lithographic apparatus, method of postitioning an optical element and method of projecting a beam of radiation onto a substrate. |
| DE102009039400A1 (de) | 2009-08-31 | 2011-03-03 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element zur Verwendung in einem EUV-System |
| US8767174B2 (en) | 2010-02-18 | 2014-07-01 | Nikon Corporation | Temperature-controlled holding devices for planar articles |
| NL2006809A (en) * | 2010-06-23 | 2011-12-27 | Asml Netherlands Bv | Lithographic apparatus and lithographic apparatus cooling method. |
| NL2007155A (en) | 2010-08-25 | 2012-02-28 | Asml Netherlands Bv | Stage apparatus, lithographic apparatus and method of positioning an object table. |
| EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
| WO2013113633A1 (en) | 2012-01-30 | 2013-08-08 | Asml Netherlands B.V. | Lithographic apparatus with a metrology system for measuring a position of a substrate table |
-
2013
- 2013-01-25 WO PCT/EP2013/051480 patent/WO2013113634A2/en not_active Ceased
- 2013-01-25 US US14/375,457 patent/US9618859B2/en not_active Expired - Fee Related
- 2013-01-25 JP JP2014553736A patent/JP6140191B2/ja not_active Expired - Fee Related
- 2013-01-25 NL NL2010185A patent/NL2010185A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| US9618859B2 (en) | 2017-04-11 |
| WO2013113634A3 (en) | 2013-12-12 |
| JP2015511398A (ja) | 2015-04-16 |
| JP6140191B2 (ja) | 2017-05-31 |
| US20140340659A1 (en) | 2014-11-20 |
| WO2013113634A2 (en) | 2013-08-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WDAP | Patent application withdrawn |
Effective date: 20140129 |