NL193232B - Electronic assembly. - Google Patents

Electronic assembly.

Info

Publication number
NL193232B
NL193232B NL8601072A NL8601072A NL193232B NL 193232 B NL193232 B NL 193232B NL 8601072 A NL8601072 A NL 8601072A NL 8601072 A NL8601072 A NL 8601072A NL 193232 B NL193232 B NL 193232B
Authority
NL
Netherlands
Prior art keywords
electronic assembly
electronic
assembly
Prior art date
Application number
NL8601072A
Other languages
Dutch (nl)
Other versions
NL193232C (en
NL8601072A (en
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Publication of NL8601072A publication Critical patent/NL8601072A/en
Publication of NL193232B publication Critical patent/NL193232B/en
Application granted granted Critical
Publication of NL193232C publication Critical patent/NL193232C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL8601072A 1985-04-26 1986-04-25 Electronic assembly. NL193232C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2050385 1985-04-26
IT8520503A IT1215267B (en) 1985-04-26 1985-04-26 APPARATUS AND METHOD FOR THE PERFECTED THERMAL COUPLING OF A SEMICONDUCTOR CONTAINER TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF CONTAINER CONDUCTORS ON MORE THAN ONE SIDE OF THE CONTAINER ON A CIRCUIT BOARD.

Publications (3)

Publication Number Publication Date
NL8601072A NL8601072A (en) 1986-11-17
NL193232B true NL193232B (en) 1998-11-02
NL193232C NL193232C (en) 1999-03-03

Family

ID=11167919

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8601072A NL193232C (en) 1985-04-26 1986-04-25 Electronic assembly.

Country Status (4)

Country Link
DE (1) DE3614086C2 (en)
FR (1) FR2581250B1 (en)
IT (1) IT1215267B (en)
NL (1) NL193232C (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3633625A1 (en) * 1985-12-04 1987-06-11 Vdo Schindling CARRIER PLATE
DE4037488A1 (en) * 1990-11-24 1992-05-27 Bosch Gmbh Robert POWER COMPONENTS WITH ELECTRICALLY INSULATING THERMAL CONNECTION
DE4141650C2 (en) * 1991-12-17 1997-03-13 Vero Electronics Gmbh Heatsink with removable pressure clip
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
DE4331377A1 (en) * 1993-09-15 1995-03-16 Siemens Matsushita Components Electrical component
DE19952768A1 (en) * 1999-11-02 2001-05-31 Wincor Nixdorf Gmbh & Co Kg Device for thermally connecting an electronic component to a heat sink
DE102015219851B4 (en) * 2015-10-13 2018-05-17 Zf Friedrichshafen Ag control unit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
IT7821073V0 (en) * 1978-03-09 1978-03-09 Ates Componenti Elettron CLAMP FOR FIXING A SEMICONDUCTOR DEVICE TO A HEAT SINK.
DE2823699A1 (en) * 1978-05-31 1979-12-06 Bosch Gmbh Robert Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing
DE2919058A1 (en) * 1979-05-10 1980-11-20 Siemens Ag Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block
DE8024180U1 (en) * 1980-09-10 1980-12-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen module
DE3128856A1 (en) * 1981-07-22 1983-02-10 Oelsch KG, 1000 Berlin Device for mounting electronic components on a printed-circuit board
DE8130512U1 (en) * 1981-10-19 1982-06-16 GARDENA Präzisionstechnik GmbH, 7907 Niederstotzingen CLIP FOR FASTENING COOLERS TO TRANSISTORS AND DIODES
GB2129223A (en) * 1982-10-09 1984-05-10 Welwyn Electronics Ltd Printed circuit boards
DE3315583A1 (en) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE
JPS59208762A (en) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Device for contacting under pressure solid state unit with heat sink member
FR2567324B1 (en) * 1984-07-06 1986-11-28 Telemecanique Electrique MOUNTING DEVICE FOR A HYBRID COMPONENT WITH A THICK LAYER, ESPECIALLY FOR AN ELECTRONIC MODULE

Also Published As

Publication number Publication date
FR2581250A1 (en) 1986-10-31
IT8520503A0 (en) 1985-04-26
DE3614086C2 (en) 1998-06-04
DE3614086A1 (en) 1986-10-30
IT1215267B (en) 1990-01-31
NL193232C (en) 1999-03-03
NL8601072A (en) 1986-11-17
FR2581250B1 (en) 1991-06-21

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20051101