NL173220C - Werkwijze voor de vervaardiging van optische koppelinrichtingen, alsmede optische koppelinrichting verkregen met deze werkwijze. - Google Patents
Werkwijze voor de vervaardiging van optische koppelinrichtingen, alsmede optische koppelinrichting verkregen met deze werkwijze.Info
- Publication number
- NL173220C NL173220C NLAANVRAGE7105062,A NL7105062A NL173220C NL 173220 C NL173220 C NL 173220C NL 7105062 A NL7105062 A NL 7105062A NL 173220 C NL173220 C NL 173220C
- Authority
- NL
- Netherlands
- Prior art keywords
- optical coupling
- device obtained
- coupling device
- manufacturing
- coupling devices
- Prior art date
Links
- 230000008878 coupling Effects 0.000 title 2
- 238000010168 coupling process Methods 0.000 title 2
- 238000005859 coupling reaction Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- 230000003287 optical effect Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2858570A | 1970-04-15 | 1970-04-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7105062A NL7105062A (nl) | 1971-10-19 |
| NL173220B NL173220B (nl) | 1983-07-18 |
| NL173220C true NL173220C (nl) | 1983-12-16 |
Family
ID=21844261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7105062,A NL173220C (nl) | 1970-04-15 | 1971-04-15 | Werkwijze voor de vervaardiging van optische koppelinrichtingen, alsmede optische koppelinrichting verkregen met deze werkwijze. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3660669A (nl) |
| JP (1) | JPS5329992B1 (nl) |
| CA (1) | CA920714A (nl) |
| DE (2) | DE2118391C3 (nl) |
| NL (1) | NL173220C (nl) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2155137A5 (nl) * | 1971-10-08 | 1973-05-18 | Radiotechnique Compelec | |
| GB1423779A (en) * | 1972-02-14 | 1976-02-04 | Hewlett Packard Co | Photon isolators |
| US3839782A (en) * | 1972-03-15 | 1974-10-08 | M Lincoln | Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation |
| FR2178434A5 (nl) * | 1972-03-31 | 1973-11-09 | Radiotechnique Compelec | |
| DE2253699C3 (de) * | 1972-11-02 | 1978-11-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiter-Optokoppler und Verfahren zu seiner Herstellung |
| FR2272377B1 (nl) * | 1974-05-24 | 1977-06-24 | Texas Instruments France | |
| US3960011A (en) * | 1974-11-18 | 1976-06-01 | Harris Corporation | First fault indicator for engines |
| US4047045A (en) * | 1975-03-03 | 1977-09-06 | Paxton Jr Grady W | Optical coupler |
| GB1487010A (en) * | 1975-04-01 | 1977-09-28 | Standard Telephones Cables Ltd | Laser stud mounts |
| US4084312A (en) * | 1976-01-07 | 1978-04-18 | Motorola, Inc. | Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies |
| DE2627944C2 (de) * | 1976-06-22 | 1985-05-15 | Siemens AG, 1000 Berlin und 8000 München | Optoelektronisches Koppelelement |
| GB1579715A (en) * | 1977-03-12 | 1980-11-26 | Omron Tateisi Electronics Co | Contacless switch and method of making the same |
| US4156148A (en) * | 1977-08-18 | 1979-05-22 | Gentron Corporation | Photocoupling structure for a solid state power control device |
| JPS5582475A (en) * | 1978-12-19 | 1980-06-21 | Toshiba Corp | Photo-coupling semiconductor device |
| EP0053483B1 (en) * | 1980-11-28 | 1985-10-02 | Kabushiki Kaisha Toshiba | Method for manufacturing a module for a fiber optic link |
| US4446375A (en) * | 1981-10-14 | 1984-05-01 | General Electric Company | Optocoupler having folded lead frame construction |
| US4863806A (en) * | 1985-06-25 | 1989-09-05 | Hewlett-Packard Company | Optical isolator |
| US4694183A (en) * | 1985-06-25 | 1987-09-15 | Hewlett-Packard Company | Optical isolator fabricated upon a lead frame |
| US5148243A (en) * | 1985-06-25 | 1992-09-15 | Hewlett-Packard Company | Optical isolator with encapsulation |
| US5049527A (en) * | 1985-06-25 | 1991-09-17 | Hewlett-Packard Company | Optical isolator |
| US4633582A (en) * | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
| DE3633251A1 (de) * | 1986-09-30 | 1988-03-31 | Siemens Ag | Optoelektronisches koppelelement |
| JPH0691296B2 (ja) * | 1987-03-31 | 1994-11-14 | 三菱電機株式会社 | 半導体レ−ザの組立方法 |
| US4979017A (en) * | 1989-02-23 | 1990-12-18 | Adam Mii | Semiconductor element string structure |
| US5245198A (en) * | 1990-10-12 | 1993-09-14 | Sharp Kabushiki Kaisha | Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
| CN207279552U (zh) * | 2017-04-13 | 2018-04-27 | 东莞湧德电子科技有限公司 | 新型led支架结构 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3167658A (en) * | 1961-07-17 | 1965-01-26 | Air Shields | Apparatus for use in sensing the pulse |
| NL299675A (nl) * | 1962-10-24 | 1900-01-01 |
-
1970
- 1970-04-15 US US28585A patent/US3660669A/en not_active Expired - Lifetime
-
1971
- 1971-02-11 CA CA105108A patent/CA920714A/en not_active Expired
- 1971-04-05 JP JP2038771A patent/JPS5329992B1/ja active Pending
- 1971-04-15 DE DE2118391A patent/DE2118391C3/de not_active Expired
- 1971-04-15 NL NLAANVRAGE7105062,A patent/NL173220C/nl not_active IP Right Cessation
- 1971-04-15 DE DE19717114433U patent/DE7114433U/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE7114433U (de) | 1971-08-26 |
| US3660669A (en) | 1972-05-02 |
| NL173220B (nl) | 1983-07-18 |
| DE2118391A1 (de) | 1971-12-23 |
| CA920714A (en) | 1973-02-06 |
| DE2118391B2 (de) | 1979-01-11 |
| JPS5329992B1 (nl) | 1978-08-24 |
| DE2118391C3 (de) | 1979-09-06 |
| NL7105062A (nl) | 1971-10-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| V1 | Lapsed because of non-payment of the annual fee |