DE8703782U1 - - Google Patents

Info

Publication number
DE8703782U1
DE8703782U1 DE8703782U DE8703782U DE8703782U1 DE 8703782 U1 DE8703782 U1 DE 8703782U1 DE 8703782 U DE8703782 U DE 8703782U DE 8703782 U DE8703782 U DE 8703782U DE 8703782 U1 DE8703782 U1 DE 8703782U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8703782U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Loewe Opta GmbH
Original Assignee
Loewe Opta GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loewe Opta GmbH filed Critical Loewe Opta GmbH
Priority to DE8703782U priority Critical patent/DE8703782U1/de
Publication of DE8703782U1 publication Critical patent/DE8703782U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8703782U 1987-03-13 1987-03-13 Expired DE8703782U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8703782U DE8703782U1 (en) 1987-03-13 1987-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8703782U DE8703782U1 (en) 1987-03-13 1987-03-13

Publications (1)

Publication Number Publication Date
DE8703782U1 true DE8703782U1 (en) 1987-07-23

Family

ID=6805807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8703782U Expired DE8703782U1 (en) 1987-03-13 1987-03-13

Country Status (1)

Country Link
DE (1) DE8703782U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4338393A1 (en) * 1993-11-10 1995-05-11 Philips Patentverwaltung Arrangement for dissipating heat from (cooling) an electronic component soldered onto a printed circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7531074U (en) * 1975-10-01 1976-02-12 F.W. Assmann & Soehne 5880 Luedenscheid Attachment of a heat sink and an integrated power amplifier on a printed circuit board of electrical devices
DE2823699A1 (en) * 1978-05-31 1979-12-06 Bosch Gmbh Robert Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing
DE8202208U1 (en) * 1982-01-29 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Element for fastening a cuboid electrical component to a carrier
GB2141580A (en) * 1983-06-16 1984-12-19 Imc Magnetics Corp Heat dissipator for semiconductor devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7531074U (en) * 1975-10-01 1976-02-12 F.W. Assmann & Soehne 5880 Luedenscheid Attachment of a heat sink and an integrated power amplifier on a printed circuit board of electrical devices
DE2823699A1 (en) * 1978-05-31 1979-12-06 Bosch Gmbh Robert Heat sink system for two semiconductor components - has U=shaped metal heat sink inserted over side wall of plastics housing
DE8202208U1 (en) * 1982-01-29 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Element for fastening a cuboid electrical component to a carrier
GB2141580A (en) * 1983-06-16 1984-12-19 Imc Magnetics Corp Heat dissipator for semiconductor devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DE-Firmenschrift: Katalog der Fa. Seem, Elektronische Bauteile, April 1971, S.4 *
US-Z: IBM Technical Disclosure Bulletin, 1981, Bd.23, No.12, S.53-03 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4338393A1 (en) * 1993-11-10 1995-05-11 Philips Patentverwaltung Arrangement for dissipating heat from (cooling) an electronic component soldered onto a printed circuit board

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