NL188669C - Werkwijze voor het doteren van halfgeleidermaterialen. - Google Patents

Werkwijze voor het doteren van halfgeleidermaterialen.

Info

Publication number
NL188669C
NL188669C NLAANVRAGE7802828,A NL7802828A NL188669C NL 188669 C NL188669 C NL 188669C NL 7802828 A NL7802828 A NL 7802828A NL 188669 C NL188669 C NL 188669C
Authority
NL
Netherlands
Prior art keywords
semiconductor materials
doping semiconductor
doping
materials
semiconductor
Prior art date
Application number
NLAANVRAGE7802828,A
Other languages
English (en)
Dutch (nl)
Other versions
NL7802828A (nl
Inventor
Jean-Claude Muller
Jean-Pierre Ponpon
Joseph Kurek
Paul Siffert
Original Assignee
Anvar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anvar filed Critical Anvar
Publication of NL7802828A publication Critical patent/NL7802828A/xx
Application granted granted Critical
Publication of NL188669C publication Critical patent/NL188669C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/20Doping by irradiation with electromagnetic waves or by particle radiation
    • C30B31/22Doping by irradiation with electromagnetic waves or by particle radiation by ion-implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/961Ion beam source and generation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Photovoltaic Devices (AREA)
NLAANVRAGE7802828,A 1977-03-18 1978-03-15 Werkwijze voor het doteren van halfgeleidermaterialen. NL188669C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7708138A FR2383702A1 (fr) 1977-03-18 1977-03-18 Perfectionnements aux procedes et dispositifs de dopage de materiaux semi-conducteurs

Publications (2)

Publication Number Publication Date
NL7802828A NL7802828A (nl) 1978-09-20
NL188669C true NL188669C (nl) 1992-08-17

Family

ID=9188280

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7802828,A NL188669C (nl) 1977-03-18 1978-03-15 Werkwijze voor het doteren van halfgeleidermaterialen.

Country Status (6)

Country Link
US (1) US4187124A (es)
JP (1) JPS53130975A (es)
CH (1) CH622383A5 (es)
DE (1) DE2811414A1 (es)
FR (1) FR2383702A1 (es)
NL (1) NL188669C (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2475069A1 (fr) * 1980-02-01 1981-08-07 Commissariat Energie Atomique Procede de dopage rapide de semi-conducteurs
US4385946A (en) * 1981-06-19 1983-05-31 Bell Telephone Laboratories, Incorporated Rapid alteration of ion implant dopant species to create regions of opposite conductivity
JPS58164134A (ja) * 1982-03-24 1983-09-29 Hitachi Ltd 半導体装置の製造方法
US4462332A (en) * 1982-04-29 1984-07-31 Energy Conversion Devices, Inc. Magnetic gas gate
JPS59119830A (ja) * 1982-12-27 1984-07-11 Fujitsu Ltd 半導体装置の製造方法
EP0221897A1 (en) * 1985-05-17 1987-05-20 J.C. Schumacher Company Ion implant using alkali or alkaline earth metal tetrafluoroborate as boron ion source
DE3521053A1 (de) * 1985-06-12 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum aufbringen duenner schichten auf ein substrat
US4721683A (en) * 1987-05-21 1988-01-26 American Cyanamid Company Use of alkylphosphines and alkylarsines in ion implantation
JP2650930B2 (ja) * 1987-11-24 1997-09-10 株式会社日立製作所 超格子構作の素子製作方法
US4987102A (en) * 1989-12-04 1991-01-22 Motorola, Inc. Process for forming high purity thin films
GB9515090D0 (en) * 1995-07-21 1995-09-20 Applied Materials Inc An ion beam apparatus
JP2006278213A (ja) * 2005-03-30 2006-10-12 Seiko Epson Corp 電子デバイス用基板、電子デバイス、電子デバイスの製造方法および電子機器
US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7820460B2 (en) * 2007-09-07 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Patterned assembly for manufacturing a solar cell and a method thereof
KR101915753B1 (ko) * 2010-10-21 2018-11-07 삼성디스플레이 주식회사 이온 주입 시스템 및 이를 이용한 이온 주입 방법
US9437392B2 (en) 2011-11-02 2016-09-06 Varian Semiconductor Equipment Associates, Inc. High-throughput ion implanter

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2787564A (en) * 1954-10-28 1957-04-02 Bell Telephone Labor Inc Forming semiconductive devices by ionic bombardment
US3507709A (en) * 1967-09-15 1970-04-21 Hughes Aircraft Co Method of irradiating dielectriccoated semiconductor bodies with low energy electrons
US3520741A (en) * 1967-12-18 1970-07-14 Hughes Aircraft Co Method of simultaneous epitaxial growth and ion implantation
US3583361A (en) * 1969-12-18 1971-06-08 Atomic Energy Commission Ion beam deposition system
JPS4914102A (es) * 1972-05-16 1974-02-07
US4021675A (en) * 1973-02-20 1977-05-03 Hughes Aircraft Company System for controlling ion implantation dosage in electronic materials
US3908183A (en) * 1973-03-14 1975-09-23 California Linear Circuits Inc Combined ion implantation and kinetic transport deposition process
US3901183A (en) * 1973-06-12 1975-08-26 Extrion Corp Wafer treatment apparatus
JPS5148097A (en) * 1974-10-23 1976-04-24 Osaka Koon Denki Kk Iongen
US4082636A (en) * 1975-01-13 1978-04-04 Sharp Kabushiki Kaisha Ion plating method
JPS5181100A (es) * 1975-01-13 1976-07-15 Inoue Japax Res
FR2298880A1 (fr) * 1975-01-22 1976-08-20 Commissariat Energie Atomique Procede et dispositif d'implantation ionique
US4013891A (en) * 1975-12-15 1977-03-22 Ibm Corporation Method for varying the diameter of a beam of charged particles
US4074139A (en) * 1976-12-27 1978-02-14 Rca Corporation Apparatus and method for maskless ion implantation

Also Published As

Publication number Publication date
JPS53130975A (en) 1978-11-15
CH622383A5 (es) 1981-03-31
FR2383702B1 (es) 1982-04-02
DE2811414A1 (de) 1978-09-21
NL7802828A (nl) 1978-09-20
FR2383702A1 (fr) 1978-10-13
DE2811414C2 (es) 1990-01-18
US4187124A (en) 1980-02-05

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Legal Events

Date Code Title Description
BV The patent application has lapsed
A85 Still pending on 85-01-01
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed