NL142823B - Halfgeleiderelement. - Google Patents

Halfgeleiderelement.

Info

Publication number
NL142823B
NL142823B NL291606A NL291606A NL142823B NL 142823 B NL142823 B NL 142823B NL 291606 A NL291606 A NL 291606A NL 291606 A NL291606 A NL 291606A NL 142823 B NL142823 B NL 142823B
Authority
NL
Netherlands
Prior art keywords
semiconductor element
semiconductor
Prior art date
Application number
NL291606A
Other languages
English (en)
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL142823B publication Critical patent/NL142823B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
NL291606A 1962-04-18 1963-04-17 Halfgeleiderelement. NL142823B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0079056 DE1273073B (de) 1962-04-18 1962-04-18 Halbleiterbauelement mit Druckkontakten

Publications (1)

Publication Number Publication Date
NL142823B true NL142823B (nl) 1974-07-15

Family

ID=7507915

Family Applications (2)

Application Number Title Priority Date Filing Date
NL291606D NL291606A (de) 1962-04-18
NL291606A NL142823B (nl) 1962-04-18 1963-04-17 Halfgeleiderelement.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL291606D NL291606A (de) 1962-04-18

Country Status (4)

Country Link
CH (1) CH420388A (de)
DE (1) DE1273073B (de)
GB (1) GB1024633A (de)
NL (2) NL142823B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030428B1 (de) * 1969-03-31 1975-10-01
US4953003A (en) * 1987-05-21 1990-08-28 Siemens Aktiengesellschaft Power semiconductor device
EP3240125B1 (de) * 2014-12-26 2020-04-08 Panasonic Intellectual Property Management Co., Ltd. Halbleiterbauelement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2784121A (en) * 1952-11-20 1957-03-05 Bell Telephone Labor Inc Method of fabricating semiconductor bodies for translating devices
DE1095615B (de) * 1958-04-23 1960-12-22 Licentia Gmbh Verfahren zum galvanischen Vergolden von Molybdaenblech
NL243218A (de) * 1958-12-24

Also Published As

Publication number Publication date
DE1273073B (de) 1968-07-18
GB1024633A (en) 1966-03-30
NL291606A (de)
CH420388A (de) 1966-09-15

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