DE2823699A1 - Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing - Google Patents

Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing

Info

Publication number
DE2823699A1
DE2823699A1 DE19782823699 DE2823699A DE2823699A1 DE 2823699 A1 DE2823699 A1 DE 2823699A1 DE 19782823699 DE19782823699 DE 19782823699 DE 2823699 A DE2823699 A DE 2823699A DE 2823699 A1 DE2823699 A1 DE 2823699A1
Authority
DE
Germany
Prior art keywords
heat sink
leaf spring
leg
semiconductor components
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782823699
Other languages
German (de)
Inventor
Gert Jakob
Horst Konz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19782823699 priority Critical patent/DE2823699A1/en
Publication of DE2823699A1 publication Critical patent/DE2823699A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The heat sink has metallic terminal surfaces for heat convection generated by operation of thyristors etc. The thyristors are mounted on a circuit board in a plastics housing. The heat sink body (1) is formed by a U-shaped metal member, inserted over the side wall (11) of the housing. One shank (3) of the heat sink body is on the outside, while the other shank (2) abuts the metal terminal surfaces (13, 14) of the thyristors (8, 9). Preferably the second shank is pressed against the surfaces by a leaf spring (15). The leaf spring may be dished in the effective direction, and its end may have an opposite curvature a small radius to form pressure points.

Description

Stand der TechnikState of the art

Die Erfindung geht aus von einer Anordnung nach der Gattung des Hauptanspruchs. Es sind Anordnungen mit Kühlkörpern bekannt, die auf metallische Begrenzungswände eines Gehäuses aufgebracht sind und über diese die Wärme nach außen leiten.The invention is based on an arrangement according to the preamble of the main claim. There are known arrangements with heat sinks that on metallic boundary walls a housing are applied and conduct the heat to the outside via this.

Diese Anordnungen haben aber den Nachteil, daß sie nicht für Gehäuse aus Plastik verwendbar sind.However, these arrangements have the disadvantage that they are not suitable for housing made of plastic can be used.

Vorteile der Erfindung Die erfindungsgemäße Anordnung mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß die Wärme nach außen geleitet wird, ohne die Gehäusewand zu beeinflussen.Advantages of the invention The arrangement according to the invention with the characterizing Features of the main claim has the advantage that the heat to the outside is conducted without affecting the housing wall.

Zeichnung Es zeigen Fig. ia die Seitenansicht und Fig. Ib die Aufsicht auf den Kühlkörper, Fig. 2 die Aufsicht auf den Kühlkörper im eingebauten Zustand und Fig. 3 einen Schnitt nach der Linie A-A der Fig. 2.DRAWING FIG. 1 shows the side view and FIG. 1b the top view on the heat sink, Fig. 2 is a plan view of the heat sink in the installed state and FIG. 3 shows a section along the line A-A of FIG.

Beschreibung der Erfindung Der Kühlkörper 1 nach Fig. la und Fig. Ib ist aus einem rechteckförmigen Metallband zu einem im Querschnitt U-förmigen Teil gebogen. Aus dem einen Schenkel 2 und dem die Schenkel 2 und 3 verbindenden Steg 4 ist eine Zunge 5 ausgeschnitten, die aus der Ebene des Schenkels 2 herausgebogen ist und parallel zu der Ebene des Schenkels 2 hakenförmig nach oben ragt. Wie aus der Fig. 3 zu ersehen ist, ist der Schenkel 3 länger als der Schenkel 2. Aus dem Steg 4 ist jeweils am Ende ein Lappen 6 bzw. 7 ausgeschnitten und hochgebogen, so daß die beiden Lappen 6, 7 die Ebene des Schenkels 2 verlängern.Description of the invention The heat sink 1 according to Fig. 1a and Fig. Ib is made from a rectangular metal strip to form a U-shaped cross-section Part bent. From the one leg 2 and the leg 2 and 3 connecting Web 4 is a tongue 5 cut out, which is bent out of the plane of the leg 2 is and protrudes parallel to the plane of the leg 2 hook-shaped upwards. How out 3 can be seen, the leg 3 is longer than the leg 2. From the Web 4 is a tab 6 or 7 cut out and bent up at each end, see above that the two tabs 6, 7 extend the plane of the leg 2.

