NL170871B - PROCEDURE FOR THE REMOVAL OF HEAVY AND / OR TOXIC METALS FROM WASTE GAS. - Google Patents

PROCEDURE FOR THE REMOVAL OF HEAVY AND / OR TOXIC METALS FROM WASTE GAS.

Info

Publication number
NL170871B
NL170871B NLAANVRAGE7413473,A NL170871DA NL170871B NL 170871 B NL170871 B NL 170871B NL 170871D A NL170871D A NL 170871DA NL 170871 B NL170871 B NL 170871B
Authority
NL
Netherlands
Prior art keywords
heavy
removal
procedure
waste gas
toxic metals
Prior art date
Application number
NLAANVRAGE7413473,A
Other languages
Dutch (nl)
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL170871B publication Critical patent/NL170871B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NLAANVRAGE7413473,A 1952-07-05 PROCEDURE FOR THE REMOVAL OF HEAVY AND / OR TOXIC METALS FROM WASTE GAS. NL170871B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2742412X 1952-07-05

Publications (1)

Publication Number Publication Date
NL170871B true NL170871B (en)

Family

ID=19875526

Family Applications (4)

Application Number Title Priority Date Filing Date
NLAANVRAGE7106028,A NL170870B (en) 1952-07-05 PROCESS FOR FIRE-PROOF CLADING OF OVEN WALLS AND AN THIS MANUFACTURED METALLURGIC SHAFT OVEN.
NL84048D NL84048C (en) 1952-07-05
NLAANVRAGE7413473,A NL170871B (en) 1952-07-05 PROCEDURE FOR THE REMOVAL OF HEAVY AND / OR TOXIC METALS FROM WASTE GAS.
NL81606D NL81606C (en) 1952-07-05

Family Applications Before (2)

Application Number Title Priority Date Filing Date
NLAANVRAGE7106028,A NL170870B (en) 1952-07-05 PROCESS FOR FIRE-PROOF CLADING OF OVEN WALLS AND AN THIS MANUFACTURED METALLURGIC SHAFT OVEN.
NL84048D NL84048C (en) 1952-07-05

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL81606D NL81606C (en) 1952-07-05

Country Status (4)

Country Link
US (2) US2742412A (en)
BE (1) BE518440A (en)
DE (2) DE962129C (en)
NL (4) NL81606C (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE962489C (en) * 1954-02-10 1957-04-25 Dehydag Gmbh Saver pickling agent to protect metals when treated with acidic agents
DE1007592B (en) * 1955-01-19 1957-05-02 Dehydag Gmbh Bath for the production of galvanic metal coatings
US2853443A (en) * 1956-04-25 1958-09-23 Westinghouse Electric Corp Addition agent for acid copper electrolytes
BE565994A (en) * 1957-04-16
US2931760A (en) * 1957-09-25 1960-04-05 Leon R Westbrook Acid copper plating
NL238490A (en) * 1958-04-26
US3770599A (en) * 1971-05-24 1973-11-06 Oxy Metal Finishing Corp Acid zinc plating baths
US4009087A (en) * 1974-11-21 1977-02-22 M&T Chemicals Inc. Electrodeposition of copper
US4474649A (en) * 1982-06-21 1984-10-02 Asarco Incorporated Method of thiourea addition of electrolytic solutions useful for copper refining
JPH02232391A (en) * 1988-12-21 1990-09-14 Internatl Business Mach Corp <Ibm> Additive plating bath and method thereof
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6551484B2 (en) 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
CN100469948C (en) * 2000-10-03 2009-03-18 应用材料有限公司 Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6478937B2 (en) 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20050092602A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a membrane stack
US20050092601A1 (en) * 2003-10-29 2005-05-05 Harald Herchen Electrochemical plating cell having a diffusion member
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
US20100140098A1 (en) * 2008-05-15 2010-06-10 Solopower, Inc. Selenium containing electrodeposition solution and methods
EP3074552A1 (en) * 2013-11-25 2016-10-05 Enthone, Inc. Electrodeposition of copper

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA461186A (en) * 1949-11-22 John Franklin Beaver, Jr. Bright copper plating
CA477508A (en) * 1951-10-02 Brown Henry Electrodeposition of nickel from acid baths
DE104111C (en) *
US2196588A (en) * 1937-05-26 1940-04-09 Du Pont Electroplating
US2315802A (en) * 1940-04-20 1943-04-06 Harshaw Chem Corp Nickel plating
US2389179A (en) * 1941-02-21 1945-11-20 Udylite Corp Electrodeposition of metals
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
US2355505A (en) * 1941-10-03 1944-08-08 Purdue Research Foundation Electrodeposition of bright zinc
US2462870A (en) * 1942-07-09 1949-03-01 Gen Motors Corp Electrodeposition of copper
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
BE504701A (en) * 1950-07-17
US2700020A (en) * 1952-06-02 1955-01-18 Houdaille Hershey Corp Plating copper

Also Published As

Publication number Publication date
DE962129C (en) 1957-04-18
NL170870B (en)
NL81606C (en)
BE518440A (en)
US2742412A (en) 1956-04-17
US2742413A (en) 1956-04-17
DE940860C (en) 1956-03-29
NL84048C (en)

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