NL186785C - Microgolf-diode voorzien van warmte-opnemers. - Google Patents
Microgolf-diode voorzien van warmte-opnemers.Info
- Publication number
- NL186785C NL186785C NLAANVRAGE7809334,A NL7809334A NL186785C NL 186785 C NL186785 C NL 186785C NL 7809334 A NL7809334 A NL 7809334A NL 186785 C NL186785 C NL 186785C
- Authority
- NL
- Netherlands
- Prior art keywords
- recorders
- heat
- microwave diode
- microwave
- diode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/864—Transit-time diodes, e.g. IMPATT, TRAPATT diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/833,322 US4160992A (en) | 1977-09-14 | 1977-09-14 | Plural semiconductor devices mounted between plural heat sinks |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7809334A NL7809334A (nl) | 1979-03-16 |
| NL186785B NL186785B (nl) | 1990-09-17 |
| NL186785C true NL186785C (nl) | 1991-02-18 |
Family
ID=25264091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7809334,A NL186785C (nl) | 1977-09-14 | 1978-09-13 | Microgolf-diode voorzien van warmte-opnemers. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4160992A (de) |
| JP (1) | JPS5453973A (de) |
| CA (1) | CA1095178A (de) |
| CH (1) | CH633655A5 (de) |
| DE (1) | DE2839043C2 (de) |
| GB (1) | GB2004415B (de) |
| NL (1) | NL186785C (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
| CS214034B1 (en) * | 1980-06-10 | 1982-04-09 | Michal Pellant | Semiconductor modulus |
| US4536469A (en) * | 1981-11-23 | 1985-08-20 | Raytheon Company | Semiconductor structures and manufacturing methods |
| US4474623A (en) * | 1982-04-26 | 1984-10-02 | Raytheon Company | Method of passivating a semiconductor body |
| DE3243307A1 (de) * | 1982-11-23 | 1984-05-24 | Raytheon Co., 02173 Lexington, Mass. | Halbleiter-bauelemente und verfahren zu ihrer herstellung |
| DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
| US4604591A (en) * | 1983-09-29 | 1986-08-05 | Hazeltine Corporation | Automatically adjustable delay circuit having adjustable diode mesa microstrip delay line |
| US4711859A (en) * | 1984-05-24 | 1987-12-08 | Raytheon Company | Method for forming an insulator having a conductive surface |
| US4604529A (en) * | 1984-09-28 | 1986-08-05 | Cincinnati Microwave, Inc. | Radar warning receiver with power plug |
| US5530658A (en) * | 1994-12-07 | 1996-06-25 | International Business Machines Corporation | System and method for packing heat producing devices in an array to prevent local overheating |
| FR2793953B1 (fr) * | 1999-05-21 | 2002-08-09 | Thomson Csf | Capacite thermique pour composant electronique fonctionnant en impulsions longues |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB941375A (en) * | 1959-05-11 | 1963-11-13 | Microwaves Associates Inc | A semi-conductor device |
| US3249891A (en) * | 1959-08-05 | 1966-05-03 | Ibm | Oscillator apparatus utilizing esaki diode |
| US3231794A (en) * | 1961-06-05 | 1966-01-25 | Int Rectifier Corp | Thermal coupling of parallel connected semiconductor elements |
| US3320497A (en) * | 1964-09-11 | 1967-05-16 | Control Data Corp | Variable capacitance diode packages |
| FR1473250A (fr) * | 1966-01-31 | 1967-03-17 | Comp Generale Electricite | Dispositif redresseur de puissance pour très haute tension |
| US3551842A (en) * | 1968-03-27 | 1970-12-29 | Rca Corp | Semiconductor laser having high power output and reduced threshold |
| US3740617A (en) * | 1968-11-20 | 1973-06-19 | Matsushita Electronics Corp | Semiconductor structure and method of manufacturing same |
| NL6902447A (de) * | 1969-02-14 | 1970-08-18 | ||
| FR2032139A5 (de) * | 1969-02-19 | 1970-11-20 | Comp Generale Electricite | |
| US3649881A (en) * | 1970-08-31 | 1972-03-14 | Rca Corp | High-power semiconductor device assembly |
| US3686541A (en) * | 1971-07-19 | 1972-08-22 | Gen Electric | A flexible resilient member for applying a clamping force to thyristor units |
| US3728236A (en) * | 1971-08-05 | 1973-04-17 | Rca Corp | Method of making semiconductor devices mounted on a heat sink |
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
| US3783348A (en) * | 1972-10-30 | 1974-01-01 | Rca Corp | Encapsulated semiconductor device assembly |
| DE2324780C3 (de) * | 1973-05-16 | 1978-07-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen eines Halbleiterbauelements |
| US3896473A (en) * | 1973-12-04 | 1975-07-22 | Bell Telephone Labor Inc | Gallium arsenide schottky barrier avalance diode array |
| US3932226A (en) * | 1974-12-06 | 1976-01-13 | Rca Corporation | Method of electrically interconnecting semiconductor elements |
| US3956820A (en) * | 1975-02-26 | 1976-05-18 | Rca Corporation | Method of manufacturing a semiconductor device having a lead bonded to a surface thereof |
| JPS5850428B2 (ja) * | 1975-04-16 | 1983-11-10 | 株式会社東芝 | メサ型半導体装置 |
| DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
| DE2611059A1 (de) * | 1976-03-16 | 1977-09-29 | Siemens Ag | Gehaeuseloses halbleiterbauelement mit doppelwaermesenke |
| US4030943A (en) * | 1976-05-21 | 1977-06-21 | Hughes Aircraft Company | Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits |
-
1977
- 1977-09-14 US US05/833,322 patent/US4160992A/en not_active Expired - Lifetime
-
1978
- 1978-08-23 CA CA309,907A patent/CA1095178A/en not_active Expired
- 1978-09-07 DE DE2839043A patent/DE2839043C2/de not_active Expired
- 1978-09-12 GB GB7836558A patent/GB2004415B/en not_active Expired
- 1978-09-13 JP JP11288878A patent/JPS5453973A/ja active Pending
- 1978-09-13 NL NLAANVRAGE7809334,A patent/NL186785C/xx not_active IP Right Cessation
- 1978-09-14 CH CH961678A patent/CH633655A5/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| NL7809334A (nl) | 1979-03-16 |
| US4160992A (en) | 1979-07-10 |
| CH633655A5 (de) | 1982-12-15 |
| GB2004415B (en) | 1982-01-20 |
| JPS5453973A (en) | 1979-04-27 |
| DE2839043A1 (de) | 1979-03-22 |
| GB2004415A (en) | 1979-03-28 |
| DE2839043C2 (de) | 1986-10-30 |
| CA1095178A (en) | 1981-02-03 |
| NL186785B (nl) | 1990-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| A85 | Still pending on 85-01-01 | ||
| BC | A request for examination has been filed | ||
| V1 | Lapsed because of non-payment of the annual fee |