Die Thyristoren 8, 9 sind mit weiteren Bauelementen auf einer Leiterplatte 10 in einem Gehäuse aus Plastik in der Nähe der Seitenwand 11 des Gehäuses befestigt (Fig. 2).The thyristors 8, 9 are on a circuit board with other components 10 mounted in a plastic housing near the side wall 11 of the housing (Fig. 2).

Die metallischen Abschlußflächen 13, 14 sind gegen die Seitenwand 11 gerichtet. Der Kühlkörper 1 wird über die Seitenwand 11 des Gehäuses in der Art gesteckt, daß der Schenkel 2 an den metallischen Abschlußflächen 13, 14 der Thyristoren 8, 9 anliegt und der Schenkel 3 nach außen geführt ist. Um einen guten Wärmeschluß der metallischen Abschlußflächen 13, 14 der Thyristoren 8, 9 mit dem Schenkel 2 des Kühlkörpers 1 zu gewährleisten, wird eine Blattfeder 15 verwendet. Die Blattfeder 15 ist in ihre Federrichtung gebogen Die Enden der Blattfeder 15 sind mit einem kleineren Biegeradius entgegengesetzt zu der Hauptbiegerichtung gebogen, so daß sich zwei Andruckpunkte ausbilden. Die Blattfeder 15 wird unter Spannung derart auf den Kühlkörper 1 und die Thyristoren 8, 9 gesteckt, daß die Andruckpunkte an den Enden der Blattfeder gegen die metallischen Abschlußflächen 13, 14 drücken und der durch die Biegung der Blattfeder hervorgerufene Bauch als weiterer Andruckpunkt gegen die Zunge 5 des Kühlkörpers 1 drückt. Damit die Blattfeder seitlich nicht verrutscht, ist in der Mitte der Blattfeder in der Ebene des Blattes ein winkelförmiges Ansatzstück angeformt, das in die Lücke zwischen den zwei Thyristoren 8, 9 greift. Der Steg 4, der die Schenkel 2 und 3 verbindet, ist so breit, daß zwischen der Seitenwand 11 des Gehäuses und dem außenliegenden Schenkel 3 ein Zwischenraum ist, in den die Bodenplatte 12 des Gehäuses hineingreift.The metallic end surfaces 13, 14 are against the side wall 11 directed. The heat sink 1 is over the side wall 11 of the housing in the manner inserted that the leg 2 on the metallic end surfaces 13, 14 of the thyristors 8, 9 is applied and the leg 3 is guided to the outside. A good heat seal the metallic end surfaces 13, 14 of the thyristors 8, 9 with the leg 2 To ensure the heat sink 1, a leaf spring 15 is used. The leaf spring 15 is bent in its spring direction. The ends of the leaf spring 15 are with a smaller bending radius bent opposite to the main bending direction, so that form two pressure points. The leaf spring 15 is so under tension on the heat sink 1 and the thyristors 8, 9 plugged that the pressure points on press the ends of the leaf spring against the metallic end surfaces 13, 14 and the belly caused by the bending of the leaf spring as a further pressure point presses against the tongue 5 of the heat sink 1. So that the leaf spring is not on the side slipped, there is an angular one in the middle of the leaf spring in the plane of the leaf Formed extension piece that engages in the gap between the two thyristors 8, 9. The web 4, which connects the legs 2 and 3, is so wide that between the side wall 11 of the housing and the outer leg 3 is a space into which the Base plate 12 of the housing engages.

Claims (5)

Ansprüche Qi Anordnung mit einem Kühlkörper für zwei Halbleiterbauelemente insbesondere Thyristoren, mit zur Wärmeableitung vorgesehenen metallischen Abschlußflächen, die auf einer Leiterplatte in einem Gehäuse aus Plastik untergebracht sind, dadurch gekennzeichnet, daß der Kühlkörper (1) aus einem im Querschnitt U-förmigen Teil aus Metall gebildet ist, das über die Seitenwand (11) des Gehäuses gesteckt ist, so daß der erste Schenkel (3) des Kühlkörpers (1) nach außen geführt ist und der zweite Schenkel (2) an den metallischen Abschlußflächen (13, 14) der Halbleiterbauelemente (8, 9) anliegt.Claims Qi arrangement with a heat sink for two semiconductor components in particular thyristors, with metallic end surfaces intended for heat dissipation, which are housed on a printed circuit board in a housing made of plastic, thereby characterized in that the heat sink (1) consists of a part which is U-shaped in cross section is made of metal that is pushed over the side wall (11) of the housing, so that the first leg (3) of the heat sink (1) is led to the outside and the second legs (2) on the metallic end surfaces (13, 14) of the semiconductor components (8, 9) is applied. 2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß der zweite Schenkel (2) mit einer Blattfeder (15) gegen die metallischen Abschlußflächen (13, 14) der Hableiterbauelemente (8, 9) gedrückt wird.2. Arrangement according to claim 1, characterized in that the second Leg (2) with a leaf spring (15) against the metallic end surfaces (13, 14) the semiconductor components (8, 9) is pressed. 3. Anordnung nach Anspruch 2,.dadurch gekennzeichnet, daß die Blattfeder (15) in Federrichtung gebogen ist und die Enden der Blattfeder (15) mit einer entgegengesetzten Krümmung mit kleinerem Radius versehen sind, so daß Andruckpunkte gebildet werden.3. Arrangement according to claim 2, characterized in that the leaf spring (15) is bent in the spring direction and the ends of the leaf spring (15) with an opposite one Curvature are provided with a smaller radius, so that pressure points are formed. 4. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß aus dem zweiten Schenkel (2) und dem die beiden Schenkel (3, 2) verbindenden Steg (4) eine Zunge (5) ausgeschnitten ist, die aus der Ebene des zweiten Schenkels (2) herausgebogen ist und hakenförmig parallel zur Ebene des zweiten Schenkels (2) angeordnet ist.4. Arrangement according to claim 1, characterized in that from the second leg (2) and the web (4) connecting the two legs (3, 2) Tongue (5) is cut out, which is bent out of the plane of the second leg (2) and is arranged like a hook parallel to the plane of the second leg (2). 5. Anordnung nach Anspruch 1 bis 4, dadurch gekennzeichnet, daß die Blattfeder (15) unter-Spannung mit den Andruckpunkten an den Enden der Blattfeder (15) gegen die metallischen Abschlußflächen (13, 14) der Halbleiterbauelemente (8, 9) drückt und daß die Mitte der Blattfeder (15) als Gegendruckpunkt gegen die Zunge (5) des Kühlkörpers (1) gepreßt wird.5. Arrangement according to claim 1 to 4, characterized in that the Leaf spring (15) under tension with the pressure points at the ends of the leaf spring (15) against the metallic end faces (13, 14) of the semiconductor components (8, 9) and that the center of the leaf spring (15) acts as a counter-pressure point against the tongue (5) of the heat sink (1) is pressed.
DE19782823699 1978-05-31 1978-05-31 Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing Withdrawn DE2823699A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782823699 DE2823699A1 (en) 1978-05-31 1978-05-31 Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782823699 DE2823699A1 (en) 1978-05-31 1978-05-31 Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing

Publications (1)

Publication Number Publication Date
DE2823699A1 true DE2823699A1 (en) 1979-12-06

Family

ID=6040595

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782823699 Withdrawn DE2823699A1 (en) 1978-05-31 1978-05-31 Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing

Country Status (1)

Country Link
DE (1) DE2823699A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331207A1 (en) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Assembly for electronic controllers
EP0154719A2 (en) * 1984-03-13 1985-09-18 Robert Bosch Gmbh Switching device
DE3416348A1 (en) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Compact assembly in which a printed-circuit board is connected to a heat sink
DE3524002A1 (en) * 1984-07-06 1986-02-06 La Télémécanique Electrique, Nanterre, Hauts-de-Seine ASSEMBLY DEVICE FOR THICK FILM COMPONENTS, ESPECIALLY FOR ELECTRONIC MODULES
DE3614086A1 (en) * 1985-04-26 1986-10-30 Sgs Microelettronica S.P.A., Catania DEVICE AND METHOD FOR THERMALLY COUPLING A SEMICONDUCTOR BUILDING UNIT TO A COOLING PLATE AND FOR ELECTRICALLY COUPLING TO A CIRCUIT BOARD
WO1987001007A1 (en) * 1985-07-30 1987-02-12 Robert Bosch Gmbh Electric switchgear
DE8703782U1 (en) * 1987-03-13 1987-07-23 Loewe Opta Gmbh, 8640 Kronach, De
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331207A1 (en) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Assembly for electronic controllers
EP0154719A2 (en) * 1984-03-13 1985-09-18 Robert Bosch Gmbh Switching device
EP0154719A3 (en) * 1984-03-13 1986-09-17 Robert Bosch Gmbh Switching device
DE3416348A1 (en) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Compact assembly in which a printed-circuit board is connected to a heat sink
DE3524002A1 (en) * 1984-07-06 1986-02-06 La Télémécanique Electrique, Nanterre, Hauts-de-Seine ASSEMBLY DEVICE FOR THICK FILM COMPONENTS, ESPECIALLY FOR ELECTRONIC MODULES
DE3614086A1 (en) * 1985-04-26 1986-10-30 Sgs Microelettronica S.P.A., Catania DEVICE AND METHOD FOR THERMALLY COUPLING A SEMICONDUCTOR BUILDING UNIT TO A COOLING PLATE AND FOR ELECTRICALLY COUPLING TO A CIRCUIT BOARD
DE3614086C2 (en) * 1985-04-26 1998-06-04 Sgs Microelettronica Spa Device for heat dissipation from a unit containing electronic components and method for thermally coupling a unit containing electronic components
WO1987001007A1 (en) * 1985-07-30 1987-02-12 Robert Bosch Gmbh Electric switchgear
DE8703782U1 (en) * 1987-03-13 1987-07-23 Loewe Opta Gmbh, 8640 Kronach, De
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink

Similar Documents

Publication Publication Date Title
EP0627104B1 (en) Contacting device for a chip card
DE19531628C2 (en) Heatsink
DE2823699A1 (en) Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing
DE3447135A1 (en) Screwless connecting and joining terminal for electrical leads
DE3903615C2 (en)
CH652269A5 (en) Quick mounting base made of plastic, for fixing an electrical device or printed-circuit board
DE102016107898B4 (en) Lateral PCB connection
DE8516915U1 (en) Heat sink for cooling a semiconductor component
DE20113884U1 (en) Electrical connector for a printed circuit board
EP0179231B1 (en) Electrical connecting element to be pressed into a carrier head
DE2400509A1 (en) Connector forked spring with solder tags - has flat S-shaped stampings with opposed entries to reduce block size
DE4218224A1 (en) Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
DE2739901A1 (en) LIQUID LEVEL MEASURING DEVICE
DE2845135A1 (en) Fixture for flat building components - comprises one-piece sheet metal stamping fitting into next one in flat for minimum waste
DE102005036966A1 (en) Electrical component arrangement
DE10259561B4 (en) Electrical terminal connection and terminal for such a connection
DE697225C (en)
WO2023193852A1 (en) Electronics assembly having a housing and a printed circuit board with at least one electronics component and a heat dissipation means for the electronics component
DE20205379U1 (en) mounting plate
DE3030161A1 (en) LIGHT HOUSING WITH AT LEAST ONE HOOK-SHAPED SPRING FOR DETACHABLE INSERT
DE7519949U (en) Heat sinks for transistors
DE1465687C (en) Plug-in device with contact springs arranged on a support element, in particular for receiving plug-in printed circuit carriers
DE1590347B1 (en) Device switch
DE1465687B2 (en) PLUG-IN DEVICE WITH CONTACT SPRINGS ARRANGED ON A SUPPORTING ELEMENT, ESPECIALLY FOR ACCEPTING PLUG-IN PRINTED CIRCUIT CARRIER
DE1575128A1 (en) Mounting bracket

Legal Events

Date Code Title Description
8130 Withdrawal